Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

    When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Wk 16 Electronics Supply Chain Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

    When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Wk 16 Electronics Supply Chain Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Murata Enters Licensing Agreement with Michelin to Integrate RFID Technology into Tires

20.5.2024
Reading Time: 3 mins read
A A

Murata Manufacturing Co., Ltd. is pleased to announce a significant licensing agreement with Michelin, Europe’s premier automobile tire manufacturer.

This agreement will allow for the integration of cutting-edge RFID (Radio Frequency Identification) tire tags into automotive tires, helping to further advance tire management, sustainability, security, and traceability until the end of life within the transportation and wider automotive industry.

RelatedPosts

Murata Automotive MLCCs Push Capacitance Limits for ADAS and Power Lines

Murata to Decouple China Rare Earth Supply in 3 Years

Murata New Vibration Sensor Targets High‑Frequency Predictive Maintenance

For 80 years now, Murata has been a leading company in the electronics market. With a major component for innovation and technology, Murata contributes to the improvement of society. With emerging environmental and societal challenges, Murata is investing more and more in the interconnectivity and traceability of products, giving life to the objects around us, particularly through RFID technology.

In the future, more and more objects will be connected, in order to better trace their origins and recycling. Europe is already implementing the ESPR (Eco-design for Sustainable Products Regulation) improving the circularity of products, each of them will be issued a digital product passport (DPP) allowing their life cycle to be traced.

This will also affect tires which must contain an RFID, an essential component to obtain a DPP. This RFID, in addition to guaranteeing compatibility with new European standards, will make it possible to improve all logistical aspects affecting the tire and automobile industry and mobility more generally.

Michelin and Murata have enjoyed a successful working relationship for many years. This partnership has contributed to advancing RFID tag technology in tires. Thanks to this new agreement, Murata will be able to produce generation 4 RFID tire tags. Through this agreement, Murata will also have the possibility of offering the integration of RFID Tag in tires, patented by Michelin. In the future, tire manufacturers around the world will have access to this cutting-edge solution scheduled to enter mass production.

In addition to offering innovative RFID tire tags, Murata is committed to helping tire manufacturers evaluate and implement these tags into their products. By leveraging its deep understanding of communications technologies, Murata can provide tailored solutions that improve tire traceability and management for various applications, encompassing high-performance motorsport, passenger vehicles, and networks for global transport. Additionally, to facilitate uniform adoption of RFID technology within the tire industry, Murata will continue to provide tire manufacturers with access to solutions based on Murata’s RFID software, id-Bridge.

“RFID technology is a key element, in improving the efficiency and optimization of tire operations. This RFID tag is the unique way to identify tires, from cradle to grave, in a consistent manner, thus responding to the ecological challenges of our time.

Through this license, Murata and Michelin, hand in hand, are revolutionizing the tire industry, by allowing stakeholders to benefit from this technology, this agreement will open up new perspectives for the future of mobility.” said Laurent Couturier, RFID system designer at Michelin.

“Michelin is one of the world’s leading tire manufacturers and this partnership will help to produce solutions capable of overcoming significant challenges that exist within the global tire market, allowing for further advancements in operation efficiency and supply chain reliability,” said Tetsuo Kawakatsu, Director of RFID Business Department at Murata.

Mass production of these innovative tire tags is slated to commence after Jan 2025, further solidifying Murata’s commitment to delivering state-of-the-art solutions to the global tire industry.

Related

Source: Murata

Recent Posts

KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

21.4.2026
7

Why Power Inductors Use a Ferrite Core With an Air Gap

20.4.2026
11

YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

17.4.2026
15

Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

16.4.2026
22

TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

16.4.2026
23

Vishay Extends Power Inductors for DC/DC with 1212 Compact Case

16.4.2026
18

Modeling Planar Magnetics Temperature: Practical Guidelines for Power Electronics Engineers

15.4.2026
20

YAGEO Releases Ferrite Shielded Power Inductors for High‑Density Designs

15.4.2026
16

YAGEO Introduces EMI Suppression High‑Current 3‑phase Common Mode Chokes

14.4.2026
30

Upcoming Events

Apr 22
17:00 - 17:30 CEST

Magnetics in a high frequency GaN era

Apr 22
17:00 - 18:00 CEST

Derating Tantalum, Film, and Ceramic Capacitors

Apr 29
10:00 - 11:00 CDT

SEPIC Design Done Right

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version