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    Transformer Losses and Thermal Design: Modelling and Validation

    DMASS Europe Q3 2026 electronic component distribution market overview

    European Component Distribution Jumps 42.7% in Q3 2026

    Bourns MSF series four-terminal current-sense shunt resistor with radial PCB terminals

    Bourns Introduces Four-Terminal Shunt Resistors for Current Sensing

    Würth Elektronik WE-SLSP SMT common-mode choke with a square package and four terminals.

    Würth Elektronik Releases Common-Mode Chokes for 100 V Data and Power Lines

    Assorted electronic connectors for USB, audio, video and power interfaces

    Top 10 Connector Manufacturers 2025: Amphenol Takes the Lead

    Samtec AcceleRate mP UDM6 and UDF6 board-to-board connectors with signal-contact arrays and power blades

    Samtec AcceleRate mP 10 mm Signal and Power Connectors

    Schematic diagrams illustrating the physical model of the stripline microinductor.

    Stripline Microinductors with Nickel–Iron Oxide Cores

    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

    Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

    Bourns Releases Power Resistor Adds Reverse-Pin Configuration

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    Transformer Losses and Thermal Design: Modelling and Validation

    DMASS Europe Q3 2026 electronic component distribution market overview

    European Component Distribution Jumps 42.7% in Q3 2026

    Bourns MSF series four-terminal current-sense shunt resistor with radial PCB terminals

    Bourns Introduces Four-Terminal Shunt Resistors for Current Sensing

    Würth Elektronik WE-SLSP SMT common-mode choke with a square package and four terminals.

    Würth Elektronik Releases Common-Mode Chokes for 100 V Data and Power Lines

    Assorted electronic connectors for USB, audio, video and power interfaces

    Top 10 Connector Manufacturers 2025: Amphenol Takes the Lead

    Samtec AcceleRate mP UDM6 and UDF6 board-to-board connectors with signal-contact arrays and power blades

    Samtec AcceleRate mP 10 mm Signal and Power Connectors

    Schematic diagrams illustrating the physical model of the stripline microinductor.

    Stripline Microinductors with Nickel–Iron Oxide Cores

    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

    Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

    Bourns Releases Power Resistor Adds Reverse-Pin Configuration

    Trending Tags

    • Ripple Current
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STMicroelectronics Introduces High-Performance GaN Family for Automotive Applications

7.5.2021
Reading Time: 2 mins read
A A

New product family to combine Power GaN with intelligence for smaller and more highly integrated system solutions for the EV era. STi2GaN offering to include solutions for On-Board Chargers, LiDAR for autonomous driving, bidirectional DC-DC converters, Class-D amplifiers, and power-conversion systems with new architecture and requirements for passive components.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has announced a new family of ST Intelligent and Integrated Gallium Nitride (GaN) solutions, STi2GaN.

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Transformer Losses and Thermal Design: Modelling and Validation

European Component Distribution Jumps 42.7% in Q3 2026

Bourns Introduces Four-Terminal Shunt Resistors for Current Sensing

STi2GaN is an innovative and unique offering combining power and intelligence in compact, high-performance solutions required by the automotive industry as it shifts to electrified platforms.

Building on ST’s leadership and strong automotive experience, innovations in Smart Power technology, wide bandgap semiconductor materials and packaging expertise, the STi2GaN family combines a monolithic power stage along with drivers and protections in GaN technology as well as System-in-Package (SiP) solutions for application-specific ICs with additional processing and control circuitry. The STi2GaN solutions use ST’s novel bond-wire-free packaging technology to provide high robustness, reliability, and performance.

“STi2GaN continues ST’s long success story in compound materials and Smart Power product innovation, targeting mainly automotive applications and the needs of high-density, high-reliability and high-power. Initial offering of STi2GaN solutions suit On-Board Chargers, LiDAR for autonomous driving, bidirectional DC-DC converters, Class-D amplifiers and power conversion systems,” said Alfio Russo, Group VP and GM Low Voltage and STi2GaN Solutions Macro Division, STMicroelectronics.

“The new product family aims to leverage the high-power density and efficiency of GaN to offer an industry-unique range of devices in 100V and 650V clusters that ensure scalability, compactness, and outstanding performance.”

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Source: STMicroelectronics

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