Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Transformer Design Optimization for Power Electronics Applications

    Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

    Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

    Lightweight Model for MLCC Appearance Defect Detection

    DMASS Reports First Positive Signs of European Distribution Market in Q3/25

    TAIYO YUDEN Releases 22uF MLCC in 0402 Size for AI Servers

    Wk 44 Electronics Supply Chain Digest

    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Transformer Design Optimization for Power Electronics Applications

    Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

    Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

    Lightweight Model for MLCC Appearance Defect Detection

    DMASS Reports First Positive Signs of European Distribution Market in Q3/25

    TAIYO YUDEN Releases 22uF MLCC in 0402 Size for AI Servers

    Wk 44 Electronics Supply Chain Digest

    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Self-gealing gel makes electronics more flexible

23.11.2015
Reading Time: 2 mins read
A A

source: Energy Harvesting Journal article

Researchers in the Cockrell School of Engineering at The University of Texas at Austin have developed a first-of-its-kind self-healing gel that repairs and connects electronic circuits, creating opportunities to advance the development of flexible electronics, biosensors and batteries as energy storage devices.

RelatedPosts

Transformer Design Optimization for Power Electronics Applications

Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

Although technology is moving toward lighter, flexible, foldable and rollable electronics, the existing circuits that power them are not built to flex freely and repeatedly self-repair cracks or breaks that can happen from normal wear and tear. Until now, self-healing materials have relied on application of external stimuli such as light or heat to activate repair. The UT Austin “supergel” material has high conductivity (the degree to which a material conducts electricity) and strong mechanical and electrical self-healing properties.

“In the last decade, the self-healing concept has been popularized by people working on different applications, but this is the first time it has been done without external stimuli,” said mechanical engineering assistant professor Guihua Yu, who developed the gel. “There’s no need for heat or light to fix the crack or break in a circuit or battery, which is often required by previously developed self-healing materials.” Yu and his team created the self-healing gel by combining two gels: a self-assembling metal-ligand gel that provides self-healing properties and a polymer hydrogel that is a conductor.

A paper on the synthesis of their hydrogel appears in the November issue of Nano Letters. In this latest paper, the researchers describe how they used a disc-shaped liquid crystal molecule to enhance the conductivity, biocompatibility and permeability of their polymer hydrogel. They were able to achieve about 10 times the conductivity of other polymer hydrogels used in bioelectronics and conventional rechargeable batteries. The nanostructures that make up the gel are the smallest structures capable of providing efficient charge and energy transport.

In a separate paper published in Nano Letters in September, Yu introduced the self-healing hybrid gel. The second ingredient of the self-healing hybrid gel is a metal-ligand supramolecular gel. Using terpyridine molecules to create the framework and zinc atoms as a structural glue, the molecules form structures that are able to self-assemble, giving it the ability to automatically heal after a break. When the supramolecular gel is introduced into the polymer hydrogel, forming the hybrid gel, its mechanical strength and elasticity are enhanced. To construct the self-healing electronic circuit, Yu believes the self-healing gel would not replace the typical metal conductors that transport electricity, but it could be used as a soft joint, joining other parts of the circuit. “This gel can be applied at the circuit’s junction points because that’s often where you see the breakage,” he said. “One day, you could glue or paste the gel to these junctions so that the circuits could be more robust and harder to break.” Yu’s team is also looking into other applications, including medical applications and energy storage, where it holds tremendous potential to be used within batteries to better store electrical charge. Yu’s research has received funding from the National Science Foundation, the American Chemical Society, the Welch Foundation and 3M.

image: University of Texas at Austin

Related

Recent Posts

Murata and QuantumScape Joint Development for Solid Batteries Ceramic Separators

14.10.2025
36

Researchers Demonstrated High Energy Ceramic Capacitors Stable in Wide Temperature Range

2.10.2025
29

Improving SMPS Performance with Thermal Interface Material

30.9.2025
13

Flaked Tantalum Powders: High Capacitance Powders for High Reliable Tantalum Capacitors

29.9.2025
30

Life Cycle Assessment of a Graphene-Based Supercapacitor

26.9.2025
22

Advancements in Flexible End Terminations for Robust MLCCs in EV

26.9.2025
51

Johnson’s Approximation Modeling Improves Understanding of MLCC Dielectrics Voltage Dependence

26.6.2024
88

Murata Utilizes its Ceramic Capacitor Expertise to Produce Precious Metal Free Gas Catalyst Material 

15.4.2024
85

Heraeus Electronics Expands Electronic Inks Portfolio Through Acquisition of PriElex

8.3.2024
184

Advancing Electrochemical Properties of Metal Oxides for Supercapacitor Electrodes

5.2.2024
38

Upcoming Events

Nov 4
November 4 @ 12:00 - November 6 @ 14:15 EST

Wirebond Materials, Processes, Reliability and Testing

Nov 6
14:30 - 16:00 CET

Self-healing polymer materials for the next generation of high-temperature power capacitors

Nov 11
17:00 - 18:00 CET

Industrial Applications Demand More from Interconnects in Next-Gen Designs

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version