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    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

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Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

31.10.2025
Reading Time: 2 mins read
A A

Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, introduced its CVH160808H Series Multilayer Power Chip Inductors.

The advanced monolithic construction of the CVH160808H Series supports higher current applications in a low profile, high reliability form factor

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These new SMD chip inductors are built with advanced multilayer technology to achieve a low profile, superior current capability solution that supports the higher current and space-constrained requirements of today’s consumer and communications applications.

The CVH160808H Series features a metal alloy-based core and monolithic construction offering high reliability, low DC resistance and high current capability in a compact form factor with a maximum profile of 0.8 mm.

The new series has a rated current range of 1300 – 4000 mA, a DC resistance of 0.02 – 0.237 ohms and an operating temperature range of -40 to 125 °C. These features make Bourns® new Power Chip Inductors excellent power conversion solutions for mobile devices, wearables, tablets, laptops and various communication devices.

The CVH160808H Series Multilayer Power Chip Inductors are available now and are RoHS compliant and halogen free.

Features

  • Monolithic construction offering high reliability
  • Low DC resistance
  • High current
  • RoHS compliant and halogen free

Applications

  • Mobile devices
  • Wearable devices
  • Notebooks/tablets
  • Communication devices

Related

Source: Bourns

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