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    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

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    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

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    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

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    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

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Coilcraft Achieves the Industry’s Highest Q factors in 0603 Size Chip Inductors

19.4.2021
Reading Time: 1 min read
A A

Coilcraft’s 0603DC Series achieves the industry’s highest Q factors in 0603 size for super low loss in high-frequency circuits.

They also feature wirewound construction for extremely high self resonance – up to 11.4 GHz – and achieve DCR as low as 29 mΩ, significantly lower than other inductors this size.

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  • Exceptionally high Q – up to 177 at 2.4 GHz!
  • Self-resonant frequencies as high as 11.4 GHz
  • 45 inductance values ranging from 2.7 to 470 nH
  • AEC-Q200 Grade 1 (−40°C to +125°C)

Features

  • Core material: Ceramic
  • Environmental: RoHS compliant without exemption, halogen free
  • Terminations: RoHS compliant matte tin over nickel over silver-glass frit.
  • Weight: 3 – 4 mg
  • Ambient temperature: –40°C to +125°C with Irms current
  • Maximum part temperature: +140°C (ambient + temp rise)
  • Storage temperature Component: –40°C to +140°C
  • Tape and reel packaging: –40°C to +80°C
  • Resistance to soldering heat: Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles
  • Temperature Coefficient of Inductance (TCL): +25 to +125 ppm/°C
  • Moisture Sensitivity Level: (MSL) 1 (unlimited floor life at <30°C / 85% relative humidity)
  • Failures in Time (FIT) / Mean Time Between Failures (MTBF): 0.22 per billion hours / 4.545E+09 hours, calculated per Telcordia SR-332
  • Packaging: 2000 per 7” reel; Paper tape: 8 mm wide, 0.95 mm thick, 4 mm pocket spacing
  • PCB washing: Tested to MIL-STD-202 Method 215 plus an additional aqueous wash.

Related

Source: Coilcraft

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