Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung Unveils World First CLLC Resonant 1kV 33nF C0G MLCC in 1210 Size

    Bourns Releases 500VDC 690VAC Fuse to Protect Power Semiconductors

    Samsung MLCC Replacing Aluminum Polymer Capacitors in AI Systems

    Reliability Improvement in BaTiO3 MLCCs Using Ni–Sn and Ni–In Alloy Electrodes

    Littelfuse Introduces Automotive Current Sensors for EV Battery, Motor, and Safety Systems

    Vishay Releases Fast Acting Thin Film Chip Fuses

    Mechanical Testing of Tantalum Anodes to Predict Tantalum Capacitor Quality

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung Unveils World First CLLC Resonant 1kV 33nF C0G MLCC in 1210 Size

    Bourns Releases 500VDC 690VAC Fuse to Protect Power Semiconductors

    Samsung MLCC Replacing Aluminum Polymer Capacitors in AI Systems

    Reliability Improvement in BaTiO3 MLCCs Using Ni–Sn and Ni–In Alloy Electrodes

    Littelfuse Introduces Automotive Current Sensors for EV Battery, Motor, and Safety Systems

    Vishay Releases Fast Acting Thin Film Chip Fuses

    Mechanical Testing of Tantalum Anodes to Predict Tantalum Capacitor Quality

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Merck: The Next Decade is Going to be the Decade of Materials

30.8.2021
Reading Time: 4 mins read
A A

Building out manufacturing capacity is one answer to the ongoing electronic components supply chain shortages, but it’s not the only answer. As semiconductor companies like Intel, GlobalFoundries and Samsung announce plans to build new sites or expand existing ones to add more capacity they are sending the message that they will do whatever they can to address the chip shortage and growing customer demand, but ultimately other business practices within the supply chain also will need to evolve, according to Anand Nambiar, global head of semiconductor materials for EMD Electronics, a business of Germany’s Merck KGaA.

“These announcements by the giants are commitments to create space,” he said. “Essentially, the new fabs are white space, and equipment and materials are needed to fill that white space. So the question becomes, ‘How do you fill this white space?’ It will take the supply chain time to catch up.”

RelatedPosts

Samsung Unveils World First CLLC Resonant 1kV 33nF C0G MLCC in 1210 Size

Bourns Releases 500VDC 690VAC Fuse to Protect Power Semiconductors

Samsung MLCC Replacing Aluminum Polymer Capacitors in AI Systems

The chip shortage isn’t just a chip shortage. As other industry players have noted, it is also a shortage of both raw and integrated materials necessary for the manufacturing process. At the same time, the supply chain won’t get a chance to come up for air anytime soon, as fresh demand for all kinds of chips is increasing.

“All of these market segments that need chips–AI, 5G smartphones, data center servers, sensors, autonomous driving and others–they’re all growing at a rapid rate,” Nambiar said. 

These trends are also going to generate more data, which means a growing requirement for more data analysis and development of insights based on the data, all of which means chips will need to be more powerful and more capable, with an increasing likelihood that more data analysis will happen on-chip or on-device. Right now, there is collectively still very little data analysis being done across all industries–different research sources put the figure in the low-to-mid single digits percentage-wise. If that percentage grows even a little, it could represent a doubling of the amount of analysis being done now, which could translate to an explosion in the need for chips with AI capabilities.

“All of these technology drivers are happening at the same time to create much more market demand, and that has been compounded by the fact of the supply shortage to create the more significant demand/supply disruption,” Nambiar said

Due to the wide range of factors in play to create this perfect storm of disruption, constraints in different parts of the semiconductor supply chain are likely to continue to pop up for years to come, he added.

The shortage combined with ever-broadening demand are the reasons “why companies are building so much more capacity, but for the next decade there are going to be ups and downs with market corrections and changes in pricing,” Nambiar said. “There will be a stabilizing effect from improvements in capacity and logistics, but there will also be sustained demand.”

Rethinking materials practices

This “new normal” means that chip companies will need to start to rethink how they acquire and work with the materials they need.

The demand/supply disruption has exposed the weakness of modern global-scale supply chains. For one thing, supply chains have become extremely complex, with too many moving parts for any one company to adequately control. Also, some manufacturing processes or  supply sources for some materials have become so concentrated in individual countries (most tungsten traditionally come out of China, for example) that when problems arise in these locations, the supply chain can crash.

That could drive more companies to try to localize their sourcing to some degree to mitigate some of the blips that might occur in a more distributed chain, a practice companies and governments around the world are starting to buy into. 

“Regarding the geopolitical aspects, there definitely is a nationalistic drive to build more capacity and ecosystem support in countries that are feeling left out of the chain,” Nambiar said. “But they need to do this smartly and focus on a strategy to localize their supply chain where this is possible. It’s important that materials and supplies are locally present for the new capacity being built [by chip companies].”

Living in a material world

Beyond localization, chip companies might also need to create longer-term strategies to acquire more raw materials and seek more integrated and packaged materials where they can to offset delays of these materials coming out of certain suppliers or countries. 

“Two to three decades ago, fewer than 10 elements were used in chip processes,” Nambiar said. “Now, 50 to 70 of the elements on the periodic table are used, with even more under scrutiny. The next decade is going to be the decade of materials.”

But along with the exigent supply chain challenges, the broader range of materials being used means that the ability to integrate and package these materials to streamline the manufacturing process is increasingly critical.

“Materials are an opportunity for us to solve complex problems,” Nambiar said. “What happens today is that the chip customer works with many different materials suppliers, and the onus is on that customer to integrate everything.

“Think about how this market is evolving,” Nambiar said. “Google has started to drive chip design. Some companies want to own the entire value chain, others want to farm everything out, but they all need hardware. Facebook is doing AR and they need both display and semiconductor hardware competency to make that work. Amazon, Microsoft, Google — they all have hardware roadmaps. These companies are emerging to drive how semiconductor processes will work in the future.”

Related

Source: Fierce Electronics

Recent Posts

Littelfuse Completes Acquisition of Basler Electric

12.12.2025
23

YAGEO Achieved a Record Revenue in November on Strong AI Demand

10.12.2025
41

Key Interconnect Technologies for 2025

5.12.2025
31

Bishop Reveals Top 10 Connector Manufacturers

5.12.2025
89

November 2025 Interconnect, Passives and Electromechanical Components Market Insights

4.12.2025
100

DigiKey Launches 2025 DigiWish Holiday Giveaway for Global Engineering Community

3.12.2025
22

Skeleton Opens €220M Supercapacitor Leipzig Factory

3.12.2025
26

TDK and NIPPON CHEMICAL to Establish Joint Venture for MLCC Material Development

27.11.2025
70

Passive Components for Next Gen Automotive Systems

26.11.2025
171

Upcoming Events

Jan 27
16:00 - 17:00 CET

Simplifying Vehicle Development with Automotive Ethernet and Zonal Smart Switch Technologies

Feb 24
16:00 - 17:00 CET

Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version