This podcast by Würth Elektronik explains conditions and processes how to mount through-hole components by reflow.
Because of fast assembling and small sizes, designers are turning to surfance mount technology on their PCBs.
Although there are still through-hole (THT) components that need to be soldered by Wave, Through-Hole Reflow (THR), allows designers to solder the Through-Hole Components together with the surfance mount parts in the Reflow Oven, thus canceling the whole Wave Soldering Process; saving time and money.
Source:
Würth Elektronik
