Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK HVC28 and HVC29 high-voltage DC contactors with black housings and main power terminals

    TDK Introduces Gas-Filled High-Voltage DC Contactors up to 600 A

    Murata SWL RF coaxial switch connector measurement diagram and SWL-to-SWJ board-area comparison.

    Murata RF Switch Connectors Cut PCB Test-Point Area

    Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

    Mathematical state-space illustration of a series-connected memcapacitor oscillator with two constrained memory coordinates

    Memcapacitor chaos in a six-state series-connected model

    Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

    Exxelia Brings High-Temperature Passives to Electronica 2026

    IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

    Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

    Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

    Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

    Bourns Releases 450 V Power TVS for DC Bus Clamping

    MLCC construction image

    Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK HVC28 and HVC29 high-voltage DC contactors with black housings and main power terminals

    TDK Introduces Gas-Filled High-Voltage DC Contactors up to 600 A

    Murata SWL RF coaxial switch connector measurement diagram and SWL-to-SWJ board-area comparison.

    Murata RF Switch Connectors Cut PCB Test-Point Area

    Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

    Mathematical state-space illustration of a series-connected memcapacitor oscillator with two constrained memory coordinates

    Memcapacitor chaos in a six-state series-connected model

    Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

    Exxelia Brings High-Temperature Passives to Electronica 2026

    IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

    Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

    Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

    Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

    Bourns Releases 450 V Power TVS for DC Bus Clamping

    MLCC construction image

    Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Smoltek Signs MoU for its CNF-MIM Capacitor Manufacturing Joint Venture

30.6.2022
Reading Time: 4 mins read
A A

Smoltek Nanotech Holding AB (“Smoltek”) announces that the Group company Smoltek Semi AB (“Smoltek Semi”) has signed a Memorandum of Understanding (MoU) with a global manufacturer of capacitors for the joint development of Smoltek’s ultra-thin CMF-MIM capacitors and, provided that the development goals are achieved, mass production and sales via a 50/50-owned joint venture.

The MoU that the two parties have now signed relates to the joint development of a capacitor product and the industrial mass production process for Smoltek’s patented, ultra-thin carbon nanofiber (CNF-MIM) capacitors. The initial part of the project will be defined in a Joint Development Agreement (JDA), where 1.5 million USD will be paid to Smoltek Semi for continued development work when the development agreement has been signed. The MoU also refers to the potential formation of a 50/50-owned joint venture which, if it is formed, will receive a license for mass production and sales of CNF-MIM capacitors in the discrete capacitors segment. The capacitor manufacturer has, in the event of the joint venture being formed, undertaken to take responsibility for the day-to-day operations of the planned joint venture, as well as to invest a total of 3.5 million USD in the development project, of which 1.5 million USD will be paid to Smoltek Semi when the planned Joint Development Agreement (JDA) for the initial part of the project has been signed.

RelatedPosts

Smoltek CNF-MIM Capacitors Hit 1,000x Lower Leakage

Smoltek CNF-MIM Capacitors Pass 1,000h Reliability Test

Smolteks CNF-MIM Capacitors Meet Thermal and Voltage Stability Industry Requirements

Smoltek Semi has been collaborating with a global manufacturer of passive components for the evaluation of Smoltek’s patented technology platform, which enables manufacturing of ultra-thin carbon nanofiber capacitors, since 2020. The evaluation license agreement for this collaboration has been gradually extended, most recently to the end of June 2022, with the purpose to reach an agreement on the terms of the MoU which has now been signed.

The MoU means that Smoltek Semi and the capacitor manufacturer have now agreed on the overall terms and initial financing to bring Smoltek’s patented CNF-MIM technology for ultra-thin capacitors to market in the discrete capacitors segment, and to mass-produce and sell these capacitors via a 50/50-owned joint venture.

“This agreement with a global capacitor manufacturer is a historic milestone for Smoltek. We now have a perfect partner in place to complete a competitive product and industrial mass production process for our ultra-thin CNF-MIM capacitors. Given that we succeed in this, the joint venture that we plan to start will have excellent conditions to take a significant share of the market for decoupling capacitors by utilizing our partner’s established network in the semiconductor industry. I am very proud of Smoltek’s entire team that has made it possible to take such an important step closer to our goal of becoming an innovative industrial company based on our patented nanotechnology platform,” says Smoltek’s CEO Håkan Persson.

More about the MoU and the way forward 
The MoU defines two phases, of which Phase 1 begins after negotiations and signing of a Joint Development Agreement (JDA) which will regulate the parties’ responsibilities and commitments. The JDA is expected to be signed in the near future and Phase 1 is expected to be completed during the second half of 2023.

Phase 1 includes product development and industrial process development for discrete CNF-MIM capacitors. The capacitor manufacturer will invest 1.5 million USD at the start of phase 1, while Smoltek Semi’s corresponding investment consists of the carbon growth machine which the company has ordered, as communicated in a press release on March 21 2022, as well as product development and process development at the contract manufacturer.

Phase 2 will begin when a number of predetermined conditions for the performance of the discrete CNF-MIM capacitors have been met. During phase 2, Smoltek Semi and the manufacturer plan to form a joint venture, with each party owning 50 percent. According to the MoU, this joint venture will receive a license from Smoltek for mass production and sales of discrete CNF-MIM capacitors. Commercial and financial terms for the license will be negotiated and decided in connection with the formation of the joint venture. The manufacturer undertakes to initially invest 1.5 million USD in the joint venture, and approximately an additional 0.5 million USD related to production equipment. Smoltek Semi’s corresponding commitment to invest in the joint venture consists of additional investments in production equipment for industrial carbon growth and additional investments in process development. Given that the joint venture is formed, the parties will negotiate regarding additional financing and terms related to running the operating company, as well as the terms for the license mentioned above.

Smoltek’s targets for 2027 for the company’s ultra-thin capacitors 
The MoU with a global manufacturer of capacitors is in line with the company’s strategic goals for 2027, as well as the phases and interim goals that remain to achieve these goals, as described in a press release published on May 5, 2022. Smoltek recommends stakeholders who want more information about the company’s overall development from an innovation company to an innovation-driven industrial company to read this press release.

Related

Source: Smoltek

Recent Posts

Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

28.10.2026
12
Mathematical state-space illustration of a series-connected memcapacitor oscillator with two constrained memory coordinates

Memcapacitor chaos in a six-state series-connected model

28.10.2026
5
Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

Exxelia Brings High-Temperature Passives to Electronica 2026

29.10.2026
13
Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

27.10.2026
12
MLCC construction image

Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

26.10.2026
35
Samsung Electro-Mechanics MFC molded frame ceramic capacitor with epoxy encapsulation and external metal frame

Samsung 100V Molded Frame MLCC Targets 48V AI Server PSUs

26.10.2026
21
TDK B3201 series Y1 film safety capacitors with rectangular cases and parallel wire leads

TDK Introduces Y1 Film Safety Capacitors for 500 V AC EMI Filtering

21.10.2026
31
Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

19.10.2026
12
Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

15.10.2026
71

Upcoming Events

Nov 24
16:00 - 17:00 CET

Select the Correct Components for Your DC/DC Converter

Dec 1
16:00 - 17:00 CET

Developing low-noise mixed-signal systems

Dec 8
16:00 - 17:00 CET

WE-CCMF: Design Principles, Layout Guidelines and Measurement Results for High-Speed EMI Filtering

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved