Name: Wirebond Materials, Processes, Reliability and Testing
Start: 2025-11-04T12:00:00-05:00
End: 2025-11-06T14:15:00-05:00
Location: virtual

Würth Elektronik Releases Push-Button and Main Switches

13.8.2025

2

Würth Elektronik expands its switch program. The popular SMT-mountable short-travel push-button switches are now joined by a new size version:...

Littelfuse Unveils High-Precision TMR Angle Magnetic Sensors

13.8.2025

3

Littelfuse introduces new TMR-based magnetic angle sensors for enhanced precision and thermal stability. Littelfuse, Inc., a leading industrial technology manufacturing...

Stackpole Extends Voltage of High Temp Chip Resistors

13.8.2025

3

Stackpole enhances voltage ratings for RNCE series of high temperature, high stability thin film chip resistors. Stackpole Electronics, Inc. announced...

High Voltage MLCCs Meeting the Growing Demand for Efficiency in Power Conversion

12.8.2025

32

This article by Verena Özdemir, Product Engineer for Capacitors at Murata Electronics provide insight how high voltage MLCC ceramic capacitors answers the growing...

Bourns Releases High Power High Ripple Chokes

8.8.2025

22

Bourns Custom Magnetics Product Line is introducing the new RoHS compliant* 15322x high power storage choke series. This series is...

KYOCERA AVX Releases Hermaphroditic WTW and WTB Connectors

8.8.2025

6

KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future,...

Radiation Tolerance of Tantalum and Ceramic Capacitors

8.8.2025

56

KYOCERA AVX issues a white paper investigating radiation harness and radiation tolerance of tantalum capacitors and ceramic capacitors. KYOCERA AVX’s...

TDK Releases Compact Polypropylene Film Capacitors for Resonant Topologies

7.8.2025

30

TDK Corporation presents its new EPCOS B3264xH series of double-sided metallized polypropylene film capacitors (MMKP). These components are designed to...