Wirebond Materials, Processes, Reliability and Testing Instructor: Lee Levine Description: Wire Bonding is a welding process that is the dominant chip interconnection method. More than 15 trillion wires are bonded annually. In the past, gold wire was the dominant material in use, but in 2015 copper and palladium coated copper wire captured more than 51% of […]

VIRTUAL: Microelectronic Packaging Failure Modes and Analysis Instructors: Thomas Green and Robert Lowry Description: The design and packaging of microelectronic devices such as hybrids, RF microwave modules, Class III medical implants and other types of packaged microcircuits intended for high reliability systems is a critical aspect of reliability engineering. This course is intended to review […]

Design and Test of Non-Hermetic Microelectronics Instructors: Thomas Green and Robert Lowry Description: Packages made from polymeric materials as opposed to traditional hermetic materials (i.e. metals, ceramics, and glasses) require a different approach from a design, production, testing, and qualification standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces. Fick’s law […]