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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

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Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

30.10.2025
Reading Time: 2 mins read
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Smiths Interconnect, a leading provider of technically differentiated electronic components, cables and connectors, optical transceivers, microwave and radio frequency products, announced the release of its HR TSX Wire Bond 2 Series – a new range of space-qualified, high-reliability fixed chip attenuators optimised to combine high frequency and power in a small package.

As the global demand for faster data transmission and broadband connectivity contiues to grow, engineers face increasing challenges around space, power, and performance. 

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The new HR TSX WB2 Series is designed to solve these challenges by offering excellent broadband performance up to 50 GHz, while delivering increased power handling in a small 0404 wire bond package.

It allows wider coverage than traditional components while providing optimised return loss for multiple frequency ranges. The HR TSX WB2 Series offers a broadband product that can be used in multiple frequency ranges and many applications reducing the need for customer’s to buy multiple components. The standard parts eliminate the need for costly and time-consuming drawings and specifications as they already meet the specification and testing requirements of MIL-PRF-55342. 

Tullio Panarello, Vice President and General Manager of the Fibre Optics and RF Components Business Unit at Smiths Interconnect said:

“The HR TSX WB2 Series pushes the boundaries of Size, Weight and Power in a cost effective, small wire bond package that is easy to implement in a wide array of applications. It provides excellent attenuation accuracy and reduces overall design footprint, saving valuable space on mission-critical applications.”

Built using a robust, thin-film technology on an alumina substrate, the HR TSX WB2 Series provides reliable and stable performance in critical industries such as aerospace, space, and defence.

Key features and benefits:

  • Compact 0404 form factor – saves valuable board space
  • Space-qualified – compliant with MIL-PRF-55342 standards
  • Wire bondable – easy to install in high-reliability assemblies
  • Broad frequency range (up to 50 GHz) – reduces the need for multiple components
  • Low Voltage Standing Wave Ratio (VSWR) – increases transmitted power
  • Multiple attenuation values – available in 1-10dB, 15dB and 20dB options
  • Up to 1 watt power handling – reliable performance in demanding environments
  • Available in waffle packs or optional tape-and-reel formats for streamlined assembly

Related

Source: Smith Interconnect

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