Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Littelfuse Expands High-Voltage TVS Diodes

    DigiKey Adds 31k New In‑Stock Parts in Q1 2026

    Miniaturization of Tantalum Capacitors: Structural Limit Under Constant Rating

    Heatsink Design and Thermal Interface Materials for Reliable Electronics

    Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%

    Wk 17 Electronics Supply Chain Digest

    Exxelia Introduces SMD High‑Voltage Mica Capacitors

    Modelithics Releases COMPLETE v26.1 for Keysight ADS

    April 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Littelfuse Expands High-Voltage TVS Diodes

    DigiKey Adds 31k New In‑Stock Parts in Q1 2026

    Miniaturization of Tantalum Capacitors: Structural Limit Under Constant Rating

    Heatsink Design and Thermal Interface Materials for Reliable Electronics

    Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%

    Wk 17 Electronics Supply Chain Digest

    Exxelia Introduces SMD High‑Voltage Mica Capacitors

    Modelithics Releases COMPLETE v26.1 for Keysight ADS

    April 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Pulse Expands its Range of Ultra-low DCR Power Bead Inductors for Computing & Storage

16.9.2022
Reading Time: 3 mins read
A A

Pulse expands its range of power bead inductors with the introduction of six new platform sizes designed for the latest multi-phase and PoL architectures for server, graphics and high power FPGAs.

The latest platforms have ultra-low DCR, low loss ferrite cores and an optimized structure to ensure that they offer the highest efficiency and enable maximum power density.

RelatedPosts

Pulse Electronics Releases High Current, Low DCR Inductors in Compact Size

NIC Components Extends SMD High Voltage MLCC Offering

Stackpole Offers RoHS Compliant Lead-Free Thick Film Chip Resistors

The platforms range in size from 5.7×5.5mm to 10.8×8.2mm and come in inductances from 50nH to 1uH with peak current capability exceeding 120A and DCR as low as 120uOhms.

Part  Number SeriesFootprint (mm Max)  Height (mm Max)DCR (mOhms)Inductance RangePeak Current
PA40595.7 x 5.54.60.20050-70nH50Apk
PA50417.2 x 6.711.20.290120-330nH89Apk
PA499010.0 x 6.012.00.12080-330nH178Apk
PG17129.6 x 6.49.30.170150-300nH75Apk
PA498710.0 x 7.012.00.810470-1000nH32Apk
PA518710.8 x 8.28.20.120100-200nH100Apk

“Pulse has long been a leader in power magnetics for computing and storage applications and these latest offerings add to the already significant portfolio of our high-volume, cost-optimized products.  Our superior product, fast-turn prototyping and end-customer relationships enable us to maintain our leadership position”. John Gallagher | Product Marketing, Power PBU, Pulse Electronics

Although power beads can be used in a wide-range of applications, including input filters and single phase point of load (PoL) regulators, the most common implementation is as the energy storage element in a high-current multi-phase buck regulator. In these applications it is required to convert an input voltage (12v or 48v) down to relatively low output voltage (0.8 to 1.8v) but at currents that can change from 0A to 500Apk in a few hundred nanoseconds.

To protect the sensitive devices being powered these applications also require the output voltage to be very stable which necessitates minimizing the output ripple current. A single phase solution could be enabled but the ability to respond quickly (which requires a low apparent inductance) would be in direct opposition to the need for voltage stability (which requires a high apparent inductance).

By implementing a multi-phase topology, one avoids this conflict by breaking the current into multiple parallel paths. Each path has its own inductor and each path is activated (turned on/off) at different times throughout the cycle before being recombined at the output. This out-of-phase operation means that the ripple current in one path is increasing while in the other paths it is decreasing such that the ripple current partially cancels resulting in low output ripple.

The fact that there is ripple current cancelation at the output allows the inductance in each path to be significantly lower (50-250nH) and this in turn enables a much faster transient response.

These operational benefits of a multiphase circuit come at the expense of putting increased stress on the inductor.  Although the output ripple current is drastically reduced, the ripple current in each phase, due to the low inductance, is very high. 

If the inductor is not optimized the high ripple current will lead to excessive AC core loss and AC winding loss. In addition, the relatively low ratio of output voltage to input voltage (10%) means that the inductor effectively sees a much higher operating frequency which also contributes to high AC losses. Fortunately, Pulse is able to  leverage our three-dimensional finite element analysis modelling skills, in depth material knowledge and vast design experience to ensure we optimize the design to minimize the AC and DC losses.

Related

Source: Pulse Electronics

Recent Posts

Exxelia Introduces SMD High‑Voltage Mica Capacitors

28.4.2026
18

Modelithics Releases COMPLETE v26.1 for Keysight ADS

23.4.2026
13

April 2026 Interconnect, Passives and Electromechanical Components Market Insights

22.4.2026
63

KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

21.4.2026
45

Why Power Inductors Use a Ferrite Core With an Air Gap

20.4.2026
52

YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

17.4.2026
41

Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

17.4.2026
22

Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

17.4.2026
12

Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

16.4.2026
28

Upcoming Events

Apr 30
10:00 - 11:00 CDT

Programming Embedded Systems

May 5
16:00 - 17:00 CEST

Understanding and Selecting Capacitors – Fundamentals, Technologies and Latest Trends

May 7
17:00 - 18:00 CEST

From Grid to Motion: How Industrial Electrification is Redefining Power System Design

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version