Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Knowles ATT A-Series surface-mount RF attenuator in compact ceramic thin-film package

    Knowles A-Series RF Attenuators Target Compact 20 GHz Designs

    Film DC-link capacitor and supercapacitor energy buffer in a high-voltage power converter system

    Electrification Raises Demands on DC-Link Capacitors

    YAGEO Group high-reliability polymer tantalum capacitor portfolio for aerospace and defence power electronics

    YAGEO High-Reliability Polymer Tantalum Capacitors for Aerospace

    Schematic of the step-wise LPG/LPG@MnOx/LPG-O functionally graded thick cathode for a zinc-ion hybrid capacitor, Hefei Institutes of Physical Science.

    Laser-Engineered Zinc-Ion Cathodes Target Thick Electrodes

    Isabellenhütte HFF flexible Kapton heater with etched MANGANIN foil structure and wire lead exit

    Isabellenhütte Introduces Flexible Heaters for Space Thermal Control

    DigiKey Factory Tomorrow Season 6 graphic illustrating AI-ready industrial connectivity, data infrastructure and smart manufacturing networks.

    DigiKey Factory Tomorrow Season 6 Explores AI-Ready Factories

    Bourns CRT-TN TaN thin-film chip resistors in 0402, 0603, 0805 and 1206 package sizes

    Bourns Releases TaN Thin Film Resistors Target Precision Circuits

    Sep 2026 electronics market heat map

    September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Würth Elektronik electronica 2026 presentation featuring electronic components, PCB technologies and high-current PowerBusbar connection solutions.

    Würth Elektronik Previews Components, PCBs and Power Solutions at electronica 2026

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Knowles ATT A-Series surface-mount RF attenuator in compact ceramic thin-film package

    Knowles A-Series RF Attenuators Target Compact 20 GHz Designs

    Film DC-link capacitor and supercapacitor energy buffer in a high-voltage power converter system

    Electrification Raises Demands on DC-Link Capacitors

    YAGEO Group high-reliability polymer tantalum capacitor portfolio for aerospace and defence power electronics

    YAGEO High-Reliability Polymer Tantalum Capacitors for Aerospace

    Schematic of the step-wise LPG/LPG@MnOx/LPG-O functionally graded thick cathode for a zinc-ion hybrid capacitor, Hefei Institutes of Physical Science.

    Laser-Engineered Zinc-Ion Cathodes Target Thick Electrodes

    Isabellenhütte HFF flexible Kapton heater with etched MANGANIN foil structure and wire lead exit

    Isabellenhütte Introduces Flexible Heaters for Space Thermal Control

    DigiKey Factory Tomorrow Season 6 graphic illustrating AI-ready industrial connectivity, data infrastructure and smart manufacturing networks.

    DigiKey Factory Tomorrow Season 6 Explores AI-Ready Factories

    Bourns CRT-TN TaN thin-film chip resistors in 0402, 0603, 0805 and 1206 package sizes

    Bourns Releases TaN Thin Film Resistors Target Precision Circuits

    Sep 2026 electronics market heat map

    September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Würth Elektronik electronica 2026 presentation featuring electronic components, PCB technologies and high-current PowerBusbar connection solutions.

    Würth Elektronik Previews Components, PCBs and Power Solutions at electronica 2026

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

TDK’s Thin EDLC for IC Smart Cards

7.10.2016
Reading Time: 3 mins read
A A

source: TDK article

TDK has been offering pouch-type EDLCs, and has developed a new ultra-thin EDLC, with a thickness of 0.45mm (max.) that can be stored inside an IC card. It realizes battery-less smart cards equipped with a display, and is suitable for secondary power supplies for wearable devices or IoT devices.

RelatedPosts

Knowles A-Series RF Attenuators Target Compact 20 GHz Designs

Electrification Raises Demands on DC-Link Capacitors

YAGEO High-Reliability Polymer Tantalum Capacitors for Aerospace

EDLC of TDK often used for assisting power supplies for LED flash, etc.
TDK offers small pouch-type EDLCs by applying the production technology for lithium ion batteries. TDK’s EDLC is thin, large-capacity and low-impedance, and is often used for assisting power supplies for LED flashes and other devices. EDLCs are attracting attention as a secondary power supplies for wearable devices or IoT devices, and further reduction in their thickness is demanded. To meet these needs, TDK has developed a new EDLC featuring a thickness of only 0.45mm (max.), which is one of the thinnest EDLCs in the industry (Figure 1).

Figure 1 Newly-developed thin EDLC (EDLC041720-050-2F-13)
Realizes next-generation battery-less smart cards
IC cards incorporating IC chips are used for various applications as replacements for conventional magnetic cards. Recently, next-generation smart cards with electronic paper displays or operation buttons, featuring high convenience and security, have appeared.

In a non-contact IC card system using Near Field Communication (NFC), information on the IC chip is rewritten by transmitting the energy simultaneously with signals, using the electromagnetic wave at a frequency of 13.56MHz sent from the reader/writer. However, as several seconds are required for electronic paper displays to be rewritten, the IC cards must be held over the reader/writer for a while. Although the next-generation smart cards are equipped with a primary or secondary battery to keep convenience, there are some worries with these batteries, such as the length of the battery life or the need for a lengthy charging time. TDK’s new thin EDLC provides a solution for these concerns, which rapidly stores the energy required for rewriting the display while the card is being held over the reader/writer.

The size of an IC card is 85.60mm on the longer side, 53.98mm on the shorter side, and 0.76mm thick determined by the international standard ISO/IEC7810. The newly developed EDLC with a thickness of 0.45mm makes it possible to incorporate the EDLC into an IC card, realizing a battery-less next-generation smart card (Figure 2).

Figure 2 Example of the configuration of a next-generation battery-less smart card
IC cards are required to have bending or torsional resistance. In a test using a sample incorporating TDK’s thin EDLC, the functions were not damaged even after repeating dynamic bending with a maximum flexure amount of 20mm in the long direction and 10mm in the short direction 250 times for the front and back sides respectively, for a total of 1,000 times. In addition, the functions were not lost even after repeating a dynamic torsion of 15±1° 1,000 times, which sufficiently cleared the durability test under the ISO/IEC standard required for IC cards.

Effective for wearable devices or IoT devices
The advantages of TDK’s thin EDLC include that it is a highly safe power storage device compared to lithium ion batteries or other devices. Even if an object such as a nail penetrates it when it is fully charged, it does not cause ignition or fumes. Therefore, it is suitable for healthcare devices used on the human body or wearable devices. In addition, it also features an excellent temperature characteristic, being able to operate under a broad temperature range from -20°C to +60°C. Owing to this temperature characteristic, the EDLC can support various applications, including secondary batteries for IoT devices used outdoors or storage devices in energy harvesting devices.

Wireless Sensor Networks (WSN) consisting of a large number of sensors will become the core of the near-future IoT society. However, power supplies for transmitting sensor information using radio waves have been a bottleneck for the spread of WSN. The combination of energy harvesting and EDLC provides a very effective solution that can realize battery-less sensor devices.

Part No. Nominal
Capacitance
(mF) typ.
Nominal
Impedance
[AC 1kHz]
(Ω) typ.
Operating Voltage
(continuous)
(V)
Peak
(V)
EDLC041720-050-2F-13 5 7 3.2 5.0

Related

Recent Posts

Film DC-link capacitor and supercapacitor energy buffer in a high-voltage power converter system

Electrification Raises Demands on DC-Link Capacitors

1.10.2026
3
YAGEO Group high-reliability polymer tantalum capacitor portfolio for aerospace and defence power electronics

YAGEO High-Reliability Polymer Tantalum Capacitors for Aerospace

1.10.2026
7
Schematic of the step-wise LPG/LPG@MnOx/LPG-O functionally graded thick cathode for a zinc-ion hybrid capacitor, Hefei Institutes of Physical Science.

Laser-Engineered Zinc-Ion Cathodes Target Thick Electrodes

1.10.2026
4
Two Murata LLD three-terminal MLCCs beside a metal ruler, showing beige ceramic bodies and silver-coloured terminals.

Murata Begins Production of 0201 Three-Terminal Low-ESL MLCCs for IC Decoupling

30.9.2026
21
LeanBOM Working Conditions search showing DC-bias capacitance curves for capacitor candidates at 88 degrees Celsius

LeanBOM Expands Capacitor Catalogue and Comparison Tools

30.9.2026
14
TDK and TAIYO YUDEN business alliance announcement for advanced MLCCs and inductors supporting AI infrastructure.

TDK and TAIYO YUDEN Explore Alliance for MLCCs and Inductors

29.9.2026
73
Antiferroelectric hafnia crystal structure showing alternating polar layers and field-aligned polar state, University of Nebraska–Lincoln

Antiferroelectric Hafnia at the 2D Limit

29.9.2026
21
Metallized film capacitor winding with PEN, PET and polypropylene dielectric film layers shown in a power-electronics supply-chain concept

PEN Film Supply Challenges and Capacitor Replacement Paths

29.9.2026
12
Rheinmetall Pierburg Pump Technology NanoLam DC-link capacitors for high-power electric vehicle traction inverter applications

Rheinmetall Funds NanoLam Capacitor Production Scale-Up

22.9.2026
71

Upcoming Events

Oct 14
17:00 - 18:00 CEST

Live Demo! Discover KYOCERA AVX Antenna Integrator Studio (AIS)

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Capacitor Symbols

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved