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    Bourns BTJ Thermal Jumper Chips for PCB Heat Management

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    Bourns BTJ Thermal Jumper Chips for PCB Heat Management

    One‑Pulse Characterization of Nonlinear Power Inductors

    Wk 51 Electronics Supply Chain Digest

    Samsung Unveils World First CLLC Resonant 1kV 33nF C0G MLCC in 1210 Size

    Bourns Releases 500VDC 690VAC Fuse to Protect Power Semiconductors

    Samsung MLCC Replacing Aluminum Polymer Capacitors in AI Systems

    Reliability Improvement in BaTiO3 MLCCs Using Ni–Sn and Ni–In Alloy Electrodes

    Littelfuse Introduces Automotive Current Sensors for EV Battery, Motor, and Safety Systems

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    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

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    Transformer Safety IEC 61558 Standard

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Extreme Temperature Testing for New Space Missions by Alter Technology

12.7.2019
Reading Time: 1 min read
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Source: Alter Technology news

New space missions include more extreme requirements of storage, operational temperatures, and vacuum conditions, and all this testing can be done in our laboratories at Alter Technology.

RelatedPosts

Bourns BTJ Thermal Jumper Chips for PCB Heat Management

One‑Pulse Characterization of Nonlinear Power Inductors

Wk 51 Electronics Supply Chain Digest

With a group of expert and professional engineers, we can provide the characterization to evaluate the usefulness of parts under extreme temperatures, understanding potential failure mechanisms and developing new parts to meet customers’ extreme applications.

All offer includes:

  • Combination of temperature and vacuum movement
  • Different temperature ranges, from very low to very high
  • Vacuum levels
  • Temperature to measure
  • and all the requirements need it

The innovation department is open to new challenges and developments in collaboration with customer requirements.

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