Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

    Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

    Samsung MLCC Options for 1 MW AI Rack Power

    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

    5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

    Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

    Samsung MLCC Options for 1 MW AI Rack Power

    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

    5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

MIT and Lamborghini filed a joint patent for a material that will serve as the technological base for a new generation of supercapacitors

16.12.2019
Reading Time: 3 mins read
A A

The new patented material was synthesized by Dincă’s lab in the Department of Chemistry, with the support of Automobili Lamborghini’s Concept Development Department, and will serve as the technological base for a new generation of supercapacitors.

By increasing the surface area exposed to electric charge in relation to mass and volume, the patent promises to increase energy density by up to 100 percent when compared to existing technology. This is a big leap, even when compared to Lamborghini’s cutting-edge supercapacitors, and, more broadly, a game-changer in high-performance motor sport.

RelatedPosts

Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

Samsung MLCC Options for 1 MW AI Rack Power

5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

“He was here to dream, and I said ‘OK, let’s dream together,’” recalls Professor Mircea Dincă of his first encounter with Automobili Lamborghini Head of Development Riccardo Parenti in February 2017. Two years later, the team is celebrating its first major collaborative victory by filing a joint patent.

A second collaboration, with Professor A. John Hart’s team in the Department of Mechanical Engineering, pursues new design principles for high-performance battery materials that can be integrated into the vehicle structure, and is on schedule to deliver its first prototypes in the next year. Together, these collaborations are key in meeting the performance targets Lamborghini set for its Terzo Millennio car.

As Stefano Domenicali, chair and CEO of Automobili Lamborghini, puts it, “The joint research with MIT fully embodies our values and our vocation for anticipating the future: a future in which hybridization is increasingly desirable and inevitably necessary.”

Of course, after manufacturability, the next question with new technology is the cost, though a maker of high-end sports cars is less sensitive to cost than others.

Lamborghini has been outspoken in its intention to preserve the auditory characteristics of its signature naturally aspirated V10 and V12 engines despite the industry wide move to forced induction. Instead, the Italian supercar maker will rely on electric boosting to keep its machines competitive with turbocharged rivals’ performance while preserving the shriek its customers love.

But rather than follow the conventional hybrid-electric route, using lithium-ion batteries, Lamborghini is pursuing capacitors for energy storage. There’re several very interesting characteristics, the power density, first of all, which makes the capacitors much more powerful compared with batteries — up to three times more power for a given mass — with a symmetrical behavior which makes them able to recuperate as much power as they can deliver.  Under this aspect, the difference with batteries is huge.

And that’s not the only benefit. Then, the very low electrical resistance, which means high efficiency and low heat dissipation, and the very long life, measurable in millions of cycles in comparison with the thousands of cycles of the batteries.

Lamborghini began its push toward super capacitor hybrids in 2017, with the Terzo Millennio, and most recently with the Sián, which debuted at the Geneva Motor Show earlier in 2019.

“We were dreaming two years ago,” says Dincă. “Now, we really think this could be happening.”

featured image: Hidden by this cover is the Sián’s super capacitor. Image source: Automobili Lamborghini

Related

Source: MIT

Recent Posts

Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

Samsung MLCC Options for 1 MW AI Rack Power

18.9.2026
4
Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

Exxelia Passive Components Support BepiColombo Mission

16.9.2026
22
TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

16.9.2026
30

Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

11.9.2026
73
ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

11.9.2026
20

LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

10.9.2026
54

On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

10.9.2026
30

Emerging Capacitor Markets in Fusion Energy

10.9.2026
58
Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

10.9.2026
32

Upcoming Events

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Sep 30
15:00 - 16:00 CEST

Positronic Space and Military Connectors

Oct 14
17:00 - 18:00 CEST

Live Demo! Discover KYOCERA AVX Antenna Integrator Studio (AIS)

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Capacitor Symbols

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved