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    Bourns Introduces Four-Terminal Shunt Resistors for Current Sensing

    Würth Elektronik WE-SLSP SMT common-mode choke with a square package and four terminals.

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    Samtec AcceleRate mP 10 mm Signal and Power Connectors

    Schematic diagrams illustrating the physical model of the stripline microinductor.

    Stripline Microinductors with Nickel–Iron Oxide Cores

    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

    Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

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    Transformer Losses and Thermal Design: Modelling and Validation

    DMASS Europe Q3 2026 electronic component distribution market overview

    European Component Distribution Jumps 42.7% in Q3 2026

    Bourns MSF series four-terminal current-sense shunt resistor with radial PCB terminals

    Bourns Introduces Four-Terminal Shunt Resistors for Current Sensing

    Würth Elektronik WE-SLSP SMT common-mode choke with a square package and four terminals.

    Würth Elektronik Releases Common-Mode Chokes for 100 V Data and Power Lines

    Assorted electronic connectors for USB, audio, video and power interfaces

    Top 10 Connector Manufacturers 2025: Amphenol Takes the Lead

    Samtec AcceleRate mP UDM6 and UDF6 board-to-board connectors with signal-contact arrays and power blades

    Samtec AcceleRate mP 10 mm Signal and Power Connectors

    Schematic diagrams illustrating the physical model of the stripline microinductor.

    Stripline Microinductors with Nickel–Iron Oxide Cores

    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

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    Bourns Releases Power Resistor Adds Reverse-Pin Configuration

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microOhm Conductors Embedded into 3D-Printed Plastics

9.11.2019
Reading Time: 2 mins read
A A

Source: Rudgers University news Rudgers University scientists succeeded to 3D-printed plastics with embedded high performance electrical circuits. This Rutgers innovation could lead to better drones, satellites or biomedical devices

Rutgers engineers have embedded high performance electrical circuits inside 3D-printed plastics, which could lead to smaller and versatile drones and better-performing small satellites, biomedical implants and smart structures.

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They used pulses of high-energy light to fuse tiny silver wires, resulting in circuits that conduct 10 times more electricity than the state of the art, according to a study in the journal Additive Manufacturing. By increasing conductivity10-fold, the engineers can reduce energy use, extend the life of devices and increase their performance.

“Our innovation shows considerable promise for developing an integrated unit – using 3D printing and intense pulses of light to fuse silver nanoparticles – for electronics,” said senior author Rajiv Malhotra, an assistant professor in the Department of Mechanical and Aerospace Engineering in the School of Engineering at Rutgers University–New Brunswick.

Embedding electrical interconnections inside 3D-printed structures made of polymers, or plastics, can create new paradigms for devices that are smaller and more energy-efficient. Such devices could include CubeSats (small satellites), drones, transmitters, light and motion sensors and Global Positioning Systems. Such interconnections are also often used in antennas, pressure sensors, electrical coils and electrical grids for electromagnetic shielding.

The engineers used high-tech “intense pulsed light sintering” – featuring high-energy light from a xenon lamp – to fuse long thin rods of silver called nanowires. Nanomaterials are measured in nanometers (a nanometer is a millionth of a millimeter – about 100,000 times thinner than a human hair). Fused silver nanomaterials are already used to conduct electricity in devices such as solar cells, displays and radio-frequency identification (RFID) tags.

Next steps include making fully 3D internal circuits, enhancing their conductivity and creating flexible internal circuits inside flexible 3D structures, Malhotra said.

The lead author is Rutgers doctoral student Md Naim Jahangir. Rutgers co-authors include undergraduate Jeremy Cleeman and postdoctoral student Hyun-Jun Hwang.

featured image: Example of simple light-sensing electronics with an LED (light-emitting diode), a light-sensitive diode (semiconductor) and power connected by a high-performance circuit inside polymer. The LED is on when exposed to light and off when light from the diode is blocked. Image credit: Md Naim Jahangir; Rudgers University

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