Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    TDK Introduces High Current 80VDC Board-Mount EMI Filters

    Bourns Releases High Heat Tolerant TO-227 Thick Film Resistor

    TDK Increases Current Ratings of Automotive Thin-Film Power Inductors

    Sumida Announces New DC Common Mode Choke Coil Series

    KYOCERA AVX Releases New 3dB Hybrid Couplers

    SCHURTER Unveils High Voltage Fuses for EV Applications

    YAGEO Releases First to Market 750V Aluminum Capacitors

    binder Introduces M9 Compact Circular Connector

    Smolteks CNF-MIM Capacitors Meet Thermal and Voltage Stability Industry Requirements

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Accelerating Full Bridge LLC Resonant Converter Design with Frenetic AI

    Understanding Switched Capacitor Converters

    Coupled Inductors Circuit Model and Examples of its Applications

    Inductor Resonances and its Impact to EMI

    Highly Reliable Flex Rigid PCBs, Würth Elektronik Webinar

    Causes of Oscillations in Flyback Converters

    How to design a 60W Flyback Transformer

    Modeling and Simulation of Leakage Inductance

    Power Inductor Considerations for AI High Power Computing – Vishay Video

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    TDK Introduces High Current 80VDC Board-Mount EMI Filters

    Bourns Releases High Heat Tolerant TO-227 Thick Film Resistor

    TDK Increases Current Ratings of Automotive Thin-Film Power Inductors

    Sumida Announces New DC Common Mode Choke Coil Series

    KYOCERA AVX Releases New 3dB Hybrid Couplers

    SCHURTER Unveils High Voltage Fuses for EV Applications

    YAGEO Releases First to Market 750V Aluminum Capacitors

    binder Introduces M9 Compact Circular Connector

    Smolteks CNF-MIM Capacitors Meet Thermal and Voltage Stability Industry Requirements

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Accelerating Full Bridge LLC Resonant Converter Design with Frenetic AI

    Understanding Switched Capacitor Converters

    Coupled Inductors Circuit Model and Examples of its Applications

    Inductor Resonances and its Impact to EMI

    Highly Reliable Flex Rigid PCBs, Würth Elektronik Webinar

    Causes of Oscillations in Flyback Converters

    How to design a 60W Flyback Transformer

    Modeling and Simulation of Leakage Inductance

    Power Inductor Considerations for AI High Power Computing – Vishay Video

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

EMC with Electromechanical Inter-Connections

1.7.2025
Reading Time: 5 mins read
A A

This Würth Elektronik webinar focuses on the basics of electromagnetic compatibility (EMC) related to the use and applications of electromechanical inter-connection components.

What is electromagnetic compatibility, what does it have to do with a flower and a bee, and how can I apply the knowledge conveyed to use it in my application?

RelatedPosts

Würth Elektronik Extends High Saturation Flat-Wire Power Inductors Line

Advancements and Applications of Switch Capacitor Power Converters

Würth Elektronik Releases Long Life SMT nano and microSD Card Connectors

What impact does the layout have on my electromagnetic compatibility, and what electromechanical inter-connection components can I use to improve this compatibility?

Electromagnetic Compatibility (EMC) with Electromechanical Connectors

This presentation delves into the critical subject of Electromagnetic Compatibility (EMC) within the context of Electromechanical Connectors. It explores fundamental principles, coupling effects, layout concepts, signal integrity, and shielding methods necessary for achieving optimal EMC performance in electronic applications.

1. Introduction

Electromagnetic Compatibility (EMC) compliance is not just a design consideration but a legal mandate across various regions. Its importance is underscored by stringent regulatory standards governing radiated emissions, immunity, Electrostatic Discharge (ESD), and conducted emissions. This document aims to provide an in-depth technical overview of EMC principles, focusing on practical implementation in electronic systems.

2. Fundamentals of EMC

2.1 Definition and Importance

EMC ensures that electronic systems operate without interference from or causing interference to other systems within their environment. Key EMC parameters include:

  • Radiated Immunity and Emission
  • Conducted Immunity and Emission
  • Electrostatic Discharge (ESD) Compliance

2.2 Regulatory Framework

EMC guidelines vary globally but maintain comparable thresholds. For instance, Austria’s EMC directives align closely with those in Spain, ensuring uniform compliance across EU nations.

3. Coupling Mechanisms

EMC issues arise from several coupling effects:

  • Capacitive Coupling: Dominant where electric fields prevail, leading to parasitic capacitance between conductors.
  • Inductive Coupling: Arises from magnetic fields inducing currents in adjacent conductors.
  • Galvanic Coupling: Occurs when two circuits share a common return path, causing interference.
  • Electromagnetic Wave Coupling: Involves near-field dominance of either electric or magnetic components.

4. Layout Concepts and Signal Integrity

4.1 Layer Design Optimization

Effective EMC design starts with PCB layout consideration:

  • Continuous Ground Planes: Minimize impedance and maintain signal integrity.
  • Minimizing Loop Areas: Reduces antenna effect, thus lowering EMI susceptibility.
  • Via Placement Strategies: Avoid unnecessary layer transitions to prevent impedance mismatches.

4.2 Transmission Line Theory

Signals prefer paths of least impedance, not necessarily the shortest physical route. Design considerations include:

  • Characteristic impedance matching
  • Return path continuity
  • Avoiding split ground planes

4.3 Filtering Techniques

Filters (e.g., common mode chokes, capacitors) are crucial for suppressing noise but should be complemented with robust layout practices for maximum effectiveness.

5. Shielding Design Principles

5.1 Purpose of Shielding

Shielding mitigates radiated emissions and improves immunity. Effective shielding requires:

  • Correct material selection (e.g., tin-plated, nickel-plated)
  • 360° contact around connectors
  • Avoiding galvanic corrosion between dissimilar metals

5.2 Grounding Strategies

Shield grounding can be applied:

  • Single-Ended Grounding: Preferred for high-impedance circuits.
  • Double-Ended Grounding: Effective for mitigating common-mode currents.
  • Capacitive Grounding: Combines benefits of both, reducing DC ground loops while maintaining high-frequency noise suppression.

6. Practical Considerations and Case Studies

6.1 Real-World EMC Failures

Examples highlight the effects of poor grounding, improper shielding, and suboptimal layout designs. Corrective actions include:

  • Adding ground vias
  • Improving connector grounding
  • Re-routing critical signal traces

6.2 EMC Testing and Validation

Testing environments (e.g., EMC chambers) simulate real-world conditions to validate compliance. Key measurements include:

  • Conducted and radiated emissions
  • Susceptibility to external electromagnetic fields

7. Conclusions and Recommendations

Successful EMC compliance integrates thoughtful design, robust layout practices, effective filtering, and strategic shielding. Continuous learning and adaptation to emerging standards are essential for sustained performance.

Related

Source: Würth Elektronik

Recent Posts

Glass Core Technology Breakthrough Potential for High-Speed Interconnects

12.6.2025
23

What Track Width To Use When Routing PCB

6.6.2025
38

Highly Reliable Flex Rigid PCBs, Würth Elektronik Webinar

15.5.2025
43

High-Density PCB Assemblies For Space Applications

2.5.2025
30

IPC Class 2 vs Class 3 Solder Joints Requirements Explained

27.2.2025
286

HIROSE Expands Open Pluggable OPS PCB connector

9.1.2025
45

How to Determine Chip Temperature

3.1.2025
185

Die and Wire PCB Bonding Explained

1.7.2025
140

EMI Shielding Challenges

1.7.2025
11

Designing and Testing HDI PCBs for Harsh Environments

1.7.2025
11

Upcoming Events

Jul 23
13:00 - 14:00 CEST

PCB design for a Smartwatch

Jul 29
16:00 - 17:00 CEST

Impact of Elevated Voltage and Temperature on Molded Power Inductors in DC/DC converters

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • How to Design an Inductor

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Why Low ESR Matters in Capacitor Design

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Premium Suppliers

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version