Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Smoltek Boosts its CNF-MIM Capacitance Density by 230 percent

26.9.2024
Reading Time: 2 mins read
A A

Smoltek Nanotech Holding AB reports significant advances in wafer-based carbon nano-fiber CNF-MIM capacitor technology with a 230% boost in capacitance density through a new dielectric stack based on zirconium oxide.

Smoltek Semi, the group company driving Smoltek’s semiconductor business area, has spent the last nine months working intensively on a project to develop a new dielectric stack for its CNF-MIM capacitor technology.

RelatedPosts

Smoltek CNF-MIM Capacitors Hit 1,000x Lower Leakage

Smoltek CNF-MIM Capacitors Pass 1,000h Reliability Test

Smolteks CNF-MIM Capacitors Meet Thermal and Voltage Stability Industry Requirements

The first phase of this project has now concluded successfully, demonstrating significant improvements over the previous generation of dielectric stacks. The new stack, based on zirconium oxide, will be integrated into future generations of CNF-MIM capacitors. The prior stack, made from hafnium oxide, was utilized in the Gen Zero capacitors.

”The newly developed dielectric stack is a blend of two oxides: a high-k oxide to boost capacitance density, and an oxide that serves as a barrier against charge movement, thus minimizing current leakage”, explains Farzan Ghavanini, CTO at Smoltek.

During the first phase, Smoltek Semi focused on parallel plate capacitors, depositing the dielectric stack on flat surfaces between two parallel electrodes. Performance measurements were carried out at the wafer level and after the devices were transferred and mounted onto PCBs. The results revealed an extraordinary 230% improvement in capacitance density compared to the Gen Zero dielectric stack, while another critical performance metric, leakage current, showed a 50% reduction.

”The results have been outstanding, both in terms of performance metrics and reproducibility. I’m particularly excited about the exceptional reproducibility achieved during the first phase, where we reached a fabrication yield of 100%”, Farzan adds.

The devices mounted on PCBs have now been sent to Yageo who is supporting Smoltek with reliability testing and further characterization.

The second phase of the project, which began after the summer, will focus on depositing the new dielectric stack onto Smoltek’s carbon nanofibers, aiming to demonstrate that the improvements can be fully utilized in a CNF-MIM structure.

Related

Source: Smoltek

Recent Posts

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

4.9.2026
8

Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

4.9.2026
6

Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

3.9.2026
32

KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

3.9.2026
17

KEMET HRA X7R High-Reliability MLCCs Target Higher Capacitance in Defense and Aerospace Electronics

1.9.2026
37

Filter Capacitors in Electric Vehicles: Knowles Safety MLCCs for BMS and Isolated DC/DC Converters

28.8.2026
44

YAGEO Expands Aluminum Polymer Capacitors for High-Temperature AI Server Power Rails

28.8.2026
60

Modelithics COMPLETE v26.4 Expands RF Passive Models for Keysight ADS

28.8.2026
13

Murata Launches 100V 10 µF Lead-Type MLCCs for 48V Systems

27.8.2026
50

Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved