Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Smiths Interconnect invests £2m in Costa Rica electronics plant

    Kyocera Offers Small SAW Filters for IoT RF Modules

    Bourns Unveils High Volt GDT for High‑Energy Surge Protection

    TDK Releases DC Link Aluminum Capacitors for EV On‑Board Chargers

    Capacitech C-Link Supercapacitors for AI Data Center Voltage Spikes Mitigation

    Wk 8 Electronics Supply Chain Digest

    Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

    Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Smiths Interconnect invests £2m in Costa Rica electronics plant

    Kyocera Offers Small SAW Filters for IoT RF Modules

    Bourns Unveils High Volt GDT for High‑Energy Surge Protection

    TDK Releases DC Link Aluminum Capacitors for EV On‑Board Chargers

    Capacitech C-Link Supercapacitors for AI Data Center Voltage Spikes Mitigation

    Wk 8 Electronics Supply Chain Digest

    Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

    Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

YAGEO’s Role in Powering the AI Revolution

7.8.2023
Reading Time: 4 mins read
A A

As AI applications demand ever-increasing computational intensity, YAGEO, a prominent electronic component manufacturer, is stepping up to address the need for specialized components to power AI servers and devices according to Dr. Philip Lessner, CTO of Yageo Group in article published by TTI Market Eye.

Artificial Intelligence (AI) has taken the world by storm, transforming various industries such as Industry 4.0, Smart Farming, healthcare, and finance, to name a few. AI is revolutionizing how we interact with technology; from language translation to autonomous vehicles, it is rapidly becoming an integral part of our daily lives. However, the widespread adoption of AI comes with unique challenges, particularly in high-power Computing.

RelatedPosts

YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions

Conductive Polymer Capacitor Market and Design‑In Guide to 2035

YAGEO Offers Automotive MOVs for EV and AI power

Understanding AI and Its Relevance

AI refers to the development of software for machines to perform tasks that typically require human intelligence. This development involves training models using vast amounts of data and then utilizing those trained models to carry out specific tasks or provide answers to various questions. The scope of AI has expanded significantly from narrow tasks to more generalized models like Chat GPT, which can engage in diverse conversations and provide comprehensive responses.

AI that empowers applications like Chat GPT and Autonomous Vehicles (AV) requires massive computing power. As AI technologies advance and find broader applications, the demand for advanced hardware components, such as GPUs, has surged, increasing the need for specialized electronic components.

The AI Boom: Why Now?

While AI models have existed for quite some time, the recent boom can be attributed to their increasing sophistication and broader adoption. The ability to train these AI models and deploy them in real time was enabled by the continuing advances in computational power made over the last 60 years (Moore’s Law). As AI tasks evolve from simple to complex like the advanced capabilities of Chat GPT, the demand for unparalleled computing power has reached unprecedented levels. This surge in AI-driven applications is responsible for the current need for cutting-edge electronic components to support the growing AI infrastructure.

YAGEO’s Participation in the AI Revolution

As AI applications necessitate substantial computing power for training and deployment, the demand for electronic components, including YAGEO products, has risen significantly. This demand is because ‘substantial computing power’ translates into significant electrical power that needs to be provided to the computing engine and supporting systems. YAGEO actively participates in the AI revolution by supporting the power needs of AI-driven hardware devices, such as the widely used GPUs.

While it is challenging to quantify the exact percentage of YAGEO’s business directly attributable to AI, the impact of AI can be seen across multiple segments, particularly in Automotive (23% of total YAGEO revenues) and Computing (19%). AI’s influence extends beyond these segments, impacting IoT growth by analyzing massive data sets, leading to an expansion of sensor products and edge computing devices.

Catering to the AI Market: YAGEO’s Approach

The demands of higher computing power necessitate electronic components with specific attributes. YAGEO is actively developing capabilities across all its product roadmaps and technologies to meet these demanding requirements. High power means that any parasitic losses in the components are magnified, so capacitive and magnetic components with ultra-low loss are needed. Meanwhile, these components must have high reliability under harsh conditions. Since many more components are needed to support the AI processors, component miniaturization is also essential.

As AI continues to push the boundaries of computing power, specific specialized components like higher voltage capacitors, capacitors with higher capacitance and energy density such as U2J and C0G dielectrics with KONNEKT™️, and inductors based on advanced materials like NANOMET® are experiencing accelerated adoption by design engineers. Additionally, there are two key areas where resistors play a significant role in advancing computing power: voltage monitoring and current sensing.

Accelerating the Pace of Innovation

AI has brought about a profound revolution in engineering, effectively shortening design cycles and the need for custom, specialized components. Amidst this ever-evolving technological landscape, YAGEO leads the charge with its comprehensive Easy-To-Design-In (E2Di) solutions suite. These solutions encompass a wide range of offerings, including tailored test support, swift product sampling, access to application experts, and digital tools for extensive component simulations. With a clear focus on expediting design cycles and fostering innovation in AI, YAGEO empowers design engineers through cutting-edge technical content, advanced tools, and top-notch services. By dismantling barriers and facilitating the seamless integration of groundbreaking solutions, YAGEO plays a pivotal role in driving advancements in AI technology.

YAGEO’s AI Customers and Future Outlook

The AI ecosystem consists of CPU/GPU OEMs such as Nvidia, AMD, and Intel, power converter suppliers such as Infineon, ADI, and Renesas, and end users such as Google, Amazon, and Tesla. YAGEO actively collaborates with all these industry leaders, participating in their growth plans and custom electronic components and maintaining solid relationships with them.

YAGEO’s focus on serving the AI market is expected to remain steadfast. As AI applications continue to proliferate and influence segments like Automotive and Computing, YAGEO is poised to grow alongside these industries, supplying essential electronic components to power the AI revolution.

Conclusion

Artificial Intelligence is transforming the world and driving the need for higher computing power. YAGEO, as a leading electronic component manufacturer, is at the forefront of addressing the unique requirements of the AI market. With its advanced components specifically designed to power high-power AI servers and devices, YAGEO plays a vital role in the AI revolution, supporting cutting-edge applications across diverse industries and making AI accessible to billions of users worldwide.

Related

Source: TTI Market Eye. Yageo

Recent Posts

Smiths Interconnect invests £2m in Costa Rica electronics plant

23.2.2026
0

TDK Releases DC Link Aluminum Capacitors for EV On‑Board Chargers

23.2.2026
2

Capacitech C-Link Supercapacitors for AI Data Center Voltage Spikes Mitigation

23.2.2026
4

Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

20.2.2026
10
Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

19.2.2026
27

ECIA January 2026 Reports Strong Sales Confidence

19.2.2026
34

Vishay Unveils Ultra-Compact 0201 Thick Film Chip Resistors

19.2.2026
12

Würth Elektronik Component Data Live in Accuris

19.2.2026
16

Coilcraft Releases Automotive Common Mode Chokes

19.2.2026
16

Upcoming Events

Feb 24
16:00 - 17:00 CET

Mastering Galvanic Isolation: Ensuring Safety in Power Electronics

Feb 25
16:00 - 17:00 CET

Magnetic Modeling – How Frenetic Models Magnetics

Mar 3
16:00 - 17:00 CET

Cybersecurity at the Eleventh Hour – from RED to CRA – Information and Discussion

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version