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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

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    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

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    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

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    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

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    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

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    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

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microOhm Conductors Embedded into 3D-Printed Plastics

9.11.2019
Reading Time: 2 mins read
A A

Source: Rudgers University news Rudgers University scientists succeeded to 3D-printed plastics with embedded high performance electrical circuits. This Rutgers innovation could lead to better drones, satellites or biomedical devices

Rutgers engineers have embedded high performance electrical circuits inside 3D-printed plastics, which could lead to smaller and versatile drones and better-performing small satellites, biomedical implants and smart structures.

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They used pulses of high-energy light to fuse tiny silver wires, resulting in circuits that conduct 10 times more electricity than the state of the art, according to a study in the journal Additive Manufacturing. By increasing conductivity10-fold, the engineers can reduce energy use, extend the life of devices and increase their performance.

“Our innovation shows considerable promise for developing an integrated unit – using 3D printing and intense pulses of light to fuse silver nanoparticles – for electronics,” said senior author Rajiv Malhotra, an assistant professor in the Department of Mechanical and Aerospace Engineering in the School of Engineering at Rutgers University–New Brunswick.

Embedding electrical interconnections inside 3D-printed structures made of polymers, or plastics, can create new paradigms for devices that are smaller and more energy-efficient. Such devices could include CubeSats (small satellites), drones, transmitters, light and motion sensors and Global Positioning Systems. Such interconnections are also often used in antennas, pressure sensors, electrical coils and electrical grids for electromagnetic shielding.

The engineers used high-tech “intense pulsed light sintering” – featuring high-energy light from a xenon lamp – to fuse long thin rods of silver called nanowires. Nanomaterials are measured in nanometers (a nanometer is a millionth of a millimeter – about 100,000 times thinner than a human hair). Fused silver nanomaterials are already used to conduct electricity in devices such as solar cells, displays and radio-frequency identification (RFID) tags.

Next steps include making fully 3D internal circuits, enhancing their conductivity and creating flexible internal circuits inside flexible 3D structures, Malhotra said.

The lead author is Rutgers doctoral student Md Naim Jahangir. Rutgers co-authors include undergraduate Jeremy Cleeman and postdoctoral student Hyun-Jun Hwang.

featured image: Example of simple light-sensing electronics with an LED (light-emitting diode), a light-sensitive diode (semiconductor) and power connected by a high-performance circuit inside polymer. The LED is on when exposed to light and off when light from the diode is blocked. Image credit: Md Naim Jahangir; Rudgers University

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