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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

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    Würth Elektronik ABC of Thermal Management textbook

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    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

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    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

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USB 3.0 vs. Other High Speed Protocols

14.9.2021
Reading Time: 2 mins read
A A

Many other communication standards provide equivalent or even higher data rate than USB 3.0, namely: PCIe gen 2.0 (5 Gbits/s), Serial ATA (SATA) III (6 Gbits/s), Thunderbolt (10 Gbits/s), HDMI 1.4 (8 Gb/s) …

But PCIe and SATA III do not enable true plug & play application. Thunderbolt is a more complex technology, combination of PCI express and display port so the combination of monitor and data technologies. Therefore they do not really fight for same applications. Same for HDMI which is rather related to video applications. Therefore, even if they look like direct competitors of the USB 3.0 technology, all these communication protocols rather focus on niche applications and do not compete on the exact same market.

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Looking backwards, we should be reminded that the IEEE 1394 (Firewire) technology which was certainly the most reliable and effective serial interface (higher bandwidth and higher reliability…) was only used on niche markets such as high performance applications, while USB has been implemented in nearly every electronic equipment. As a consequence, technology is not always the key factor determining the success of a communication standard.

While talking about high data rate and improved power management, we must not forget that the main advantage of USB is and will remain its backward compatibility, which makes it theoretically compatible with billions of pieces of equipment all over the world.

It’s just the beginning of the game and all these technologies will keep developing simultaneously but we can assume that the royalty fee for USB 3.0 protocol has wide path for developing.

Fig. 2.135: Standard interfaces

Related

Source: Wurth elektronik

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