Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Making the Internet of Things possible with a new breed of memristors

11.1.2018
Reading Time: 3 mins read
A A

source: Phys.org article

The Internet of Things is coming, that much we know. But not without components and chips that can handle the explosion of data that comes with IoT. In 2020, there will be 50 billion industrial internet sensors in place. A single autonomous device – a smartwatch, a cleaning robot, or a driverless car – can produce gigabytes of data each day, whereas an airbus may have over 10,000 sensors in one wing alone.

RelatedPosts

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

TDK X Series SMD Varistors for Industrial Transient Protection

Two hurdles need to be overcome. First, current transistors in computer chips must be miniaturized to the size of only few nanometres, a huge thermodynamic challenge; second, analysing and storing unprecedented amounts of data will require equally huge amounts of energy. Sayani Majumdar, Academy Fellow at Aalto University, along with her colleagues, is designing technology to tackle both issues.

Majumdar has with her colleagues designed and fabricated the basic building blocks of future components in what are called “neuromorphic” computers inspired by the human brain. It’s a field of research on which the largest ICT companies in the world and also the EU are investing heavily. Still, no one has yet come up with a nanoscale hardware architecture that could be scaled to industrial manufacture and use.

“The technology and design of neuromorphic computing is advancing more rapidly than its rival revolution, quantum computing. There is already wide speculation both in academia and company R&D about ways to inscribe heavy computing capabilities in the hardware of smart phones, tablets and laptops. The key is to achieve the extreme energy-efficiency of a biological brain and mimic the way neural networks process information through electric impulses,” explains Majumdar.

Basic components for computers that work like the brain

In their recent article in Advanced Functional Materials, Majumdar and her team report that they have fabricated a new breed of ferroelectric tunnel junctions, nanometre-scale ferroelectric thin films sandwiched between two electrodes. They have abilities beyond existing technologies and bode well for energy-efficient and stable neuromorphic computing.

The junctions work in low voltages of less than five volts and with a variety of electrode materials – including silicon used in chips in most of our electronics. They also can retain data for more than 10 years without power and be manufactured in normal conditions.

Tunnel junctions have up to this point mostly been made of metal oxides and require 700 degree Celsius temperatures and high vacuums to manufacture. Ferroelectric materials also contain lead which makes them – and all our computers – a serious environmental hazard.

“Our junctions are made out of organic hydro-carbon materials and they would reduce the amount of toxic heavy metal waste in electronics. We can also make thousands of junctions a day in room temperature without them suffering from the water or oxygen in the air,” explains Majumdar.

What makes ferroelectric thin film components great for neuromorphic computers is their ability to switch between not only binary states – 0 and 1 – but a large number of intermediate states, as well. This allows them to ‘memorise’ information not unlike the brain: to store it for a long time with minute amounts of energy and to retain the information they have once received – even after being switched off and on again.

These are called memristors. They are ideal for computation similar to that in biological brains. Take, for example, the upcoming Mars 2020 rover. For the Rover to process data on its own using only a single solar panel as an energy source, its unsupervised algorithms will need to use an artificial brain.

“What we are striving for now is to integrate millions of our tunnel junction memristors into a network on a one square centimetre area. We can expect to pack so many in such a small space because we have now achieved a record-high difference in the current between on and off-states in the junctions and that provides functional stability. The memristors could then perform complex tasks like image and pattern recognition and make decisions autonomously,” says Majumdar.

featured image: The probe-station device (the full instrument, left, and a closer view of the device connection, right) which measures the electrical responses of the basic components for computers mimicking the human brain. The tunnel junctions are on a thin film on the substrate plate. Credit: Tapio Reinekoski

Related

Recent Posts

TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

TDK X Series SMD Varistors for Industrial Transient Protection

14.10.2026
8
Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

13.10.2026
17
Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

Relaxor superlattice capacitors approach 99% efficiency

12.10.2026
26
Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

12.10.2026
10
Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

TT Electronics: Resistor and Sensing Trends at electronica 2026

9.10.2026
13
Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

Toray Film Capacitor Enables 150°C Inverter Operation

9.10.2026
55
Samtec automotive interconnect technologies for software-defined vehicle electronics

Samtec Links Automotive Connector Demands to Software-Defined Cars

8.10.2026
12
Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

Panasonic Targets Space Thermal Design at SPCD 2026

8.10.2026
35
tungsten-bronze-ceramic-capacitor-stack

Tungsten bronze capacitors combine high κ and thermal stability

7.10.2026
31

Upcoming Events

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved