Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Würth Elektronik Releases Heat Sinks for TO and IC packages

    Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio

    Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

    Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors

    Panasonic High Precision Chip Resistors Bridge Gap Between Thin and Thick Technology

    Wk 13 Electronics Supply Chain Digest

    Samsung Introduces 35V MLCCs Flying Capacitors for USB PD Fast Charging

    New J‑STD‑075B Standard Elevates Process Sensitivity Classification for Passive and Solid-State Components

    Modelithics Expands COMPLETE+3D Library for Ansys HFSS

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Würth Elektronik Releases Heat Sinks for TO and IC packages

    Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio

    Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

    Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors

    Panasonic High Precision Chip Resistors Bridge Gap Between Thin and Thick Technology

    Wk 13 Electronics Supply Chain Digest

    Samsung Introduces 35V MLCCs Flying Capacitors for USB PD Fast Charging

    New J‑STD‑075B Standard Elevates Process Sensitivity Classification for Passive and Solid-State Components

    Modelithics Expands COMPLETE+3D Library for Ansys HFSS

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Making the Internet of Things possible with a new breed of memristors

11.1.2018
Reading Time: 3 mins read
A A

source: Phys.org article

The Internet of Things is coming, that much we know. But not without components and chips that can handle the explosion of data that comes with IoT. In 2020, there will be 50 billion industrial internet sensors in place. A single autonomous device – a smartwatch, a cleaning robot, or a driverless car – can produce gigabytes of data each day, whereas an airbus may have over 10,000 sensors in one wing alone.

RelatedPosts

Würth Elektronik Releases Heat Sinks for TO and IC packages

Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio

Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

Two hurdles need to be overcome. First, current transistors in computer chips must be miniaturized to the size of only few nanometres, a huge thermodynamic challenge; second, analysing and storing unprecedented amounts of data will require equally huge amounts of energy. Sayani Majumdar, Academy Fellow at Aalto University, along with her colleagues, is designing technology to tackle both issues.

Majumdar has with her colleagues designed and fabricated the basic building blocks of future components in what are called “neuromorphic” computers inspired by the human brain. It’s a field of research on which the largest ICT companies in the world and also the EU are investing heavily. Still, no one has yet come up with a nanoscale hardware architecture that could be scaled to industrial manufacture and use.

“The technology and design of neuromorphic computing is advancing more rapidly than its rival revolution, quantum computing. There is already wide speculation both in academia and company R&D about ways to inscribe heavy computing capabilities in the hardware of smart phones, tablets and laptops. The key is to achieve the extreme energy-efficiency of a biological brain and mimic the way neural networks process information through electric impulses,” explains Majumdar.

Basic components for computers that work like the brain

In their recent article in Advanced Functional Materials, Majumdar and her team report that they have fabricated a new breed of ferroelectric tunnel junctions, nanometre-scale ferroelectric thin films sandwiched between two electrodes. They have abilities beyond existing technologies and bode well for energy-efficient and stable neuromorphic computing.

The junctions work in low voltages of less than five volts and with a variety of electrode materials – including silicon used in chips in most of our electronics. They also can retain data for more than 10 years without power and be manufactured in normal conditions.

Tunnel junctions have up to this point mostly been made of metal oxides and require 700 degree Celsius temperatures and high vacuums to manufacture. Ferroelectric materials also contain lead which makes them – and all our computers – a serious environmental hazard.

“Our junctions are made out of organic hydro-carbon materials and they would reduce the amount of toxic heavy metal waste in electronics. We can also make thousands of junctions a day in room temperature without them suffering from the water or oxygen in the air,” explains Majumdar.

What makes ferroelectric thin film components great for neuromorphic computers is their ability to switch between not only binary states – 0 and 1 – but a large number of intermediate states, as well. This allows them to ‘memorise’ information not unlike the brain: to store it for a long time with minute amounts of energy and to retain the information they have once received – even after being switched off and on again.

These are called memristors. They are ideal for computation similar to that in biological brains. Take, for example, the upcoming Mars 2020 rover. For the Rover to process data on its own using only a single solar panel as an energy source, its unsupervised algorithms will need to use an artificial brain.

“What we are striving for now is to integrate millions of our tunnel junction memristors into a network on a one square centimetre area. We can expect to pack so many in such a small space because we have now achieved a record-high difference in the current between on and off-states in the junctions and that provides functional stability. The memristors could then perform complex tasks like image and pattern recognition and make decisions autonomously,” says Majumdar.

featured image: The probe-station device (the full instrument, left, and a closer view of the device connection, right) which measures the electrical responses of the basic components for computers mimicking the human brain. The tunnel junctions are on a thin film on the substrate plate. Credit: Tapio Reinekoski

Related

Recent Posts

Würth Elektronik Releases Heat Sinks for TO and IC packages

31.3.2026
4

Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio

31.3.2026
4

Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

31.3.2026
8

Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors

31.3.2026
3

Panasonic High Precision Chip Resistors Bridge Gap Between Thin and Thick Technology

30.3.2026
55

New J‑STD‑075B Standard Elevates Process Sensitivity Classification for Passive and Solid-State Components

27.3.2026
25

Modelithics Expands COMPLETE+3D Library for Ansys HFSS

27.3.2026
6

Vishay Releases Compact High‑Accuracy Hall Effect Linear Position Sensor

26.3.2026
8

Nanocrystalline Cores for Low‑Loss MHz Chip Inductors

25.3.2026
38

Upcoming Events

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

May 5
16:00 - 17:00 CEST

Understanding and Selecting Capacitors – Fundamentals, Technologies and Latest Trends

May 19
16:00 - 17:00 CEST

Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Plastic Materials Dielectric Constant and DF

    4 shares
    Share 4 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version