Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Overvoltage and Transient Protection for DC/DC Power Modules

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Littelfuse Releases TMR Switches with Ultra-Low Power Magnetic Sensing

    Skeleton Opens SuperBattery Factory in Finland 

    Kyocera Releases Ultra-Compact Low Voltage Clock Oscillators

    Murata Expands High Rel NTC Thermistors in Compact 0603M Size

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Wk 45 Electronics Supply Chain Digest

    Transformer Safety IEC 61558 Standard

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Overvoltage and Transient Protection for DC/DC Power Modules

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Littelfuse Releases TMR Switches with Ultra-Low Power Magnetic Sensing

    Skeleton Opens SuperBattery Factory in Finland 

    Kyocera Releases Ultra-Compact Low Voltage Clock Oscillators

    Murata Expands High Rel NTC Thermistors in Compact 0603M Size

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Wk 45 Electronics Supply Chain Digest

    Transformer Safety IEC 61558 Standard

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Tantalum Capacitor Technology Advantages for Harsh Environment

24.9.2025
Reading Time: 4 mins read
A A

The paper “Tantalum Capacitor Technology Advantages for Harsh Environment” was presented by Michel Bouvier, Vishay Europe, Le Pecq, France at the 5th PCNS Passive Components Networking Symposium 9-12th September 2025, Seville, Spain as paper No. 1.2.

Introduction

Vishay has continuously developed advanced tantalum capacitor technologies to address the challenges of harsh environments such as aerospace, military, space, underwater, and critical industrial applications. Environments with extreme temperatures, high mechanical stresses, and severe electrical conditions demand components with exceptional reliability.

RelatedPosts

Vishay Releases Space-Grade 150 W 28V Planar Transformers

Vishay Unveils SMD 1200V PTC Thermistors in Compact Size

Vishay Releases Automotive TO-220 Case 50W Thick Film Power Resistor

Traditional commercial capacitors often fail under such conditions, prompting the need for enhanced material selection, refined manufacturing processes, and protective packaging solutions.

Vishay’s innovations—from advanced anode technologies to MAP packaging and hermetic designs—provide robust performance, long-term reliability, and low DC leakage.

Key Points

  • Advanced Tantalum anode technology using liquid delubrication, magnesium deoxidation, beveled pellet pressing, and welded wire attachment.
  • Defect-free Ta₂O₅ dielectric formation resulting in low DC leakage and improved reflow resistance.
  • MAP (Multiple Array Packaging) technology delivers ~40% increased capacitive volume with stable MSL performance.
  • HiRel screening and statistical DCL methods ensure high reliability under life testing.
  • Hermetically sealed polymer and wet tantalum capacitors provide enhanced stability in extreme conditions.
  • Specialized solutions for high temperature, mechanical stress, and mission-specific harsh environment applications.

Extended Summary

Vishay’s approach to harsh-environment capacitors begins with technological enhancements at the anode level. The company introduced top-down pressed beveled pellets, which solve the common issue of corner weaknesses in polymer-coated capacitors. This geometry ensures uniform cathode coverage, reducing short failures. Liquid delubrication replaces traditional high-temperature burn-out methods, reducing carbon residuals from ~300 ppm to ≤30 ppm, enabling the formation of defect-free Ta₂O₅ dielectric films. Magnesium deoxidation further enhances the dielectric’s integrity by lowering oxygen content, optimizing reliability and performance under stress.

Welded anode wire attachment strengthens mechanical connections, mitigating failures during thermal reflow. Vishay has also implemented Shell Formation, a process that creates a thicker dielectric layer on the anode’s outer surface to endure thermo-mechanical and electrical stress during soldering and testing.

Packaging innovations play a central role. The MAP (Multiple Array Packaging) technology allows for approximately 40% higher volumetric efficiency than traditional molded packaging, without sacrificing Moisture Sensitivity Level ratings. This brings advantages in module assembly, weight reduction, and improved high-frequency performance. Hermetic solutions, such as the T27 vPolyTan™ series, provide additional protection against conductive polymer degradation from thermo-oxidation, ensuring long-term parametric stability.

Reliability is reinforced through Vishay’s comprehensive testing and screening regime. Processes include reflow conditioning, surge current testing, accelerated voltage conditioning, thermal shock, and patented statistical DC Leakage (DCL) screening at elevated temperature and voltage. Life test results demonstrate that Vishay polymer capacitors maintain stable DCL values over 10,000 hours, while competitors often show increased leakage and early failures.

The company also addresses extreme temperature requirements. Tantalum MnO₂ capacitors can operate up to 200°C, making them suitable for oil drilling and aerospace applications. Polymer capacitors are typically rated for up to 125°C, with some limited solutions for 150°C, supporting automotive AEC-Q200 environments. Wet tantalum capacitors remain the choice for very high-temperature, high-voltage designs beyond 150°C.

Mechanical stress resilience is critical for applications like space launchers and oil drilling. Vishay products undergo rigorous vibration and shock testing, with hermetic and vibration-proven enclosures like T27 and T22/T24 ensuring electrical parameter stability even under 53G random vibration or 1000G shocks.

For failure-rate assessments, polymer tantalum capacitors exhibit such low intrinsic failure mechanisms that traditional 100% FR grading is not practical. Instead, lot-based accelerated testing is used under MIL-PRF-32700 guidelines, with Arrhenius and Prokopowicz-Vaskas models applied to calculate acceleration factors for temperature and voltage stress.

Conclusion

Vishay’s advanced Tantalum capacitor technology offers a complete solution for demanding, harsh-environment applications. By combining defect-free anode fabrication, innovative packaging such as MAP, hermetic sealing, and rigorous testing protocols, the company delivers components with exceptional stability, low DC leakage, and long service life. These innovations not only exceed industry reliability standards but also reduce system-level risk in critical missions. Future progress will focus on extending temperature ranges, improving lifetime performance, and working closely with system designers to achieve optimal solutions for the most challenging environments.

1_2_Vishay PCNS 2025 PaperDownload

Related

Source: PCNS

Recent Posts

Overvoltage and Transient Protection for DC/DC Power Modules

13.11.2025
23

Choosing the Right Capacitor: The Importance of Accurate Measurements

12.11.2025
41

Littelfuse Releases TMR Switches with Ultra-Low Power Magnetic Sensing

12.11.2025
6

Skeleton Opens SuperBattery Factory in Finland 

12.11.2025
15

Murata Expands High Rel NTC Thermistors in Compact 0603M Size

12.11.2025
8

RF Inductors: Selection and Design Challenges for High-Frequency Circuits

10.11.2025
53

Transformer Safety IEC 61558 Standard

7.11.2025
28

ESR of Capacitors, Measurements and Applications

7.11.2025
101

3-Phase EMI Filter Design, Simulation, Calculation and Test

6.11.2025
77

Upcoming Events

Dec 2
December 2 @ 12:00 - December 4 @ 14:15 CET

Microwave Packaging Technology

Dec 9
December 9 @ 12:00 - December 11 @ 14:15 EST

Space and Military Standards for Hybrids and RF Microwave Modules

Dec 10
16:00 - 17:00 CET

Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version