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    Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

    Mathematical state-space illustration of a series-connected memcapacitor oscillator with two constrained memory coordinates

    Memcapacitor chaos in a six-state series-connected model

    Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

    Exxelia Brings High-Temperature Passives to Electronica 2026

    IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

    Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

    Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

    Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

    Bourns Releases 450 V Power TVS for DC Bus Clamping

    MLCC construction image

    Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

    Samsung Electro-Mechanics MFC molded frame ceramic capacitor with epoxy encapsulation and external metal frame

    Samsung 100V Molded Frame MLCC Targets 48V AI Server PSUs

    SCHURTER EKO square-body DC fuse variants with ceramic bodies and different metal terminal arrangements

    SCHURTER EKO DC Fuses Extend to 1500 V and 2000 A

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    Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

    Mathematical state-space illustration of a series-connected memcapacitor oscillator with two constrained memory coordinates

    Memcapacitor chaos in a six-state series-connected model

    Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

    Exxelia Brings High-Temperature Passives to Electronica 2026

    IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

    Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

    Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

    Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

    Bourns Releases 450 V Power TVS for DC Bus Clamping

    MLCC construction image

    Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

    Samsung Electro-Mechanics MFC molded frame ceramic capacitor with epoxy encapsulation and external metal frame

    Samsung 100V Molded Frame MLCC Targets 48V AI Server PSUs

    SCHURTER EKO square-body DC fuse variants with ceramic bodies and different metal terminal arrangements

    SCHURTER EKO DC Fuses Extend to 1500 V and 2000 A

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
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STMicroelectronics Introduces High-Performance GaN Family for Automotive Applications

7.5.2021
Reading Time: 2 mins read
A A

New product family to combine Power GaN with intelligence for smaller and more highly integrated system solutions for the EV era. STi2GaN offering to include solutions for On-Board Chargers, LiDAR for autonomous driving, bidirectional DC-DC converters, Class-D amplifiers, and power-conversion systems with new architecture and requirements for passive components.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has announced a new family of ST Intelligent and Integrated Gallium Nitride (GaN) solutions, STi2GaN.

RelatedPosts

Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

Memcapacitor chaos in a six-state series-connected model

Exxelia Brings High-Temperature Passives to Electronica 2026

STi2GaN is an innovative and unique offering combining power and intelligence in compact, high-performance solutions required by the automotive industry as it shifts to electrified platforms.

Building on ST’s leadership and strong automotive experience, innovations in Smart Power technology, wide bandgap semiconductor materials and packaging expertise, the STi2GaN family combines a monolithic power stage along with drivers and protections in GaN technology as well as System-in-Package (SiP) solutions for application-specific ICs with additional processing and control circuitry. The STi2GaN solutions use ST’s novel bond-wire-free packaging technology to provide high robustness, reliability, and performance.

“STi2GaN continues ST’s long success story in compound materials and Smart Power product innovation, targeting mainly automotive applications and the needs of high-density, high-reliability and high-power. Initial offering of STi2GaN solutions suit On-Board Chargers, LiDAR for autonomous driving, bidirectional DC-DC converters, Class-D amplifiers and power conversion systems,” said Alfio Russo, Group VP and GM Low Voltage and STi2GaN Solutions Macro Division, STMicroelectronics.

“The new product family aims to leverage the high-power density and efficiency of GaN to offer an industry-unique range of devices in 100V and 650V clusters that ensure scalability, compactness, and outstanding performance.”

Related

Source: STMicroelectronics

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