Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    SCHURTER TCS6F IP67 sealed SMD tactile switch with white silicone actuator on dark background

    SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

    YAGEO SMD 0603 ST Pt1000 chip sensor shown in front of rooftop HVAC equipment

    YAGEO SMD 0603 ST Pt1000 Sensor with Standard SMD Termination

    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    SCHURTER TCS6F IP67 sealed SMD tactile switch with white silicone actuator on dark background

    SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

    YAGEO SMD 0603 ST Pt1000 chip sensor shown in front of rooftop HVAC equipment

    YAGEO SMD 0603 ST Pt1000 Sensor with Standard SMD Termination

    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

European Electronic Components Distribution Under Strong Demand and Allocation in Q1 2022

9.11.2022
Reading Time: 3 mins read
A A

Strong demand and allocation continue to drive European semiconductor and passive components distribution (DMASS) in first quarter of 2022.

DMASS reports Q1 growth of 43.5% in semiconductors and 35.7% in interconnect, passive and electromechanical components. Shortages continue, but order situation becomes lighter. War impact limited but poses a risk for near-term future.

RelatedPosts

European Component Distribution Jumps 42.7% in Q3 2026

ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

ECIA Industry Pulse Moderates as Passive Lead Times Tighten

On the back of a strong 2021, a huge order book and ongoing shortages in key components, European components distribution again reported significant growth in its first calendar year quarter. According to DMASS Ltd., semiconductor sales, as reported by members, grew by 43.5% to a new record 3.13 Billion Euro. IP&E (Interconnect, Passive and Electromechanical) components grew by an equally impressive 35.7% to 1.62 Billion Euro. In total, the market grew by 40.8% to 4.75 Billion Euro.

Hermann Reiter, chairman of DMASS: “First of all, let us welcome a group of new members from the manufacturing and distribution side of the business, who bring our membership to nearly 40 leading companies, representing well over 80% of total European components distribution. In the course of 33 years of existence, DMASS Ltd. has grown continuously in representation and recognition for its great market coverage.”

In terms of last quarter’s results, Reiter stated: “A combined growth of 40% across all components is outstanding, but at the same time a clear sign of unprecedented times. The challenges of a post-CoVID recovery are now accompanied by the uncertainties of the Russian war against Ukraine and its ramifications for the entire planet. The human catastrophe of this war dwarfs every other concern, may it be unclear market expectations or supply chain disruptions. We hope that a just peace will be achieved soon.”

Electronic Components Market Germany; source FBDi

Semiconductors:

From a regional view, DMASS reported a similar picture on semiconductor growth as in the last quarter, a huge spread and an astounding strength of the major countries. Germany, for example, grew by 45.4% to 867 Million Euro, Italy by 45.6% to 310 Million Euro, the UK by 47.8% to 213 Million Euro, France by a staggering 54.8% to 210 Million Euro, Eastern Europe instead “only” by 34.5% to 540 Million Euro and the Nordic countries by 46% to 240 Million Euro.

At product and product group level, the situation was a bit more diverse. While Memories and Other Logic (ASSPs etc.) grew significantly over-proportionally and MOS Micro slightly faster than average, most other product groups grew below average, although still in the 20s and 30s. Analog, for example, grew by 42% to 886 Million Euro, MOS Micro by 44.8% to 621 Million Euro, Power by 36.5% to 375 Million Euro, Memories by 71.8% to 328 Million Euro, Opto by 26.1% to 260 Million Euro, Other Logic by 64.7% to 172 Million Euro, overtaking Programmable Logic (33.5% to 165 Million Euro). Finally Discretes went up 41.9% to 188 Million Euro and Sensors (incl. Actuators) by 34.9% to 88 Million Euro.

Interconnect, Passive and Electromechanical Components:

Interconnect, Passive and Electromechanical (IP&E) components again showed parallels to semis, but total sales “only” grew in the 30s. Last quarter’s 1.62 Billion Euro of total sales split as follows: Germany grew by 39.5% to 418 Million Euro, Italy by 40.5% to 191 Million Euro, the UK by 31.4% to 147 Million, France by 31.9% to 143 Million Euro and Eastern Europe by 30.5% to 207 Million Euro. On the product side, Passives grew by 36.4% to 670 Million Euro, Electromechanical products (including connectors) by 34.6% to 852 Million Euro and Power Supplies by 40.4% to 93 Million Euro.

Chairman Hermann Reiter: “We can certainly be very satisfied with the financial results in the first quarter, although some of the growth is exchange rate as well as price-driven. However, we are definitely not happy with the continuing difficult supply situation, where we cannot serve customers in the way we want. While we all hope that the situation gets better towards the end of the summer, the current uncertainties make any prediction impossible. The terrible war continues, economic growth expectations have been cut across the board, supply chains are disrupted by lockdowns in Asia, inflation is rising, energy supply is becoming unaffordable and customer confidence is sinking.  We can only hope that this is all 2022 has in store for us. In the long run, we are convinced that technology will still make a huge difference to the world and distribution will be the way to go.”

Related

Source: DMASS, FBDi

Recent Posts

Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

800 VDC AI Data Centers Reshape Capacitor Demand for 2027

6.11.2026
11
Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

Connector Raw Material Costs Rise 20.9% in Q2 2026

5.11.2026
12

AI and Passive Components: Structural Growth Beyond Data Centers

5.11.2026
34
DMASS Europe Q3 2026 electronic component distribution market overview

European Component Distribution Jumps 42.7% in Q3 2026

4.11.2026
15
Assorted electronic connectors for USB, audio, video and power interfaces

Top 10 Connector Manufacturers 2025: Amphenol Takes the Lead

4.11.2026
44

IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

28.10.2026
75
DigiKey product distribution center in Thief River Falls, Minnesota

DigiKey Invests $100 Million to Expand Distribution Capacity

20.10.2026
41
Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

15.10.2026
82
Supercapacitor LSM production

LS Materials Wins $51.5M AI Data Center Supercapacitor Order

13.10.2026
118

Upcoming Events

Nov 24
16:00 - 17:00 CET

Select the Correct Components for Your DC/DC Converter

Dec 1
16:00 - 17:00 CET

Developing low-noise mixed-signal systems

Dec 8
16:00 - 17:00 CET

WE-CCMF: Design Principles, Layout Guidelines and Measurement Results for High-Speed EMI Filtering

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved