Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Presents 3.6 kW LLC Transformer Platform

    Empower Extends Embedded Silicon Capacitors for AI

    ECIA February 2026 Industry Pulse Signals Strong Component Growth

    How Modern Tools Model Magnetic Components for Power Electronics

    Inductors and Ferrite Beads Price Hikes 

    TDK Extends Compact ThermoFuse Varistors up to 50 kA

    Samtec ANSI/VITA 90 Connectors: Rugged Small Form Factor Standard

    Resistor Technology Dossier

    Würth Elektronik IQD Awarded by EcoVadis Gold Sustainability Medal

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Presents 3.6 kW LLC Transformer Platform

    Empower Extends Embedded Silicon Capacitors for AI

    ECIA February 2026 Industry Pulse Signals Strong Component Growth

    How Modern Tools Model Magnetic Components for Power Electronics

    Inductors and Ferrite Beads Price Hikes 

    TDK Extends Compact ThermoFuse Varistors up to 50 kA

    Samtec ANSI/VITA 90 Connectors: Rugged Small Form Factor Standard

    Resistor Technology Dossier

    Würth Elektronik IQD Awarded by EcoVadis Gold Sustainability Medal

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

UNIST Introduces Tiny Micro Supercapacitor On Chip, Ideal for Wearable Devices

18.3.2020
Reading Time: 3 mins read
A A

A tiny microsupercapacitor (MSC) that is as small as the width of a person’s fingerprint and can be integrated directly with an electronic chip has been developed. This has attracted major attention as a novel technology to lead the era of Internet of Things (IoT) since it can be driven independently when applied to individual electronic components.

Through the study, Professor Sang-Young Lee and his research team in the School of Energy and Chemical Engineering at UNIST have unveiled a new class of ultrahigh areal number density solid-state MSCs (UHD SS–MSCs) on a chip via electrohydrodynamic (EHD) jet printing. According to the research team, this is the first study to exploit EHD jet printing in the MSCs.

RelatedPosts

YAGEO Presents 3.6 kW LLC Transformer Platform

Empower Extends Embedded Silicon Capacitors for AI

ECIA February 2026 Industry Pulse Signals Strong Component Growth

A supercapacitor (SC), also known as an ultracapacitor, can store much more energy than ordinary capacitors. The benefits ofsupercapacitors include having high power delivery and longer cycle life compared to lithium-based secondary batteries. In particular, it can be produced as small as the width of a person’s fingerprint via semiconductor manufacturing process, and thus can be also applicable for wearables and internet of things (IoT) devices.

However, because the heat produced in manufacturing process may cause deterioration of the electrical characteristics of the supercapacitor, it has been difficult to connect them directly to electronic components. In addition, the fabrication method that combines supercapacitors with electronic components via inkjet printing technique has also the disadvantage of lower precision.

The overall fabrication of on-chip UHD SS–MSCs is schematically illustrated above.

The research team solved this issue using EHD jet printing, a high-resolution patterning technique in microelectronics. EHD jet printing uses the electrode and electrolyte for printing purpose similar to that of conventional inkjet printing, yet it can control printed liquid with an electric field.

“We were able to produce up to 54.9 unit cells per square centimeter via electro-hydrodynamic jet printing technique, and thus the output of 65.9 volts (V) was achieved in the same area,” says Kwonhyung Lee (Combined M.S/Ph.D. of Energy and Chemical Engineering, UNIST), the first author of the study.

On-chip UHD SS–MSCs as a device-unitized power source.

The team also succeeded in fabricating 36 unit cells on a chip (area = 8.0 mm × 8.2 mm, 54.9 cells cm−2) and areal operating voltage (65.9 V cm−2) that lie far beyond those of previously reported MSCs fabricated by printing techniques. Besides, upon exposure to hot temperature (80°C), these cells maintained normal cyclic voltammetry (CV) profiles, and thus has proven they can withstand excessive heat generated during the operation of actual electronic component. In addition, these batteries can provide customized power supplies, as they can be connected either in series or parallel.

“In this study, we have demonstrated on-chip UHD SS–MSCs fabricated via EHD jet printing,” says Professor Lee. “The on-chip UHD SS–MSCs presented here hold great promise as a new platform technology for miniaturized monolithic power sources with customized design and tunable electrochemical properties.”

This study has been supported through the Mid-career Researcher Supporting Program by the Ministry of Science and ICT (MSIT, Korea) and the Industry Technology Development Program funded by the Ministry of rade, Industry and Energy (MOTIE, Korea). The findings of this work have been published in the scientific journal, Science Advances on March 6, 2020.

Journal Reference
Kwon-Hyung Lee, Seong-Sun Lee, David B. Ahn, et al., “Ultrahigh areal number density solid-state on-chip microsupercapacitors via Electrohydrodynamic Jet-Printing,” Science Advances, (2020).

Related

Source: UNIST

Recent Posts

Empower Extends Embedded Silicon Capacitors for AI

6.3.2026
15

How Modern Tools Model Magnetic Components for Power Electronics

5.3.2026
28

Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

4.3.2026
24

AI Servers Demand is Driving Tantalum Capacitor Price Hikes

5.3.2026
78

DMASS Reports Europe Components Up 9.8% in Q4 2025

3.3.2026
21

Mastering Galvanic Isolation in Power Electronics: Methods, Standards, and Implementation

2.3.2026
37

VINATech Targets AI Data Center Supercapacitor Boom

26.2.2026
49

TDK Introduces 350V Safety Film Capacitors for Compact EMI Suppression

26.2.2026
36

Samsung Launches Worlds First Automotive 47uF 4V MLCC in 0805 Size

24.2.2026
38

Upcoming Events

Mar 19
13:00 - 14:00 CDT

Smart Consideration of Inductor Thermal Performance

Mar 21
All day

PSMA Capacitor Workshop 2026

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version