Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

    YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

    TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

    Vishay Extends Power Inductors for DC/DC with 1212 Compact Case

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

    YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

    TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

    Vishay Extends Power Inductors for DC/DC with 1212 Compact Case

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Samsung Electro-Mechanics eyes new demand for capacitors in 5G era

5.12.2018
Reading Time: 3 mins read
A A

Source: The Korea Herald news

Company strives to make even smaller MLCCs for high-tech IT products, car components, IoT devices and 5G network.

RelatedPosts

YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

Samsung Electro-Mechanics, an electronic component affiliate of Samsung since 1973, had belatedly joined a Japan-led market for multilayer ceramic capacitors (MLCC) for electronics in 1986. But decades later, it is now seeking to lead the specific market with its signature nanotechnology and ultra-thin technology on new demand for the capacitors in the era of the fifth-generation network.

“It was a huge challenge for the company that used to make modules for TVs to develop capacitor technologies at the time,” said Lee Jong-ho, a master engineer at Samsung Electro-Mechanics, in an email interview with The Korea Herald.

Lee has been leading the development of MLCC technologies at the company since 2003. Under his leadership, the company rose to become the second biggest player in 2009 in the global market and has retained the position for nearly 10 years.

“MLCC requires highest-level technologies to handle sensitive materials and needs related cutting-edge equipment,” Lee said.

The capacitor, known as the tiniest part of electronics, is as thin as human hair — 0.4 millimeter by 0.2 millimeter — and at least 1,000 capacitors are needed for today’s smartphones per unit.

To the naked eye, the capacitors look like tiny particles that are even smaller than rice, but they are made of 500 to 600 layers of ceramic and nickel.

The capacitors’ role in electronics is to store power, supply needed amounts of power for chips, and remove noise inside products.

The secret to its rise to the world’s top two position is the firm’s flagship nanometer technology and ultra-thin technology, according to Lee.

“Samsung has the technology to handle power particles that are less than 10 nanometers to make super-thin dielectric layers and a heat process technology for high dielectric constant,” he said. “And the company is at the top in minimizing external electrodes in order to maximize use of the internal space of the MLCCs.”

To develop even thinner, smaller but larger-storage capacitors, Samsung is trying to apply new metals in addition to nickel, as a next-generation managerial for MLCCs.

“For MLCCs, a crucial material factor is to have endurance for temperature changes and direct current bias,” Lee said. “We are continuing to develop compounds that will improve the capacitors’ performance by looking at various substances.”

Beyond smartphones, TVs and home electronics, Samsung is expanding its business portfolio to the automotive sector to provide enhanced capacitors for car components. In September, the company announced a 500 billion won ($448.8 million) investment for its Tianjin plant, to build the automotive capacitor production line.

“For car components, MLCCs need to endure high temperatures of over 125 degrees Celsius and up to nine times of direct current bias,” he said. “We will need a new material technology that will control the power move in line with temperature changes and also a short-free design that will help absorb external shock.”

According to market researchers, the automotive MLCC market is expected to grow from 1 trillion won in 2017 to 8 trillion won by 2020, as car components for safety and entertainment features are increasingly being adopted by automakers.

Samsung Electro-Mechanics’ automotive MLCC sales are expected to soar 43 times to 1.3 trillion won by 2020, according to a forecast by Eugene Securities & Investment.

“We are also eyeing the upcoming 5G network market, to provide capacitors for servers at network stations and data centers,” Lee said.

featured image: Master engineer Lee Jong-ho explains MLCC technologies at the Samsung Electro-Mechanics headquarters in Suwon, Gyeonggi Province. (image credit: Samsung Electro-Mechanics)

 

By Song Su-hyun ([email protected])

Related

Recent Posts

YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

17.4.2026
3

Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

17.4.2026
2

Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

17.4.2026
4

YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

16.4.2026
31

Würth Elektronik Expanded Capacity for Validation and Services in Asia

16.4.2026
10

Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

16.4.2026
17

YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

16.4.2026
46

TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

16.4.2026
16

Vishay Extends Power Inductors for DC/DC with 1212 Compact Case

16.4.2026
16

Upcoming Events

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

Apr 22
17:00 - 17:30 CEST

Magnetics in a high frequency GaN era

Apr 22
17:00 - 18:00 CEST

Derating Tantalum, Film, and Ceramic Capacitors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • Plastic Materials Dielectric Constant and DF

    4 shares
    Share 4 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version