Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

    Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

    Bourns Releases Power Resistor Adds Reverse-Pin Configuration

    Conceptual polypropylene DC-link film capacitor module with parallel cells and copper interconnections

    DC-Link Film Capacitor Modules: Inductance and Thermal Design, Jianghai-Europe Tech Memo

    Panasonic EVP-BX surface-mount tactile switches with top-push actuators and two-terminal construction

    Panasonic EVP-BX Quiet Tactile Switches for HMI Designs

    Motor Run Capacitor Safety Classes S0–S3: A Design Guide

    YAGEO Piezoelectric Sensors for Predictive Maintenance

    Wk 44 Electronics Supply Chain Digest

    TDK HVC28 and HVC29 high-voltage DC contactors with black housings and main power terminals

    TDK Introduces Gas-Filled High-Voltage DC Contactors up to 600 A

    Murata SWL RF coaxial switch connector measurement diagram and SWL-to-SWJ board-area comparison.

    Murata RF Switch Connectors Cut PCB Test-Point Area

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

    Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

    Bourns Releases Power Resistor Adds Reverse-Pin Configuration

    Conceptual polypropylene DC-link film capacitor module with parallel cells and copper interconnections

    DC-Link Film Capacitor Modules: Inductance and Thermal Design, Jianghai-Europe Tech Memo

    Panasonic EVP-BX surface-mount tactile switches with top-push actuators and two-terminal construction

    Panasonic EVP-BX Quiet Tactile Switches for HMI Designs

    Motor Run Capacitor Safety Classes S0–S3: A Design Guide

    YAGEO Piezoelectric Sensors for Predictive Maintenance

    Wk 44 Electronics Supply Chain Digest

    TDK HVC28 and HVC29 high-voltage DC contactors with black housings and main power terminals

    TDK Introduces Gas-Filled High-Voltage DC Contactors up to 600 A

    Murata SWL RF coaxial switch connector measurement diagram and SWL-to-SWJ board-area comparison.

    Murata RF Switch Connectors Cut PCB Test-Point Area

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

The Future of Stretchable Electronics

20.7.2022
Reading Time: 3 mins read
A A

Stretchable electronics is emerging as a promising new technology for next-generation wearable devices, according to a review published in Science and Technology of Advanced Materials.

The technology has many possible applications for healthcare, energy and the military. But there are several challenges involved in finding suitable materials and manufacturing methods. The biggest challenge for making stretchable electronics is that each component must endure being compressed, twisted and applied to uneven surfaces while maintaining its performance, according to the review author Wei Wu, materials scientist at Wuhan University, China.

RelatedPosts

Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

Bourns Releases Power Resistor Adds Reverse-Pin Configuration

DC-Link Film Capacitor Modules: Inductance and Thermal Design, Jianghai-Europe Tech Memo

Many different stretchable electronic components are being developed. For instance, low-cost stretchable conductors and electrodes are being made from silver nanowires and graphene. An urgent technical problem is the need for stretchable energy conversion and storage devices, such as batteries. Zinc-based batteries are promising candidates; however, more work is required to make them commercially viable.

An alternative to batteries is stretchable nanogenerators, which can produce electricity from various freely available vibrations, such as wind or human body movements. Stretchable solar cells could also be used to power wearable electronic devices.

By integrating multiple stretchable components, such as temperature, pressure and electrochemical sensors, supercapacitors etc it is possible to create a material resembling human skin that could use signals from sweat, tears or saliva for real-time, non-invasive healthcare monitoring, as well as for smart prosthetics or robots with enhanced sense capabilities. However, at present, fabrication of artificial skin remains time-consuming and complex.

Currently there are two main strategies for manufacturing stretchable electronics. The first is to use intrinsically stretchable materials, such as rubber, which can endure large deformations. However, these materials have limitations, such as high electrical resistance.

The second method is to make non-flexible materials stretchable using innovative design. For example, brittle semiconductor materials like silicon can be grown on a pre-stretched surface and then allowed to compress, creating buckling waves. Another method involves linking ‘islands’ of rigid conductive materials together using flexible interconnections, such as soft or liquid metals. Origami-inspired folding techniques can be used to make foldable electronic devices. In the future, stretchable electronics may be enhanced with new capabilities, such as wireless communication, self-charging or even self-healing.

The next step after laboratory tests is to bring stretchable electronic devices to market. This requires cheaper materials and faster, scalable manufacturing methods, concludes the review author.

featured image: This solar cell can be stretched (left) or twisted (right) without performance degradation. Copyright : Nam, J. et al. Scientific Reports. 8 Aug. 2017/Creative Commons

Related

Source: ECN

Recent Posts

Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

Bourns Releases Power Resistor Adds Reverse-Pin Configuration

3.11.2026
0
Conceptual polypropylene DC-link film capacitor module with parallel cells and copper interconnections

DC-Link Film Capacitor Modules: Inductance and Thermal Design, Jianghai-Europe Tech Memo

3.11.2026
1
Panasonic EVP-BX surface-mount tactile switches with top-push actuators and two-terminal construction

Panasonic EVP-BX Quiet Tactile Switches for HMI Designs

3.11.2026
0

Motor Run Capacitor Safety Classes S0–S3: A Design Guide

2.11.2026
17

YAGEO Piezoelectric Sensors for Predictive Maintenance

2.11.2026
25
TDK HVC28 and HVC29 high-voltage DC contactors with black housings and main power terminals

TDK Introduces Gas-Filled High-Voltage DC Contactors up to 600 A

29.10.2026
20
Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

Exxelia Brings High-Temperature Passives to Electronica 2026

29.10.2026
33

IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

28.10.2026
60
Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

Bourns Releases 450 V Power TVS for DC Bus Clamping

27.10.2026
30

Upcoming Events

Nov 24
16:00 - 17:00 CET

Select the Correct Components for Your DC/DC Converter

Dec 1
16:00 - 17:00 CET

Developing low-noise mixed-signal systems

Dec 8
16:00 - 17:00 CET

WE-CCMF: Design Principles, Layout Guidelines and Measurement Results for High-Speed EMI Filtering

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved