Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Miniaturization of Tantalum Capacitors: Structural Limit Under Constant Rating

    Heatsink Design and Thermal Interface Materials for Reliable Electronics

    Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%

    Wk 17 Electronics Supply Chain Digest

    Exxelia Introduces SMD High‑Voltage Mica Capacitors

    Modelithics Releases COMPLETE v26.1 for Keysight ADS

    April 2026 Interconnect, Passives and Electromechanical Components Market Insights

    SPICE Simulation of Non-Linear Resistors: Vishay’s Thermistor and PPTC Modelling Ecosystem

    KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Miniaturization of Tantalum Capacitors: Structural Limit Under Constant Rating

    Heatsink Design and Thermal Interface Materials for Reliable Electronics

    Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%

    Wk 17 Electronics Supply Chain Digest

    Exxelia Introduces SMD High‑Voltage Mica Capacitors

    Modelithics Releases COMPLETE v26.1 for Keysight ADS

    April 2026 Interconnect, Passives and Electromechanical Components Market Insights

    SPICE Simulation of Non-Linear Resistors: Vishay’s Thermistor and PPTC Modelling Ecosystem

    KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

November 2025 Interconnect, Passives and Electromechanical Components Market Insights

4.12.2025
Reading Time: 5 mins read
A A

Edgewater researchers report that November AI outlooks is broadly strengthening, Industrial/Auto/Other little changed in late 2025.

This November 2025 collection of news summaries, survey results, and channel market insights, covers Interconnect, Passives, and Electromechanical Components from Edgewater Research. 

RelatedPosts

Wk 17 Electronics Supply Chain Digest

April 2026 Interconnect, Passives and Electromechanical Components Market Insights

Wk 16 Electronics Supply Chain Digest

What’s Changed/What’s New?

Aggregate reads have improved, and the 4Q tracking is ahead on the upside potential of AI, military, and aerospace. The seasonal 1Q outlook, excluding AI, is firming on the uptick in October orders.

The demand reads for AI are improving month-over-month, driven by feedback from most customers and programs that have made upward revisions for 2026 and beyond.

Google’s 2026 TPU rack forecasts have been revised higher by over 20% to 60K units, compared to the previous forecast of 48K units. We estimate that the TPU connector TAM will grow by over 60% year-over-year in 2026, driven by a significant increase in rack units and a rise in content tied to the adoption of higher ASP ACCs in the second half of 2026.

The odds of the VR144 backplane reverting to a bi-directional design are increasing due to recent improvements in SerDes technology. While contingencies remain, there is a potential to avoid the double-density design.

The top three channel comments are:

  1. NVIDIA has recently made progress on the SerDes required for bi-directional connectivity, which would enable it to avoid doubling the cable-backplane density in VR144. The remaining challenges include the readiness of the bi-directional connector and long-reach signal integrity. However, we believe the odds have shifted to approximately 55% in favor of the bi-directional design over the double-density backplanes.
  2. We anticipate that CPO, NPO, and CPC will all coexist in the near future, as end customers have different requirements. CPO is likely to enable scale across, while the other technologies are likely to be used inside the rack, at least until CPC reaches its limit. We have observed several CPC designs with flyovers recently, which should extend the lifecycle of copper.
  3. NVIDIA has shared its latest optics outlook, projecting a significant increase in the demand for InP (Indium Phosphide) wafer TAM from 2026 to 2030, reflecting the expected acceleration in optical content across scale-up, scale-out, and scale-across.

Key Takeaways

The demand across markets is stable to improving. The 4Q shipments are expected to track ahead through mid-November, driven by the strength in the AI and Mil/Aero markets. The Ind and Auto trends remain stable to modestly improving, with unevenness by geo/sub-markets.

October orders are expected to step up M/M globally. There are pockets of upside surprise tied to typical seasonality ahead of YE shutdowns in the West and some replenishment demand for early 2026. B2Bs remain noted as above 1x and closer to 1.1x, driven by AI and Mil/Aero, resulting in continued backlog improvement and firming up in expectations for at least seasonal 1Q globally.

By geo, EMEA demand reads appear better M/M with improving order trends following somewhat disappointing September. This is driven by Mil/Aero and Energy, while Ind and Auto recovery trends remain muted. Americas demand trends remain modestly improving, driven by Mil/Aero strength and pockets of channel replenishment, particularly by high service distribution ahead of anticipated January price increases from interconnect suppliers. Asia demand trends remain relatively better, driven by AI and EVs.

2026 forecasts excluding AI are little changed. They project a mid-single digit increase in shipments, consistent with expectations for a continued measured recovery.

Other Takeaways:

  • CPC designs are gaining momentum across various programs and customers, validating their market relevance.
  • CPC, CPO, and NPO are expected to coexist in the near term. CPC and NPO are favored for scale-up, while CPO is preferred for scale-out and across. Copper is projected to continue its role in these designs.
  • To surpass the 448G limit (2028+), AMD might potentially cede its share to optics LT. However, the durability of copper shouldn’t be underestimated.
  • AEC TAM predicts robust growth for 2026, with units potentially doubling year-over-year, approaching high single-digit to 10 million across PCIe and Ethernet.
  • The market is structurally large enough to support multiple suppliers, and there are no signs of aggressive pricing actions to date.
  • Initial optics feedback is also bullish, supported by Nvidia’s projection of a 20-fold increase in market demand by 2030. The supply is noted as tight, particularly in the NT segment.
  • The momentum for the 1.6Tb design is strong, with feedback indicating a broader shift in the DSP share towards AVGO at Asian module suppliers.
  • There are signs of potential inventory build across Nvidia and AWS supply chains, but feedback remains universal that the dynamic has not resulted in any material changes to orders or robust 2026 expectations.
  • The auto reads are stable month-over-month. Asia leads, while the West still lags behind. The Americas mix is expected to shift towards ICE, and Europe’s recovery is not expected until the second half of 2026.
  • The industrial reads are mixed, with stable to modest increases projected into 2026. Military and aerospace reads are still constructive, driven by the strengthening outlook for the EMEA region, which is causing some incremental supply tightness for military and aerospace SKUs. Amphenol and TE are expected to push larger than typical low to mid-single-digit January price increases in distribution to offset the inflation in metal costs.

Conclusion

the IP&E fundamentals remain positive and broadly unchanged month-over-month. AI continues to drive sector strength, and there is a more muted but healthy recovery across non-AI end markets. As 2025 winds down, the 2026 outlook appears similar: strong IP&E fundamentals supported by continued robust double-digit AI growth and a mid-single-digit recovery across other markets. We continue to track AI inventory levels and non-AI end-demand signals for indications of additional upside or emerging risk in 2026.

Full report available from: Dennis Reed, Sr. Research Analyst, Edgewater Research

Related

Source: Edgewater Research

Recent Posts

Miniaturization of Tantalum Capacitors: Structural Limit Under Constant Rating

27.4.2026
2

Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%

27.4.2026
3

Exxelia Introduces SMD High‑Voltage Mica Capacitors

27.4.2026
4

Modelithics Releases COMPLETE v26.1 for Keysight ADS

23.4.2026
11

April 2026 Interconnect, Passives and Electromechanical Components Market Insights

22.4.2026
47

KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

21.4.2026
40

When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

20.4.2026
40

Why Power Inductors Use a Ferrite Core With an Air Gap

20.4.2026
44

YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

17.4.2026
33

Upcoming Events

Apr 27
15:00 - 16:00 CEST

Commercial Space Screening Approach for Agile, High-Reliability Payloads

Apr 29
10:00 - 11:00 CDT

SEPIC Design Done Right

Apr 30
10:00 - 11:00 CDT

Programming Embedded Systems

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version