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    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

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    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

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    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

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    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

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ESD Protection Explained for Robust Electronic Systems Design

1.11.2021
Reading Time: 1 min read
A A

System Efficient ESD Design (SEED) address the protection of I/O against ESD using simulation. This allows to predict the robustness against damaging ESD and allows to reduce the likelihood of disturbances caused by ESD (soft-failure). Reduced design margin due to smaller, less current carrying metallization and contacts and thinner gate oxide has reduced the design window for ESD protection to a few V and currents of less than 2 A for high speed I/O such as USB 4.x.

This, and the need to use low capacitance devices inhibits a design by data sheet. In simulation based design models for the TVS, which include the transient turn-on and models for the IO of the IC are combined with all passive interconnect to create a model that predicts currents and voltage at the IC for different rise time and amplitude ESD pulses.

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