Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

The Future of Stretchable Electronics

20.7.2022
Reading Time: 3 mins read
A A

Stretchable electronics is emerging as a promising new technology for next-generation wearable devices, according to a review published in Science and Technology of Advanced Materials.

The technology has many possible applications for healthcare, energy and the military. But there are several challenges involved in finding suitable materials and manufacturing methods. The biggest challenge for making stretchable electronics is that each component must endure being compressed, twisted and applied to uneven surfaces while maintaining its performance, according to the review author Wei Wu, materials scientist at Wuhan University, China.

RelatedPosts

VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

Bourns Introduces Precision Thin Film Resistors for Measurement

Many different stretchable electronic components are being developed. For instance, low-cost stretchable conductors and electrodes are being made from silver nanowires and graphene. An urgent technical problem is the need for stretchable energy conversion and storage devices, such as batteries. Zinc-based batteries are promising candidates; however, more work is required to make them commercially viable.

An alternative to batteries is stretchable nanogenerators, which can produce electricity from various freely available vibrations, such as wind or human body movements. Stretchable solar cells could also be used to power wearable electronic devices.

By integrating multiple stretchable components, such as temperature, pressure and electrochemical sensors, supercapacitors etc it is possible to create a material resembling human skin that could use signals from sweat, tears or saliva for real-time, non-invasive healthcare monitoring, as well as for smart prosthetics or robots with enhanced sense capabilities. However, at present, fabrication of artificial skin remains time-consuming and complex.

Currently there are two main strategies for manufacturing stretchable electronics. The first is to use intrinsically stretchable materials, such as rubber, which can endure large deformations. However, these materials have limitations, such as high electrical resistance.

The second method is to make non-flexible materials stretchable using innovative design. For example, brittle semiconductor materials like silicon can be grown on a pre-stretched surface and then allowed to compress, creating buckling waves. Another method involves linking ‘islands’ of rigid conductive materials together using flexible interconnections, such as soft or liquid metals. Origami-inspired folding techniques can be used to make foldable electronic devices. In the future, stretchable electronics may be enhanced with new capabilities, such as wireless communication, self-charging or even self-healing.

The next step after laboratory tests is to bring stretchable electronic devices to market. This requires cheaper materials and faster, scalable manufacturing methods, concludes the review author.

featured image: This solar cell can be stretched (left) or twisted (right) without performance degradation. Copyright : Nam, J. et al. Scientific Reports. 8 Aug. 2017/Creative Commons

Related

Source: ECN

Recent Posts

VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

12.11.2026
52
Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

12.11.2026
4
Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

Bourns Introduces Precision Thin Film Resistors for Measurement

12.11.2026
5
Würth Elektronik ABC of Thermal Management textbook

Würth Elektronik Launches ABC of Thermal Management Guide

11.11.2026
14

Bourns Releases 450 V DC Bus TVS Diode

10.11.2026
3
YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

9.11.2026
6
SCHURTER TCS6F IP67 sealed SMD tactile switch with white silicone actuator on dark background

SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

7.11.2026
3
YAGEO SMD 0603 ST Pt1000 chip sensor shown in front of rooftop HVAC equipment

YAGEO SMD 0603 ST Pt1000 Sensor with Standard SMD Termination

7.11.2026
20
Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

800 VDC AI Data Centers Reshape Capacitor Demand for 2027

6.11.2026
59

Upcoming Events

Nov 24
16:00 - 17:00 CET

Select the Correct Components for Your DC/DC Converter

Dec 1
16:00 - 17:00 CET

Developing low-noise mixed-signal systems

Dec 8
16:00 - 17:00 CET

WE-CCMF: Design Principles, Layout Guidelines and Measurement Results for High-Speed EMI Filtering

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved