Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Paumanok Releases Capacitor Foils Market Report 2025-2030

    Modelithics Welcomes CapV as a Sponsoring MVP

    Wk 40 Electronics Supply Chain Digest

    Benefits of Tantalum Powder Stress–Strain Curve Evaluation vs Conventional Wet Test

    Electrolyte Selection and Performance in Supercapacitors

    Connector PCB Design Challenges

    Researchers Demonstrated High Energy Ceramic Capacitors Stable in Wide Temperature Range

    Stackpole Offers High Voltage Plate Resistors up to 40KV

    How to Manage Supercapacitors Leakage Current and Self Discharge 

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Paumanok Releases Capacitor Foils Market Report 2025-2030

    Modelithics Welcomes CapV as a Sponsoring MVP

    Wk 40 Electronics Supply Chain Digest

    Benefits of Tantalum Powder Stress–Strain Curve Evaluation vs Conventional Wet Test

    Electrolyte Selection and Performance in Supercapacitors

    Connector PCB Design Challenges

    Researchers Demonstrated High Energy Ceramic Capacitors Stable in Wide Temperature Range

    Stackpole Offers High Voltage Plate Resistors up to 40KV

    How to Manage Supercapacitors Leakage Current and Self Discharge 

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Solder Paste Volume

12.9.2021
Reading Time: 3 mins read
A A

The solder paste volume on the PCB surface will be determined by the thickness and area of the stencil opening. Stencil thickness is in the 100 to 200 micron range, and the area will depend on the PCB design. Typical stencil apertures are shown in Figure 2.88.

Fig. 2.88: Typical stencil apertures

Apertures 1 & 2 are typical for THR printing.
Aperture 3 is used when extra solder paste is needed.
Aperture 4 (paste reducer) is used for large PCB PTHs to prevent the solder paste from dropping through the PTH.
Aperture 5 is commonly used when double printing, top and bottom of the PCB, to add additional solder paste to meet the solder requirement.

RelatedPosts

Polymer Materials and Processing

What is RF Connector

Connector Materials and Processes

Typical PCB pad dimensions are shown in Figure 2.89, where Tb is the PCB thickness, generally 1.6 mm, Dd is the drilled hole diameter (not shown), Dh is the PCB PTH. Dh = Dp + 0.3 mm, where Dp is the pin diameter (shown in Figure 2.89) and Dsp is the solder pad diameter = Dh + 0.5 mm to 0.8 mm.

Fig. 2.89: PCB pad dimensions
Fig. 2.90: Pin diameter

The stencil area, as shown in Figure 2.91, in combination with the stencil thickness (Ts), determines the solder paste volume on the surface of the PCB. Ideally, when an overprint is not necessary, the stencil diameter (Ds ) = Dsp – 0.1 in order to guarantee a perfect paste deposition on the solder pad.

Fig. 2.91: Stencil dimensions

As noted previously, the solder paste consists of approximately 50 percent of the volume of solder particles and 50 percent of the soldering flux volume. The optimum solder particle size depends on the pitch of the PCB pads and on the thickness of the stencil. If the particle size is too large, as per Figure 2.92, the effective solder volume will be reduced.

Fig. 2.92: Effect of the solder particle size on stencil fill

If the solder particle size is too small, viscosity issues may arise, thus affecting the retention of the solder paste in the stencil. The most commonly used solder particle size is in the range of 20 to 45 microns. JEDEC STD-005 covers soldering paste requirements. The pin geometry, square, round or rectangular, may also impact the stencil fill and the solder volume.

Related

Source: Wurth elektronik

Recent Posts

Connector PCB Design Challenges

3.10.2025
17

Non-Magnetic Interconnects

23.4.2025
27

10 Tips for Ensuring Reliability of Discrete Wire Assemblies

20.2.2025
55

Polymer Materials and Processing

11.8.2025
55

Basic PCB Technology Overview

1.7.2025
23

What is RF Connector

17.12.2024
14

Creepage and Clearance of Connector

25.7.2025
24

Microwave Multi Line Connectors Mounting and Handling Precautions

11.8.2025
3

BASIC PCB Design Rules – Layout

1.7.2025
35

MEMR RF Relay for Space Compact Redundancy Ring

17.12.2024
3

Upcoming Events

Oct 8
11:00 - 12:00 CEST

PCB Online Shop – simply “Made in Germany” by Würth Elektronik

Oct 14
16:00 - 17:00 CEST

Smart Sensors, Smarter AI: Building Reliable Edge Systems

Oct 17
12:00 - 14:00 EDT

External Visual Inspection per MIL-STD-883 TM 2009

Oct 20
October 20 - October 23

Digital WE Days 2025 – Virtual Conference

Oct 21
October 21 @ 12:00 - October 23 @ 14:15 EDT

Space and Military Standards for Hybrids and RF Microwave Modules

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • Flying Capacitors Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Premium Suppliers

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version