Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Conceptual illustration of a Murata NCU01 surface-mount NTC thermistor beside densely arranged electronic components

    Murata World First 008004 NTC Thermistors for Temperature Sensing

    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Conceptual illustration of a Murata NCU01 surface-mount NTC thermistor beside densely arranged electronic components

    Murata World First 008004 NTC Thermistors for Temperature Sensing

    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Researches Developed Fast and Low Cost Prototyping Technique to Make Wearable Stretchable Sensors and Supercapacitors

16.2.2022
Reading Time: 4 mins read
A A
A supercapacitor array made using a new fabrication technique that is faster and less expensive than photolithography. (Image by Peisheng He/UC Berkeley)

A supercapacitor array made using a new fabrication technique that is faster and less expensive than photolithography. (Image by Peisheng He/UC Berkeley)

Engineers at UC Berkeley have developed a new technique for making stretchable flexible electronics – wearable sensors and supercapacitors – that enables medical researchers to prototype test new designs much faster and at a far lower cost than existing methods.

The new technique replaces photolithography — a multistep process used to make computer chips in clean rooms — with a $200 vinyl cutter. The novel approach slashes the time to make small batches of sensors by nearly 90% while cutting costs by almost 75%, said Renxiao Xu (Ph.D.’20 ME), who developed the technique while pursuing his Ph.D. in mechanical engineering at Berkeley.

RelatedPosts

Electroninks Enhanced Ultra-Fine Silver Ink Ready for Aerosol Jet Printing

High Energy Flexible Supercapacitors for IoT Applications

Integrated Flexible Solar and Supercapacitors Maximize IoT Device Performance & Operating Life

“Most researchers working on medical devices have no background in photolithography,” Xu said. “Our method makes it easy and inexpensive for them to change their sensor design on a computer and then send the file to the vinyl cutter to make.”

A description of the technique was published Jan. 25 in ACS Nano. Xu, who now works at Apple, and Liwei Lin, professor of mechanical engineering and co-director of the Berkeley Sensor and Actuator Center, were the lead researchers.

Wearable sensors are often used by researchers to gather medical data from patients over extended periods of time. They range from adhesive bandages on skin to stretchable implants on organs, and harness sophisticated sensors to monitor health or diagnose illnesses. These devices consist of flat wires, called interconnects, as well as sensors, power sources and antennas to communicate data to smartphone apps or other receivers. To maintain full functionality, they must stretch, flex and twist with the skin and organs they are mounted on — without generating strains that would compromise their circuitry.

A stretchable “smart mesh” made from the two-mode cutting fabrication process. This device could be applied in skin-mounted sweat extraction and sensing. (Image by Peisheng He/UC Berkeley)

To achieve low-strain flexibility, engineers use an “island-bridge” structure, Xu said. The islands house rigid electronics and sensor components, such as commercial resistors, capacitors and lab-synthesized components like carbon nanotubes. The bridges link the islands to one another. Their spiral and zigzag shapes stretch like springs to accommodate large deformations. In the past, researchers have built these island-bridge systems using photolithography, a multistep process that uses light to create patterns on semiconductor wafers. Making wearable sensors this way requires a clean room and sophisticated equipment.

The new technique is simpler, faster and more economical, especially when making the one or two dozen samples that medical researchers typically need for testing. Making sensors starts by attaching an adhesive sheet of polyethylene terephthalate (PET) to a Mylar (biaxially oriented PET) substrate. Other plastics would also work, Xu said.

A vinyl cutter then shapes them using two types of cuts. The first, the tunnel cut, slices through only the top PET layer but leaves the Mylar substrate untouched. The second type, the through cut, carves through both layers. This is enough to produce island-bridge sensors. First, tunnel cuts are used in the upper adhesive PET layer to trace the path of the interconnects; then the cut PET segments are peeled off, leaving behind the pattern of interconnects on the exposed Mylar surface.

Next, the entire plastic sheet is coated with gold (another conductive metal could be used as well). The remaining top PET layer is peeled away, leaving a Mylar surface with well-defined interconnects, as well as exposed metal openings and contact pads on the islands. Sensor elements are then attached to the contact pads. For electronic devices, such as resistors, a conductive paste and a common heat plate are used to secure the bond. Some lab-synthesized components, such as carbon nanotubes, can be applied directly to the pads without any heating. Once this step is done, the vinyl cutter uses through cuts to carve the sensor’s contours, including spirals, zigzags and other features. To demonstrate the technique, Xu and Lin developed a variety of stretchable elements and sensors. One mounts under the nose and measures human breath based on the tiny changes in temperatures it creates between the front and back of the sensor.

“For a breath sensor, you don’t want to something bulky,” Lin said. “You want something thin and flexible, almost like a tape beneath your nose, so you can fall asleep while it records a signal over a long period of time.”

Another prototype consists of an array of water-resistant supercapacitors, which store electrical power like a battery but release it more rapidly. Supercapacitors could provide power for some types of sensors.

“We could also make more complex sensors by adding capacitors or electrodes to make electrocardiogram measurements, or chip-sized accelerometers and gyroscopes to measure motion,” Xu said.

Size is sensor cutting’s one key limitation. Its smallest features are 200 to 300 micrometers wide, while photolithography can produce features that are tens of micrometers wide. But most wearable sensors do not require such fine features, Xu noted. The researchers believe this technique could one day become a standard feature in every lab studying wearable sensors or new diseases. Prototypes could be designed using high-powered computer-aided design (CAD) software or simpler apps made especially for vinyl printers. Other study authors are Kamyar Behrouzi, Peisheng He, Tao Jiang, Guangchen Lan, Ashley Lee, Yu Long, Yande Peng and Dongkai Wang.

Related

Source: University of Berkeley

Recent Posts

Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

19.10.2026
6
Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

15.10.2026
47
Supercapacitor LSM production

LS Materials Wins $51.5M AI Data Center Supercapacitor Order

13.10.2026
86
Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

Relaxor superlattice capacitors approach 99% efficiency

12.10.2026
31
Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

Toray Film Capacitor Enables 150°C Inverter Operation

9.10.2026
65
Silicon capacitors and integrated passives dossier cover

Silicon Capacitors and Integrated Passives Dossier Report 10/26

8.10.2026
66
Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

Panasonic Targets Space Thermal Design at SPCD 2026

8.10.2026
41
tungsten-bronze-ceramic-capacitor-stack

Tungsten bronze capacitors combine high κ and thermal stability

7.10.2026
39
Ruggedized passive component customization overview covering capacitors, resistors and inductors.

Ruggedized Passive Components: Reliability Beyond the Datasheet

6.10.2026
50

Upcoming Events

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

Oct 28
13:00 - 14:00 CDT

Inductor Design in a Multi-Phase Buck Converter

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved