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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

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Harris Night Vision Goggles Leverage Ohmcraft to Lighten the Load for Soldiers

21.6.2017
Reading Time: 1 min read
A A

source: EIN news

ROCHESTER, NY, USA, June 20, 2017 /EINPresswire.com/ — When on a mission, soldiers are often limited to utilizing only the equipment they can carry on their bodies, yet they must be prepared for varied environments—rain or shine, day or night. Harris Corporation’s Spiral Enhanced Night Vision Goggles (SENVG) enable soldiers to see in low light and complete darkness, providing greater situational awareness and improved threat detection that can save lives. To develop this image intensifier technology, Harris partnered with Ohmcraft to supply the high voltage resistors the SENVG requires to operate.

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Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

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SCHURTER THT DIP Switches Support Hardware-Level Configuration

With any wearable technology, weight and size are critical—particularly for military operations, when soldiers are sometimes expected to carry 70 to 100 pounds of gear—so manufacturers look for any opportunity to lighten the load.

“At Ohmcraft, we are capable of delivering high voltage resistors in extremely small form factors, while maintaining the performance and reliability that is essential in equipment used for military missions,” said Eric Van Wormer, Vice President of the Ohmcraft division of Micropen Technologies.

To manufacture these surface mount resistors, Ohmcraft’s technology utilizes the proprietary Micropen electronic printing system to ‘print’ precise, narrow, serpentine lines with resistive ink on a ceramic substrate producing higher performance resistors over a wider range of values on a smaller surface area than is possible with conventional film resistor technology.

Harris Corporation is the world’s leading developer, producer, and supplier of Generation 3 image intensifier technology, and is currently delivering the SENVG system to the U.S. Army on the ENVG II program.

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