source: TDK news TDK Corporation presents the world’s first multilayer chip beads and inductors with the innovative soft-termination technology that...
Read moreDetailssource: Electronics Weekly article US-based power semiconductor firm Helix Semiconductors has moved its power converter technology to a 0.18micron process...
Read moreDetailssource: Science Daily news As transistor dimensions within integrated circuits continue to shrink, smooth metallic lines are required to interconnect...
Read moreDetailssource: ECN news Wed, 02/15/2017 - 1:13pm by American Chemical Society Wearable electronics are here -- the most prominent versions...
Read moreDetailssource: EPCI news Feb 12th 2017 Lanskroun, Czech Republic. European Passive Components Institute EPCI is pleased to announce Call for...
Read moreDetailssource: Electronics Weekly news Nano Dimension, the Israel 3D printing specialist, has successfully 3D printed electrical circuits, in which it embedded...
Read moreDetailssource: Energy Harvesting Journal article Nearly a century after it was theorized, Harvard scientists report they have succeeded in creating...
Read moreDetailsLast interview of the month with Dr. Schnitter on technological metals moved us to the sphere of passive component...
Read moreDetailssource: Electropages article Rutronik’s Christian Kasper and Jochen Neller highlight the latest developments in passive components for power systems applications....
Read moreDetailssource: Science Daily news Copper based nano structures have gained much attention in today's modern devices. A team of Nano-fabricated...
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