Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches

    SCHURTER Releases Compact SMT DIP Switches

    TDK and Nippon Chemical Launch Joint Venture for MLCC Materials

    Wk 14 Electronics Supply Chain Digest

    Bourns Releases Compact High Current Shielded Power Inductors

    March 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

    APEC 2026 Power Electronics Trends and Implications for Passive Components

    Hydra Enhances Film Capacitor Robustness by Novel Gel Filler

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches

    SCHURTER Releases Compact SMT DIP Switches

    TDK and Nippon Chemical Launch Joint Venture for MLCC Materials

    Wk 14 Electronics Supply Chain Digest

    Bourns Releases Compact High Current Shielded Power Inductors

    March 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

    APEC 2026 Power Electronics Trends and Implications for Passive Components

    Hydra Enhances Film Capacitor Robustness by Novel Gel Filler

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Screen-printed graphene ink micro-supercapacitors as a new approach to electronics and flexible devices

18.1.2019
Reading Time: 3 mins read
A A

Source: Chemistry World news

Researchers in China have developed an easy way to make complicated arrays of microsupercapacitors that involves screen-printing them out of graphene ink. The simplicity and freedom offered by the approach will aid the development of new approaches to electronics and flexible devices.

Although semiconductor components continue to shrink, not all of the parts of modern gadgets are as easy to miniaturise. Capacitors and batteries are particularly challenging given that they are complex and discrete bundles of different materials. Microsupercapacitors, a tiny relative of both of these components, can do similar jobs.

Now, scientists at the Chinese Academy of Sciences have come up with a screen-printing method using a multi-purpose graphene ink that quickly lays down multiple microsupercapacitors in a variety of shapes and as complicated arrays. The ink combines graphene and carbon black, both of which are conductive, with a polymer binder in a solvent, although the simplicity of the mixture belies the difficulty in finding the right composition. ‘Preparing inks with suitable electrical, electrochemical and rheological properties was one of the biggest challenges for printable integrated microsupercapacitors,’ emphasises Zhong-Shuai Wu, one of the principal investigators on the project. Importantly, the ink shows shear-thinning behaviour, like ketchup: as it’s applied, the force causes it to lose its viscosity so it flows easily, but as soon as the force is removed, it thickens and keeps its shape.

They applied the graphene ink to a substrate, such as glass or flexible PET plastic, using a patterned screen as a stencil. The resulting pattern includes all of the conductive parts of the device. ‘The graphene-based ink can act as the microelectrodes, metal-free current collectors and interconnects, simultaneously,’ Wu notes. The ink dries for 12 hours, and then an electrolyte gel is applied and allowed to solidify for a further 12 hours, at which point the device is ready to use.

Because the entire structure of the device can be laid out in one step, very complicated designs can be made with ease. Although a single microsupercapacitor supplies less than one volt, the researchers were able to integrate 130 of them in series, giving an output of over 100 volts. ‘Micro-robots and soft actuators based on dielectric elastomer require hundreds and even thousands of volts,’ says Wu. ‘High voltage operation increases the scope and usefulness of microsupercapacitors,’ agrees Francesca Iacopi, head of the integrated nanosystems lab at the University of Technology Sydney in Australia.

The supercapacitors are incredibly flexible

The devices are also flexible, if they’re printed on a flexible substrate, which should make them compatible with wearable electronics. ‘The versatility and low cost of this screen-print approach could be a plus in the wearable systems that are disposable, which is what most of the external health monitoring and other wearable systems are meant to be,’ says Iacopi. ‘I believe microsupercapacitors on flexible substrates like these would be particularly promising to support the area of wearable systems for health monitoring, for example sensors placed on skin and eyes.’

The investigators are keen use their method to make more complete devices, by including components that can harvest energy and store it in the microsupercapacitors, or put that stored energy to use. They also hope to use new electrolytes to increase the voltage each capacitor can provide, and improve the total energy a device can store.

References

X Shi et al, Energy Environ. Sci., 2019, DOI: 10.1039/c8ee02924e

 

featured image: The printing process takes seconds, and avoids expensive equipment and harsh conditions Source: vimeo, X Shi et al, Energy Environ. Sci., 2019, DOI: 10.1039/c8ee02924e

 

RelatedPosts

Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches

SCHURTER Releases Compact SMT DIP Switches

TDK and Nippon Chemical Launch Joint Venture for MLCC Materials

Related

Recent Posts

TDK and Nippon Chemical Launch Joint Venture for MLCC Materials

7.4.2026
8

March 2026 Interconnect, Passives and Electromechanical Components Market Insights

2.4.2026
56

APEC 2026 Power Electronics Trends and Implications for Passive Components

1.4.2026
78

Hydra Enhances Film Capacitor Robustness by Novel Gel Filler

1.4.2026
26

Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

31.3.2026
41

Samsung Introduces 35V MLCCs Flying Capacitors for USB PD Fast Charging

27.3.2026
35

New J‑STD‑075B Standard Elevates Process Sensitivity Classification for Passive and Solid-State Components

27.3.2026
54

Modelithics Expands COMPLETE+3D Library for Ansys HFSS

27.3.2026
9

Nanocrystalline Cores for Low‑Loss MHz Chip Inductors

25.3.2026
47

Upcoming Events

Apr 8
17:00 - 18:00 CEST

Trade Secrets of the Flyback Converter

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

May 5
16:00 - 17:00 CEST

Understanding and Selecting Capacitors – Fundamentals, Technologies and Latest Trends

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Plastic Materials Dielectric Constant and DF

    4 shares
    Share 4 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version