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    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

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Thermal Aging in Molded Inductors

7.5.2024
Reading Time: 1 min read
A A

This Wurth Elektronik presentation examines the market trends pushing the limits of electronic components, focusing on the critical phenomenon of thermal aging in molded inductors.

As current density increases and miniaturization drives components to operate at higher temperatures, the risk of thermal aging issues rises.

RelatedPosts

Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

Power Inductors Future: Minimal Losses and Compact Designs

Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

In this presentation we will discuss reasons and consequences of thermal aging in molded inductors, thermal aging detection, effects of thermal aging in applications and Wurth Elektronik’s product line up designed for the challenges associated with thermal aging.

Content:

  • Market trends in power converters
  • From ferrite to molded inductors
  • Characteristics of molded inductors
  • Thermal ageing

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Source: Wurth Elektronik

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