Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Transformer Safety IEC 61558 Standard

    ESR of Capacitors, Measurements and Applications

    Murata Christophe Pottier Appointed President of EPCIA

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    YAGEO Unveils Compact 2.4 GHz SMD Antenna

    KYOCERA AVX Releases Antenna for Iridium Satellite IoT Applications

    Molex Releases Industry-First Quad-Row Board-to-Board Connectors with EMI Shields

    Image credit: Samtec

    How to Match the Right Connector with Protocol Requirements

    Smoltek CNF-MIM Capacitors Pass 1,000h Reliability Test

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Transformer Safety IEC 61558 Standard

    ESR of Capacitors, Measurements and Applications

    Murata Christophe Pottier Appointed President of EPCIA

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    YAGEO Unveils Compact 2.4 GHz SMD Antenna

    KYOCERA AVX Releases Antenna for Iridium Satellite IoT Applications

    Molex Releases Industry-First Quad-Row Board-to-Board Connectors with EMI Shields

    Image credit: Samtec

    How to Match the Right Connector with Protocol Requirements

    Smoltek CNF-MIM Capacitors Pass 1,000h Reliability Test

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Samtec Presents High-Speed Twinax Cable for Flyover Assemblies

10.3.2025
Reading Time: 3 mins read
A A

Samtec unveils high-speed twinax cable for flyover assemblies, addressing the growing scrutiny of signal transmission characteristics on PCBs. As signal limits were reached, designers turned to high-speed twinax cable, enabling signal off-board configurations like the commercially introduced Samtec Flyover® system.

Samtec achieved commercial success with Flyover cable assemblies, prompting other vendors to follow suit. Fully dedicated to cable design and fabrication, Samtec continues to advance high-speed twinax cable with the introduction of Eye Speed® Hyper Low Skew Twinax.

RelatedPosts

How to Match the Right Connector with Protocol Requirements

Samtec Expands Offering of Slim, High-Density HD Array Connectors

Samtec Expands Connector Severe Environment Testing Offering

Understanding Skew’s Impact

Skew, a critical design concern for 224 Gbps PAM4, manifests as delay differences within a differential pair due to physical and electrical channel construction. Samtec conducted extensive R&D to assess the skew impact on both Flyover twinax and PCB traces.

Tightly coupled, co-extruded twinax cable with drainless shield construction, exemplified by the Eye Speed product family, offers superior skew performance (alongside impedance and insertion loss stability) even under realistic bending conditions. This allows skew to be precisely controlled by the implementer, unlike other manufacturing techniques for twinax cable that lack co-extrusion.

Across the industry, skew is under increased scrutiny due to its potential to cause excessive signal performance variation. Samtec’s R&D revealed that precisely constraining the conductors relative to each other can maintain signal stability. This is evident in Samtec’s Eye Speed® Twinax and Eye Speed Hyper Low Skew Twinax.

Eye Speed Hyper Low Skew Twinax, meticulously crafted to address the demanding requirements of 224 Gbps PAM4 applications, offers unparalleled high-speed performance extending up to 60+ GHz Nyquist frequencies. With a maximum intrapair skew of just 1.75 ps/m, Samtec’s Hyper Low Skew Twinax stands as the industry’s leading digital differential pair transmission line, delivering exceptional signal stability.

Compact Design

In the realm of cable management, system architects face significant challenges due to the intricate designs that incorporate tight bends, high flex cycles, and extensive temperature ranges. Samtec’s R&D team has addressed this concern by introducing innovative solutions. The release of 34 AWG (EyeSpeed ThinaxTM for 112 Gbps) and 32 AWG (for 224 Gbps Eye Speed® Twinax) cables has revolutionized cable management. These compact gauges facilitate easier routing through crowded systems, significantly enhancing system efficiency.

Design Flexibility

System architects design for a diverse array of complex and captivating applications. Sometimes, the cable/connector combination they require simply doesn’t exist. To cater to this demand, Samtec’s Sudden Service® initiative introduces a unique approach with Eye Speed cables. This innovative concept allows designers to specify the connector at each end of the cable assembly, providing a comprehensive mix-and-match option. Popular mixed-end designs include ExaMAX® to AcceleRate® and FQSFP-D8 to NovaRay®.

The mix-and-match strategy enables system architects to select Samtec high-speed cable solutions for various applications, including mid-board to mid-board, near-chip to front panel, and ASIC-adjacent to the backplane. Whether the cable assemblies are PCB-attach or Direct-attach, Samtec’s HDR Group, comprising knowledgeable Application Engineers, can propose and tailor solutions that meet the specific customer application requirements.

Currently, the EyeSpeed product family page offers the following cable types: 32 AWG EyeSpeed Hyper Low Skew Twinax for inside-the-box solutions, with 27 AWG in development for longer reach cabled backplane systems.

Related

Source: Samtec

Recent Posts

Molex Releases Industry-First Quad-Row Board-to-Board Connectors with EMI Shields

6.11.2025
8
Image credit: Samtec

How to Match the Right Connector with Protocol Requirements

6.11.2025
12

Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

30.10.2025
10

Samtec Expands Offering of Slim, High-Density HD Array Connectors

30.10.2025
10

binder expands M8 portfolio with 360° shielded cable connectors

29.10.2025
3

Molex Acquires Smiths Interconnect

21.10.2025
12

KYOCERA Releases Shielded Board-to-Board Connectors for Reliable EMI Protection

13.10.2025
32

Samtec Expands Connector Severe Environment Testing Offering

10.10.2025
9

Connector PCB Design Challenges

3.10.2025
51

Samtec Agreed with Molex Second-Source License on High-Speed Interconnects for Data Centers

18.9.2025
24

Upcoming Events

Nov 11
17:00 - 18:00 CET

Industrial Applications Demand More from Interconnects in Next-Gen Designs

Nov 12
11:00 - 12:00 CET

PCB Design: Impedance is for everyone!

Nov 12
November 12 @ 12:00 - November 13 @ 14:15 EST

Microelectronic Packaging Failure Modes and Analysis

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version