Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    High-Q RF & Microwave MLCCs: A Cross-Vendor Benchmark

    Molex Unveils Automotive Ethernet Connectors for Next‑Gen SDV Architectures

    TAIYO YUDEN Introduced Hybrid Aluminum Capacitors for 48V Automotive Power Supplies

    ECIA Industry Pulse June 2026 Reaches Five‑Year High

    YAGEO Announces July 2026 Capacitor Price Increase

    YAGEO Presents Single-Phase Common Mode Chokes for Industrial EMI Suppression

    Enabling the 800 V AI Server Era: How C0G High-Voltage MLCC Supports Next-Generation Power Architectures

    binder Prints Electronics on 3D Components Connector Surface

    Vishay Introduces SMD Polymer PTC Thermistors for Fast Resettable Overcurrent Protection

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    High-Q RF & Microwave MLCCs: A Cross-Vendor Benchmark

    Molex Unveils Automotive Ethernet Connectors for Next‑Gen SDV Architectures

    TAIYO YUDEN Introduced Hybrid Aluminum Capacitors for 48V Automotive Power Supplies

    ECIA Industry Pulse June 2026 Reaches Five‑Year High

    YAGEO Announces July 2026 Capacitor Price Increase

    YAGEO Presents Single-Phase Common Mode Chokes for Industrial EMI Suppression

    Enabling the 800 V AI Server Era: How C0G High-Voltage MLCC Supports Next-Generation Power Architectures

    binder Prints Electronics on 3D Components Connector Surface

    Vishay Introduces SMD Polymer PTC Thermistors for Fast Resettable Overcurrent Protection

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Researchers develop hack-proof RFID chips

24.8.2022
Reading Time: 3 mins read
A A

source: EurekAlert! news

New technology could secure credit cards, key cards, and pallets of goods in warehouses. Massachusetts Institute of Technology.

RelatedPosts

High-Q RF & Microwave MLCCs: A Cross-Vendor Benchmark

Molex Unveils Automotive Ethernet Connectors for Next‑Gen SDV Architectures

TAIYO YUDEN Introduced Hybrid Aluminum Capacitors for 48V Automotive Power Supplies

Researchers at MIT and Texas Instruments have developed a new type of radio frequency identification (RFID) chip that is virtually impossible to hack.

If such chips were widely adopted, it could mean that an identity thief couldn’t steal your credit card number or key card information by sitting next to you at a café, and high-tech burglars couldn’t swipe expensive goods from a warehouse and replace them with dummy tags.

Texas Instruments has built several prototypes of the new chip, to the researchers’ specifications, and in experiments the chips have behaved as expected. The researchers presented their research this week at the International Solid-State Circuits Conference, in San Francisco.

According to Chiraag Juvekar, a graduate student in electrical engineering at MIT and first author on the new paper, the chip is designed to prevent so-called side-channel attacks. Side-channel attacks analyze patterns of memory access or fluctuations in power usage when a device is performing a cryptographic operation, in order to extract its cryptographic key.

“The idea in a side-channel attack is that a given execution of the cryptographic algorithm only leaks a slight amount of information,” Juvekar says. “So you need to execute the cryptographic algorithm with the same secret many, many times to get enough leakage to extract a complete secret.”

One way to thwart side-channel attacks is to regularly change secret keys. In that case, the RFID chip would run a random-number generator that would spit out a new secret key after each transaction. A central server would run the same generator, and every time an RFID scanner queried the tag, it would relay the results to the server, to see if the current key was valid.

Blackout

Such a system would still, however, be vulnerable to a “power glitch” attack, in which the RFID chip’s power would be repeatedly cut right before it changed its secret key. An attacker could then run the same side-channel attack thousands of times, with the same key. Power-glitch attacks have been used to circumvent limits on the number of incorrect password entries in password-protected devices, but RFID tags are particularly vulnerable to them, since they’re charged by tag readers and have no onboard power supplies.

Two design innovations allow the MIT researchers’ chip to thwart power-glitch attacks: One is an on-chip power supply whose connection to the chip circuitry would be virtually impossible to cut, and the other is a set of “nonvolatile” memory cells that can store whatever data the chip is working on when it begins to lose power.

For both of these features, the researchers — Juvekar; Anantha Chandrakasan, who is Juvekar’s advisor and the Vannevar Bush Professor of Electrical Engineering and Computer Science; Hyung-Min Lee, who was a postdoc in Chandrakasan’s group when the work was done and is now at IBM; and TI’s Joyce Kwong, who did her master’s degree and PhD with Chandrakasan — use a special type of material known as a ferroelectric crystals.

As a crystal, a ferroelectric material consists of molecules arranged into a regular three-dimensional lattice. In every cell of the lattice, positive and negative charges naturally separate, producing electrical polarization. The application of an electric field, however, can align the cells’ polarization in either of two directions, which can represent the two possible values of a bit of information.

When the electric field is removed, the cells maintain their polarization. Texas Instruments and other chip manufacturers have been using ferroelectric materials to produce nonvolatile memory, or computer memory that retains data when it’s powered off.

Complementary capacitors

A ferroelectric crystal can also be thought of as a capacitor, an electrical component that separates charges and is characterized by the voltage between its negative and positive poles. Texas Instruments’ manufacturing process can produce ferroelectric cells with either of two voltages: 1.5 volts or 3.3 volts.

The researchers’ new chip uses a bank of 3.3-volt capacitors as an on-chip energy source. But it also features 571 1.5-volt cells that are discretely integrated into the chip’s circuitry. When the chip’s power source — the external scanner — is removed, the chip taps the 3.3-volt capacitors and completes as many operations as it can, then stores the data it’s working on in the 1.5-volt cells.

When power returns, before doing anything else the chip recharges the 3.3-volt capacitors, so that if it’s interrupted again, it will have enough power to store data. Then it resumes its previous computation. If that computation was an update of the secret key, it will complete the update before responding to a query from the scanner. Power-glitch attacks won’t work.

Because the chip has to charge capacitors and complete computations every time it powers on, it’s somewhat slower than conventional RFID chips. But in tests, the researchers found that they could get readouts from their chips at a rate of 30 per second, which should be more than fast enough for most RFID applications.

Related

Recent Posts

High-Q RF & Microwave MLCCs: A Cross-Vendor Benchmark

2.7.2026
36

TAIYO YUDEN Introduced Hybrid Aluminum Capacitors for 48V Automotive Power Supplies

2.7.2026
26

YAGEO Announces July 2026 Capacitor Price Increase

1.7.2026
299

Enabling the 800 V AI Server Era: How C0G High-Voltage MLCC Supports Next-Generation Power Architectures

1.7.2026
80

MLCCs in the Age of AI: Q2 2026 Market Tightness

30.6.2026
247

AI Hardware Demand for Passive Components Dossier

30.6.2026
86

Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

29.6.2026
25

Skeleton Supercapacitor Achieves UL‑certified 3,500 A Peak Current for AI Data Centers

26.6.2026
67

100 V Hybrid Polymer Capacitor from VINA Enesol Targets 48–72 V Power Platforms

26.6.2026
134

Upcoming Events

Jul 14
16:00 - 17:00 CEST

EMC Design Essentials: Mastering Varistors and Common Mode Chokes

Jul 21
16:00 - 17:00 CEST

Safety by design: X and Y Interference suppression capacitors for power line filters

Jul 28
8:00 - 11:00 CEST

Post Procurement Testing of EEE Components for LEO Space Applications

View Calendar

Popular Posts

  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version