Murata Manufacturing Co., Ltd announces the World’s First LCP (liquid crystal polymer) flexible substrate with an Inner Cavity structure, ULTICIRC, and has already begun mass production.
Murata’s proprietary design incorporates an Inner Cavity within the substrate to achieve a dielectric constant (Dk) below 2.0, dramatically reducing transmission loss.
With 6G expected to leverage the FR3 (Frequency Range 3) band—roughly 7–24 GHz—substrates with minimal transmission loss are essential to enable high-speed, high-capacity communications at high frequencies. At the same time, demand is growing for thin, space-saving flexible substrates that support free-form mechanical design to meet the ongoing miniaturization of smartphones and communication equipment.
Murata has provided LCP flexible substrates with excellent high-frequency characteristics, featuring a proprietary high-performance resin that eliminates spring-back and an adhesive-free, one-shot press multilayer lamination process; building on this expertise for 6G readiness, Murata has developed and launched ULTICIRC.
Conventional flexible substrates faced the challenge that making them thinner resulted in increased transmission loss, but this product incorporates an Inner Cavity structure within the substrate, achieving a dielectric constant (Dk) below 2.0, which is significantly lower than Murata’s conventional products, enabling both thin profiles and ultra-low transmission loss simultaneously.
Furthermore, thanks to an adhesive-free proprietary manufacturing method and the excellent barrier properties of LCP, the Inner Cavity structure maintains high moisture resistance.
Details on our LCP flexible substrates are available on the product website; the web page for ULTICIRC will be updated at a later date.
