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    Antiferroelectric hafnia crystal structure showing alternating polar layers and field-aligned polar state, University of Nebraska–Lincoln

    Antiferroelectric Hafnia at the 2D Limit

    Bourns UALH Series aluminum housed high-power wirewound resistor in a thin rectangular metal enclosure

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    schurter-tcsv4-side-actuated-smt-tactile-switch

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    TLVR multiphase coupled inductors, auxiliary ballast inductor

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    Bourns CRH2512 2512 surface-mount metal-alloy current-sense resistor for high-current low-ohmic measurement

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    Antiferroelectric hafnia crystal structure showing alternating polar layers and field-aligned polar state, University of Nebraska–Lincoln

    Antiferroelectric Hafnia at the 2D Limit

    Bourns UALH Series aluminum housed high-power wirewound resistor in a thin rectangular metal enclosure

    Bourns Wirewound Resistors Target 100 W Industrial Designs

    Coilcraft CSX7045 surface-mount current sense transformers with compact chip-style package

    Coilcraft Extends Current Sense Transformers with 1.8 kVrms Isolation

    Metallized film capacitor winding with PEN, PET and polypropylene dielectric film layers shown in a power-electronics supply-chain concept

    PEN Film Supply Challenges and Capacitor Replacement Paths

    Wk 37 Electronics Supply Chain Digest

    Vishay Sfernice D2TO and DTO thick-film SMD power resistor sample kits with TO-263 D2PAK and TO-252 DPAK devices

    Vishay SMD Power Resistor Sample Kits for High-Power Design

    schurter-tcsv4-side-actuated-smt-tactile-switch

    SCHURTER Introduces Side-Actuated SMT Tactile Switch

    TLVR multiphase coupled inductors, auxiliary ballast inductor

    TLVR Coupled Inductors: Fast Load-Step Response and Current-Dependent Ballast-Inductor Optimisation

    Bourns CRH2512 2512 surface-mount metal-alloy current-sense resistor for high-current low-ohmic measurement

    Bourns CRH2512 5 W Current-Sense Resistors

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microOhm Conductors Embedded into 3D-Printed Plastics

9.11.2019
Reading Time: 2 mins read
A A

Source: Rudgers University news Rudgers University scientists succeeded to 3D-printed plastics with embedded high performance electrical circuits. This Rutgers innovation could lead to better drones, satellites or biomedical devices

Rutgers engineers have embedded high performance electrical circuits inside 3D-printed plastics, which could lead to smaller and versatile drones and better-performing small satellites, biomedical implants and smart structures.

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They used pulses of high-energy light to fuse tiny silver wires, resulting in circuits that conduct 10 times more electricity than the state of the art, according to a study in the journal Additive Manufacturing. By increasing conductivity10-fold, the engineers can reduce energy use, extend the life of devices and increase their performance.

“Our innovation shows considerable promise for developing an integrated unit – using 3D printing and intense pulses of light to fuse silver nanoparticles – for electronics,” said senior author Rajiv Malhotra, an assistant professor in the Department of Mechanical and Aerospace Engineering in the School of Engineering at Rutgers University–New Brunswick.

Embedding electrical interconnections inside 3D-printed structures made of polymers, or plastics, can create new paradigms for devices that are smaller and more energy-efficient. Such devices could include CubeSats (small satellites), drones, transmitters, light and motion sensors and Global Positioning Systems. Such interconnections are also often used in antennas, pressure sensors, electrical coils and electrical grids for electromagnetic shielding.

The engineers used high-tech “intense pulsed light sintering” – featuring high-energy light from a xenon lamp – to fuse long thin rods of silver called nanowires. Nanomaterials are measured in nanometers (a nanometer is a millionth of a millimeter – about 100,000 times thinner than a human hair). Fused silver nanomaterials are already used to conduct electricity in devices such as solar cells, displays and radio-frequency identification (RFID) tags.

Next steps include making fully 3D internal circuits, enhancing their conductivity and creating flexible internal circuits inside flexible 3D structures, Malhotra said.

The lead author is Rutgers doctoral student Md Naim Jahangir. Rutgers co-authors include undergraduate Jeremy Cleeman and postdoctoral student Hyun-Jun Hwang.

featured image: Example of simple light-sensing electronics with an LED (light-emitting diode), a light-sensitive diode (semiconductor) and power connected by a high-performance circuit inside polymer. The LED is on when exposed to light and off when light from the diode is blocked. Image credit: Md Naim Jahangir; Rudgers University

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