Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK HVC28 and HVC29 high-voltage DC contactors with black housings and main power terminals

    TDK Introduces Gas-Filled High-Voltage DC Contactors up to 600 A

    Murata SWL RF coaxial switch connector measurement diagram and SWL-to-SWJ board-area comparison.

    Murata RF Switch Connectors Cut PCB Test-Point Area

    Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

    Mathematical state-space illustration of a series-connected memcapacitor oscillator with two constrained memory coordinates

    Memcapacitor chaos in a six-state series-connected model

    Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

    Exxelia Brings High-Temperature Passives to Electronica 2026

    IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

    Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

    Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

    Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

    Bourns Releases 450 V Power TVS for DC Bus Clamping

    MLCC construction image

    Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK HVC28 and HVC29 high-voltage DC contactors with black housings and main power terminals

    TDK Introduces Gas-Filled High-Voltage DC Contactors up to 600 A

    Murata SWL RF coaxial switch connector measurement diagram and SWL-to-SWJ board-area comparison.

    Murata RF Switch Connectors Cut PCB Test-Point Area

    Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

    Mathematical state-space illustration of a series-connected memcapacitor oscillator with two constrained memory coordinates

    Memcapacitor chaos in a six-state series-connected model

    Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

    Exxelia Brings High-Temperature Passives to Electronica 2026

    IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

    Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

    Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

    Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

    Bourns Releases 450 V Power TVS for DC Bus Clamping

    MLCC construction image

    Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

USB 3.0 Connectors – Architecture, Protocol and Power Management

14.9.2021
Reading Time: 3 mins read
A A

Architecture: from High-Speed to Super-Speed
USB 3.0 consists of a physical super-speed bus in addition to the physical USB 2.0 bus (as illustrated by Figure 2.119). The protocol defines a dual simplex signalling mechanism with a rate of 5 Gbits/s. This enables the simultaneous transfer of data to and from the device, as opposed to the single duplex unidirectional USB 2.0 bus.

Fig. 2.132: USB 3.0 architecture

It is beyond the scope of this article to describe the full USB 3.0 architecture in detail. However, it is important to note that it was inspired by the layered PCIe architecture and the OSI model. Therefore, it includes a physical layer (PHY), a link layer and a protocol layer.

RelatedPosts

Polymer Materials and Processing

What is RF Connector

Connector Materials and Processes

Separate data lanes used for up and download enable reading and storing files at the same time and therefore offer a much higher data rate, up to 4.8 Gbits/s (versus 480 Mb/s for USB 2.0).

Power Management
USB 3.0 provides enhanced power management capabilities. With up to 150 mA per unit (+50 % compared to USB 2.0) and up to 6 units together, USB 3.0 can carry up to 900 mA, versus 500 mA with USB 2.0. This means a total 80% increase compared to USB 2.0.

There again, this article does not aim to describe how this works in detail, but it is worth noting that while USB 3.0 requires more power when active, it still consumes less power in the end. Indeed, its higher data rate and various power efficiency features let it remain far less active than in the High-Speed Mode. (See Figure 2.133 which compares power consumption during data transfer in High-Speed and Super-Speed Modes).

Fig. 2.133: Power consumption: comparison between High Speed mode & Super Speed mode

Backward Compatibility
As always with USB, the architecture is designed to ensure the electrical and mechanical backward compatibility with former USB versions (1.1 and 2.0). For example, a USB 3.0 compliant host will communicate with a device at the highest rate supported by the said device. Reciprocally: a USB 3.0 compliant device will function at USB 2.0 rate when plugged into a USB 2.0 host.

Tab. 2.10: USB connectors and mating parts – backwards compatibility from USB 3.0 to USB 2.0

This backward compatibility remains a major advantage compared to all other connection protocols available on the market. Indeed, it avoids obsolescence of existing products extending their life in the field. This is especially true for industrial applications where the life cycle has nothing to do with consumer goods.

Fig. 2.134: Backward compatibility

Related

Source: Wurth elektronik

Recent Posts

Circular Connectors Coding

26.11.2025
310

Connector PCB Design Challenges

3.10.2025
149

Non-Magnetic Interconnects

23.4.2025
76

10 Tips for Ensuring Reliability of Discrete Wire Assemblies

20.2.2025
101

Polymer Materials and Processing

11.8.2025
297

Basic PCB Technology Overview

1.7.2025
81

What is RF Connector

17.12.2024
108

Creepage and Clearance of Connector

25.7.2025
138

RF Connector Types: How To Choose the Right One

24.4.2026
1.6k

Upcoming Events

Nov 24
16:00 - 17:00 CET

Select the Correct Components for Your DC/DC Converter

Dec 1
16:00 - 17:00 CET

Developing low-noise mixed-signal systems

Dec 8
16:00 - 17:00 CET

WE-CCMF: Design Principles, Layout Guidelines and Measurement Results for High-Speed EMI Filtering

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved