Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Binder Hybrid Connector Simplifies One Cable Automation

    Tapped Inductor Buck Converter Fundamentals

    TAIYO YUDEN Releases Mini Metal Power Inductors

    Molecular Memristor Shows Record 145 kH Emergent Inductance

    Planar vs Conventional Transformer: When it Make Sense

    Researchers Propose Next‑Gen Compact Memory Using Ultra-thin Ferroelectric Capacitors

    Nichicon ADN Automotive Hybrid Aluminum Capacitors Now Available in EMEA

    Wk 19 Electronics Supply Chain Digest

    Electrocaloric Multilayer Capacitors: Towards Quiet, Solid‑State Cooling Around Room Temperature

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Tapped Inductor Buck Converter Fundamentals

    Planar vs Conventional Transformer: When it Make Sense

    Modeling Fringing Field Losses in Inductors & Transformers

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Binder Hybrid Connector Simplifies One Cable Automation

    Tapped Inductor Buck Converter Fundamentals

    TAIYO YUDEN Releases Mini Metal Power Inductors

    Molecular Memristor Shows Record 145 kH Emergent Inductance

    Planar vs Conventional Transformer: When it Make Sense

    Researchers Propose Next‑Gen Compact Memory Using Ultra-thin Ferroelectric Capacitors

    Nichicon ADN Automotive Hybrid Aluminum Capacitors Now Available in EMEA

    Wk 19 Electronics Supply Chain Digest

    Electrocaloric Multilayer Capacitors: Towards Quiet, Solid‑State Cooling Around Room Temperature

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Tapped Inductor Buck Converter Fundamentals

    Planar vs Conventional Transformer: When it Make Sense

    Modeling Fringing Field Losses in Inductors & Transformers

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Researchers Demonstrated Novel BTO Based Capacitor Heterostructures with 19x Higher Energy Density

23.4.2024
Reading Time: 4 mins read
A A
Artificial heterostructures made of freestanding 2D and 3D membranes developed by Sang-Hoon Bae’s lab have an energy density up to 19 times higher than commercially available capacitors. (Credit: Bae Lab)

Artificial heterostructures made of freestanding 2D and 3D membranes developed by Sang-Hoon Bae’s lab have an energy density up to 19 times higher than commercially available capacitors. (Credit: Bae Lab)

Sang-Hoon Bae, researcher at McKelvey School of Engineering at Washington University in St. Louis, USA developed BaTiO3(BTO) based heterostructures with material properties optimal for high-density energy storage capacitors with durable ultrafast charging.

Electrostatic capacitors play a crucial role in modern electronics. They enable ultrafast charging and discharging, providing energy storage and power for devices ranging from smartphones, laptops and routers to medical devices, automotive electronics and industrial equipment. However, the ferroelectric dielectric materials used in ceramic capacitors have significant energy loss due to their material properties, making it difficult to provide high energy storage capability. 

RelatedPosts

Binder Hybrid Connector Simplifies One Cable Automation

Tapped Inductor Buck Converter Fundamentals

TAIYO YUDEN Releases Mini Metal Power Inductors

Sang-Hoon Bae, assistant professor of mechanical engineering & materials science in the McKelvey School of Engineering at Washington University in St. Louis, has addressed this long-standing challenge in deploying ferroelectric materials for energy storage applications.

In a study published April 18 in Science, Bae and his collaborators, introduce an approach to control the relaxation time using two-dimensional (2D) materials while minimizing energy loss by using 2D/3D/2D (Au/MoS2/BaTiO3/MoS2/Au) heterostructures and preserving the crystallinity of ferroelectric 3D materials. Using this approach, we were able to achieve an energy density of 191.7 joules per cubic centimeter with an efficiency greater than 90%. This precise control over relaxation time holds promise for a wide array of applications and has the potential to accelerate the development of highly efficient energy storage systems.

Working with Bae, doctoral student Justin S. Kim and postdoctoral researcher Sangmoon Han developed novel 2D/3D/2D heterostructures that can minimize energy loss while preserving the advantageous material properties of ferroelectric 3D materials. Their approach cleverly sandwiches 2D and 3D materials in atomically thin layers with carefully engineered chemical and nonchemical bonds between each layer. A very thin 3D core is inserted between two outer 2D layers to create a stack only about 30 nanometers thick. That’s about one-tenth the size of an average virus particle. 

“We created a new structure based on the innovations we’ve already made in my lab involving 2D materials,” Bae said. “Initially, we weren’t focused on energy storage, but during our exploration of material properties, we found a new physical phenomenon that we realized could be applied to energy storage, and that was both very interesting and potentially much more useful.”

The 2D/3D/2D heterostructures are finely crafted to sit in the sweet spot between conductivity and nonconductivity where semiconducting materials have optimal electric properties for energy storage. With this design, Bae and his collaborators reported an energy density up to 19 times higher than commercially available ferroelectric capacitors, and they achieved an efficiency over 90%, which is also unprecedented.

“We found that dielectric relaxation time can be modulated or induced by a very small gap in the material structure,” Bae explained. “That new physical phenomenon is something we hadn’t seen before. It enables us to manipulate dielectric material in such a way that it doesn’t polarize and lose charge capability.”

As the world grapples with the imperative of transitioning toward next-generation electronics components, Bae’s novel heterostructure material paves the way for high-performance electronic devices, encompassing high-power electronics, high-frequency wireless communication systems, and integrated circuit chips. These advancements are particularly crucial in sectors requiring robust power management solutions, such as electric vehicles and infrastructure development.

“Fundamentally, this structure we’ve developed is a novel electronic material,” Bae said. “We’re not yet 100% optimal, but already we’re outperforming what other labs are doing. Our next steps will be to make this material structure even better, so we can meet the need for ultrafast charging and discharging and very high energy densities in capacitors. We must be able to do that without losing storage capacity over repeated charges to see this material used broadly in large electronics, like electric vehicles, and other developing green technologies.”


Han S, Kim JS, Park E, Meng Y, Xu Z, Foucher AC, Jung GY, Roh I, Lee S, Kim SO, Moon JY, Kim SI, Bae S, Zhang X, Park BI, Seo S, Li Y, Shin H, Reidy K, Hoang AT, Sundaram S, Vuong P, Kim C, Zhao J, Hwang J, Wang C, Choi H, Kim DH, Kwon J, Park JH, Ougazzaden A, Lee JH, Ahn JH, Kim J, Mishra R, Kim HS, Ross FM, and Bae SH. High energy density in artificial heterostructures through relaxation time modulation. Science, April 18, 2024. DOI: https://www.science.org/doi/10.1126/science.adl2835 

Related

Source: Washington University in St.Louis

Recent Posts

Molecular Memristor Shows Record 145 kH Emergent Inductance

12.5.2026
11

Researchers Propose Next‑Gen Compact Memory Using Ultra-thin Ferroelectric Capacitors

11.5.2026
28

Nichicon ADN Automotive Hybrid Aluminum Capacitors Now Available in EMEA

11.5.2026
23

Electrocaloric Multilayer Capacitors: Towards Quiet, Solid‑State Cooling Around Room Temperature

7.5.2026
186

High-Crystallinity Nanocrystalline Composites for MHz Chip Inductors

7.5.2026
64

KYOCERA 10 µF 0201 MLCC Brings High‑Capacitance into Mobile Designs

6.5.2026
54

Energy Localization in Tantalum Anode Formation: A Structural Perspective

4.5.2026
46

YAGEO Introduces C0G Flexible Termination Automotive MLCCs

30.4.2026
41

YMIN Introduces Polymer Tantalum Capacitors for AI Server SSDs

29.4.2026
93

Upcoming Events

May 19
16:00 - 17:00 CEST

Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization

Jun 2
16:00 - 17:00 CEST

Calculation, Simulation and Measurement of 800V EMC Filters

Jun 16
16:00 - 17:00 CEST

EMC with EMC – EMC‑compliant design with electromechanical connectors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version