Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

TAIYO YUDEN Expands Its Product Line -up of 3225- Size Medium -to-High Voltage Capacitors

12.4.2018
Reading Time: 2 mins read
A A

Source: Taioy Yuden news

Achievement of a capacitance of 10 μF, approximately twice as large as that of our conventional product, at a rated voltage of 100 V.
TOKYO, March 29, 2018 — TAIYO YUDEN CO., LTD. announced today the commercialization of the medium-to-high voltage multilayer ceramic capacitor, HMK325AC7106KMHPE ( 3.2 x
2.5 x 2.5 mm, with a capacitance of 10μF and a rated voltage of 100 V).

RelatedPosts

ECIA Industry Pulse Moderates as Passive Lead Times Tighten

LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

This product is suitable for input capacitors of DC-DC convertors in power supply circuits used in industrial equipment such as base station communication devices and servers. The sophisticated material technology TAIYO YUDEN has nurtured enables the product to achieve a capacitance of 10 μF, which is approximately twice as large as that of the company’s conventional product, HMK325 C7475KMHPE (3.2 x 2.5 x 2.5 mm, with a capacitance of 4.7μF and a rated voltage of 100 V).

Production of this multilayer ceramic capacitor will commence at the company’s Tamamura Plant (Tamamura-machi, Sawa-gun, Gunma Prefecture, Japan) from March 2018 at a production rate of one million units per month, with a sample price of 100yen per unit.

Technology Background
The introduction of 5th generation mobile communications systems (5G), which have been awaited as the next generation of mobile communications systems, has resulted in an expected increase in investment in an installation of new base station communication devices going forward. Additionally, the quantity of servers and data centers functioning as ICT infrastructure has been increasing. In these devices, capacitors with a rated voltage of 100 V are used for reliability oriented design. In addition, there is increasing demand for a reduction in the number of electronics
parts in line with downsizing trends.

To address these market needs, TAIYO YUDEN has sophisticated its material technology to develop a medium-to-high voltage multilayer ceramic capacitor, in which a capacitance of 10 μF, approximately twice as large as that of its conventional product, has been achieved at a rated voltage of 100 V. TAIYO YUDEN will continue to downsize medium-to-high voltage multilayer ceramic capacitors to realize smaller devices.

Application

  • Input capacitors for DC-DC convertors in the power supply circuit used in industrial equipment such as base station communication devices and servers

Related

Recent Posts

LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

10.9.2026
3

Emerging Capacitor Markets in Fusion Energy

10.9.2026
3
onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

9.9.2026
39
Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

9.9.2026
8

SCHURTER THT DIP Switches Support Hardware-Level Configuration

9.9.2026
2
TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

9.9.2026
6
Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

9.9.2026
10
Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

8.9.2026
3
Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

7.9.2026
19

Upcoming Events

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Nov 24
16:00 - 17:00 CET

Component selection with the WE REDEXPERT® DC-DC Converter Designer Tool

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved