Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

    Transformer Losses and Thermal Design: Modelling and Validation

    DMASS Europe Q3 2026 electronic component distribution market overview

    European Component Distribution Jumps 42.7% in Q3 2026

    Bourns MSF series four-terminal current-sense shunt resistor with radial PCB terminals

    Bourns Introduces Four-Terminal Shunt Resistors for Current Sensing

    Würth Elektronik WE-SLSP SMT common-mode choke with a square package and four terminals.

    Würth Elektronik Releases Common-Mode Chokes for 100 V Data and Power Lines

    Assorted electronic connectors for USB, audio, video and power interfaces

    Top 10 Connector Manufacturers 2025: Amphenol Takes the Lead

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

    Transformer Losses and Thermal Design: Modelling and Validation

    DMASS Europe Q3 2026 electronic component distribution market overview

    European Component Distribution Jumps 42.7% in Q3 2026

    Bourns MSF series four-terminal current-sense shunt resistor with radial PCB terminals

    Bourns Introduces Four-Terminal Shunt Resistors for Current Sensing

    Würth Elektronik WE-SLSP SMT common-mode choke with a square package and four terminals.

    Würth Elektronik Releases Common-Mode Chokes for 100 V Data and Power Lines

    Assorted electronic connectors for USB, audio, video and power interfaces

    Top 10 Connector Manufacturers 2025: Amphenol Takes the Lead

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Researchers Developed Adhesive Electrodes for Flexible 2D Supercapacitors

9.5.2024
Reading Time: 3 mins read
A A

Research team from Jilin University in China has developed adhesive electrodes that solves one of the major issues facing advancing flexible 2D supercapacitors — optimize interface between electrodes and the electrolyte by preparation of effective adhesive electrode.

“Flexible 2D supercapacitors typically suffer from complicated and time-consuming fabrication procedures and poor mechanical endurance,” said corresponding author Wen Li, professor from Jilin University in China.

RelatedPosts

TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

Connector Raw Material Costs Rise 20.9% in Q2 2026

AI and Passive Components: Structural Growth Beyond Data Centers

“In this study, we created a new type of all-in-one adhesive electrode that can not only simplify the fabrication process but also overcome the interfacial displacement of conventional supercapacitors.”

Flexible 2D supercapacitors are typically sandwich stacked structure or 2D flat structure. Under repeated mechanical deformation, the interface between electrodes and the electrolyte can become displaced, rendering the interfacial contact less effective.

“However, the mismatched bulk strain between the electrode and the electrolyte layers usually causes the inevitable interfacial displacement and delamination during repeated mechanical deformation, giving rise to a significant increase in the interfacial contact resistance between electrodes and electrolyte layers,” Li said.

“As a result, the charge/discharge rate is severely diminished and the energy storage performance as well as the stability are suppressed. More frustratingly, the integrated flexible supercapacitor devices in series for high-voltage output still depend on lots of conducting metal wires, which largely limit their flexibility, deformable tolerance and miniaturization for practical applications.”

To solve interfacial problems and eliminate wires, the researchers combined HPA with amino acids and carbon materials to construct a kind of all-in-one wet adhesive simultaneously carrying electron conduction, redox property, mechanical deformation, and adhesiveness. Heteropoly acids (HPAs), serving as a class of inorganic nano-sized clusters with fast and reversible redox activity enables the supercapacitor to quickly and reliably charge and discharge energy.

The amino acids help the HPAs become more flexible, while the carbon materials contribute to electronic conduction. They patterned the resulting wet adhesive in a parallel manner to form flexible electrodes. After bridging the gap between the parallel electrodes by injecting a gel-electrolyte, they can conveniently create a flexible 2D supercapacitor.

“We found that the carbon components improved the electronic conduction; the chemistry of the amino acids contribute to the interfacial adhesion; and the HPA clusters both prevented larger structures from forming and endowed the electrode with electron transfer and storage ability,” Li said.

“The resultant adhesives are adaptive and deformable materials that facilitate the development of flexible 2D supercapacitors for high voltage output with metal-free interconnects.”

The researchers said they would try to create substrate-independent and miniature flexible 2D supercapacitors for developing implantable power devices.

More information: Chuanling Mu et al, Taming of heteropoly acids into adhesive electrodes using amino acids for the development of flexible two-dimensional supercapacitors, Polyoxometalates (2024). DOI: 10.26599/POM.2024.9140062

Related

Source: Jilin University

Recent Posts

Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

5.11.2026
6
Schematic diagrams illustrating the physical model of the stripline microinductor.

Stripline Microinductors with Nickel–Iron Oxide Cores

4.11.2026
8
Conceptual polypropylene DC-link film capacitor module with parallel cells and copper interconnections

DC-Link Film Capacitor Modules: Inductance and Thermal Design, Jianghai-Europe Tech Memo

3.11.2026
17

Motor Run Capacitor Safety Classes S0–S3: A Design Guide

2.11.2026
25

Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

28.10.2026
54
Mathematical state-space illustration of a series-connected memcapacitor oscillator with two constrained memory coordinates

Memcapacitor chaos in a six-state series-connected model

28.10.2026
21
Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

Exxelia Brings High-Temperature Passives to Electronica 2026

29.10.2026
37
Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

27.10.2026
26
MLCC construction image

Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

26.10.2026
85

Upcoming Events

Nov 24
16:00 - 17:00 CET

Select the Correct Components for Your DC/DC Converter

Dec 1
16:00 - 17:00 CET

Developing low-noise mixed-signal systems

Dec 8
16:00 - 17:00 CET

WE-CCMF: Design Principles, Layout Guidelines and Measurement Results for High-Speed EMI Filtering

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved