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    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Molex Acquires Smiths Interconnect

    Murata Integrates Component Models into Cadence EDA Tools

    Wk 42 Electronics Supply Chain Digest

    Stackpole Introduces Automotive Thick Film Wide Termination Chip Resistors

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    Bourns Release Automotive 4-Terminal Shunt Resistors

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    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

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Integrated magnetics components serve hybrid automotives

24.4.2020
Reading Time: 1 min read
A A

Source: eeNewsEurope news

Transformers and chokes in the 3DP series provide up to 50 per cent reduction in volume for compared with current discrete industrial solutions for the same power management, says Premo.

RelatedPosts

Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

Molex Acquires Smiths Interconnect

Murata Integrates Component Models into Cadence EDA Tools

At present the 3kW_HVLV & 7kW_HVHV transformers and chokes are available, with other topologies and power (11kW and 22kW) options in development.

Thermal behaviour is addressed using thermal conductive plastics on the bobbins to create a thermal link between the wire and the core. This can be thermal pad or thermal liquid gap filling material or thermal liquid gap filler to guarantee reliable thermal link between bobbins, windings and core. Core adhesive is also a key from the mean time between failure point of view (core cracks due to temperature gradient between heat and cold halve).

Most of the resonant topology power converters available today have a transformer, resonant choke and output choke, explains Premo. Every component has its own design, core, winding and thermal dissipation.

3DPower is a single component and meet the AEC-Q200 standard.

Samples are available from the end of Q4 2018.

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