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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

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    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

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    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

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Johanson Technology Releases Specific Integrated Passive Device for Semtech IoT Chip

8.12.2020
Reading Time: 2 mins read
A A

For the next generation of low-cost, battery operated, wireless IoT products, the design goal is to provide RF signal range and stability, while also reducing power consumption, in a miniaturised package. As a result, RF chipset manufacturers are increasingly fine-tuning and improving their products, Johanson Technology has released a chipset specific integrated passive device designed to do just this.

LoRa and LoRaWAN are already the ‘de facto technology for Internet of Things (IoT) networks worldwide’ and will provide long-range connectivity for a variety of IoT applications including next generation ‘smart’ everything – cities, homes, buildings, agriculture, metering, supply chain and logistics, and others.

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Using Johanson’s integrated passive device (IPD) 0900FM15D0039, overall PCB space and component count can be significantly reduced. This IPD’s performance has shown to meet (and in some cases exceed) the original discrete reference design in terms of fundamental and harmonic power. With this device, the entire front end RF matching network is reduced to a single EIA 0805 (2.0mm x 1.25mm) component. It is recommended for applications where PCB space is a priority along with consistency of RF performance over production.

For the LoRa platform, specifically, the ability to integrate all the RF components into a much smaller, low profile package would only increase the attractiveness of the chipset for miniaturised, battery powered IoT products. Without this option, OEM’s would have to design the entire capacitor/inductor scheme and mount many separate components onto the printed circuit board.

To meet the requirements, Johanson Technology collaborated with Semtech to develop an IPD that serves as an Impedance-Matched-Balun-Filter.

Manufactured using Low Temperature Cofired Ceramic (LTCC) technology that allows the passive components to be layered ‘three-dimensionally’, IPDs deliver the same functionality as 10 to 40 individual RF components. With this approach, the entire front-end between the chipset and the antenna is manufactured in a single, ultra-low profile package that is less than 40% the total size of the same circuit comprised of discrete components.

The Impedance-Matched-Balun-Filter is designed to operate within the license-free 868 MHz RF band used in Europe and the 915 MHz band for Australia and the Americas. The product pairs seamlessly with Semtech’s LoRa and LoRa Smart Home RF transceivers SX1261, SX1262, and LLCC68.

Related

Source: Johanson Dielectrics

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