High-Density PCB Assemblies For Space Applications

2.5.2025

This paper High-Density PCB Assemblies For Space Applications: From Evaluation To Qualification was presented by Maarten Cauwe, imec and Ghent University,...

IPC Class 2 vs Class 3 Solder Joints Requirements Explained

27.2.2025

231

In this post, inspired by the Samtec blog, we’ll briefly examine IPC-A-610 Class 2 and Class 3 J-lead and Gull...

HIROSE Expands Open Pluggable OPS PCB connector

9.1.2025

42

HIROSE expands its FX18 series PCB connector with support for new Open Pluggable Specifications (OPS). *OPS is an industry standard...

How to Determine Chip Temperature

3.1.2025

168

This article written by Dr.-Ing. Martin Schulz, Global Principal, Application Engineering, Littelfuse, provides insight into how to determine packaging chip...

Die and Wire PCB Bonding Explained

17.12.2024

138

This webinar from Würth Elektronik explains principles of die and wire bonding on printed circuit boards including the complete manufacturing...

EMI Shielding Challenges

17.12.2024

10

Explore modern EMI shielding techniques and learn how to prevent electromagnetic interferences (EMI) from impacting sensitive electronics in this Würth...

EMC with Electromechanical Inter-Connections

17.12.2024

8

This Würth Elektronik webinar focuses on the basics of electromagnetic compatibility (EMC) related to the use and applications of electromechanical...

Designing and Testing HDI PCBs for Harsh Environments

17.12.2024

10

In this Würth Elektronik webinar we will offer you insights into HDI PCBs for Harsh Environments: the failure mechanisms of...

RF PCB Connector Impedance Matching and Dynamics

17.12.2024

36

This Würth Elektronik presentation is about sharing impedance variations and comparative analyses of transmission line structures and connector configurations. In...