Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    DigiKey Offers Zephyr Operating System Workshop and Training Videos

    Exxelia to Present Smart Integrated Magnetics and MML Film Capacitors at SIAE25 

    What Track Width To Use When Routing PCB

    YAGEO Unveils PulseChip LAN Transformer

    Bourns Releases Automotive Impedance Matching Transformer

    Stackpole Offers Affordable Current Sense Chip Resistors

    Knowles Extends Range and Performance of C0G MLCC Capacitors

    May 2025 ECST Component Results Show Moderating Decline in Sales Sentiment

    Panasonic Releases New Aluminum Hybrid Capacitors with High Ripple Current in Compact Size

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Coupled Inductors Circuit Model and Examples of its Applications

    Inductor Resonances and its Impact to EMI

    Highly Reliable Flex Rigid PCBs, Würth Elektronik Webinar

    Causes of Oscillations in Flyback Converters

    How to design a 60W Flyback Transformer

    Modeling and Simulation of Leakage Inductance

    Power Inductor Considerations for AI High Power Computing – Vishay Video

    Coupled Inductors in Multiphase Boost Converters

    VPG Demonstrates Precision Resistor in Cryogenic Conditions

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    DigiKey Offers Zephyr Operating System Workshop and Training Videos

    Exxelia to Present Smart Integrated Magnetics and MML Film Capacitors at SIAE25 

    What Track Width To Use When Routing PCB

    YAGEO Unveils PulseChip LAN Transformer

    Bourns Releases Automotive Impedance Matching Transformer

    Stackpole Offers Affordable Current Sense Chip Resistors

    Knowles Extends Range and Performance of C0G MLCC Capacitors

    May 2025 ECST Component Results Show Moderating Decline in Sales Sentiment

    Panasonic Releases New Aluminum Hybrid Capacitors with High Ripple Current in Compact Size

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Coupled Inductors Circuit Model and Examples of its Applications

    Inductor Resonances and its Impact to EMI

    Highly Reliable Flex Rigid PCBs, Würth Elektronik Webinar

    Causes of Oscillations in Flyback Converters

    How to design a 60W Flyback Transformer

    Modeling and Simulation of Leakage Inductance

    Power Inductor Considerations for AI High Power Computing – Vishay Video

    Coupled Inductors in Multiphase Boost Converters

    VPG Demonstrates Precision Resistor in Cryogenic Conditions

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

3D Printing of Passive Components from Manufacturer Perspective

26.4.2025
Reading Time: 4 mins read
A A

This paper 3D printing of passive electronic components from the perspective of a components manufacturer was presented by Johann Pichler, TDK, Austria during the 5th Space Passive Component Days (SPCD), an International Symposium held from October 15th to 18th, 2024, at ESA/ESTEC in Noordwijk, the Netherlands. Published under permission from ESA SPCD organizers.

Introduction:

RelatedPosts

High-Density PCB Assemblies For Space Applications

Solid State Polymer Multilayer Capacitors For High Temperature Application

Graphene-Based BOSC Bank Of Supercapacitor Cells

The article explores the transformative potential of 3D printing technologies in the manufacturing of passive electronic components, particularly from the perspective of a components manufacturer.

While traditional methods excel in high-volume, cost-efficient production, they face limitations in design flexibility, development cycles, and customization.

The research delves into how recent advancements in materials and 3D printing techniques could address these challenges, enabling faster time-to-market, low-volume, and application-specific component designs.

Key Points:

  1. Current Manufacturing Limitations: Traditional manufacturing (e.g., MLCC) is optimized for mass production but lacks flexibility for complex geometries and custom designs.
  2. 3D Printing Potential: Offers design freedom, rapid prototyping, and the ability to integrate structural and functional elements.
  3. Challenges: Includes slow printing speeds, material compatibility issues, and post-processing requirements.
  4. Application Examples: Demonstrates prototypes like microfluidic devices and MEMS packages showcasing 3D printing’s integrated capabilities.
  5. Future Outlook: 3D printing is unlikely to replace traditional methods but holds promise for niche, high-performance markets.

Extended Summary:

The article begins by underscoring the critical role of passive electronic components in modern devices. It details the traditional manufacturing process of Multi-Layer Ceramic Capacitors (MLCCs), which involves rigorous methods such as screen printing, stacking, cutting, and sintering. These processes, while efficient for mass production, are product-specific, leading to inflexibility and high costs for custom, low-volume products.

The discussion transitions to the limitations inherent in current manufacturing techniques—narrow process windows, tooling constraints, and lengthy development cycles. These challenges highlight the potential for 3D printing technologies to revolutionize the field. Unlike conventional methods, 3D printing allows for the creation of complex geometries without the need for specialized tooling. It enables rapid prototyping, on-demand production, and the possibility of integrating multiple functions within a single component.

Table 1: Ceramic 3D printing technologies

The article categorizes 3D printing technologies into several types, such as material extrusion, binder jetting, and vat photopolymerization, explaining their respective applications in fabricating ceramic structures. Despite its advantages, 3D printing faces challenges like slow production speeds, material property mismatches, and intricate post-processing requirements, especially for multi-material printing.

Table 2: Suitability of printing technologies for manufacturing functional ceramic components
Comparison of conventional passive components production vs 3D printing capabilities today

Selected application examples demonstrate the practical benefits of 3D printing. A microfluidic device illustrates how complex internal channels and integrated heating elements can be produced efficiently. Another example highlights a hermetic package for a MEMS device, showcasing the design freedom and functional integration achievable through 3D printing.

Examples of 3D printed passive components

Conclusions:

The article concludes that while 3D printing will not replace traditional mass-production technologies for passive electronic components, it offers significant advantages for specific applications.

These include the production of free-form components and highly integrated systems combining structural and functional elements. The technology’s true value lies in applications where design flexibility, rapid development, and functional integration outweigh the cost implications. Continued advancements in multi-material 3D printing and material science will be key to unlocking its full potential in electronics manufacturing.

3D printing of passive electronic components from the perspective of a components manufacturerDownload

Related

Source: ESA SPCD

Recent Posts

Exxelia to Present Smart Integrated Magnetics and MML Film Capacitors at SIAE25 

6.6.2025
10

5th PCNS Conference Registration Now Open!

5.6.2025
10

Coilcraft Extends Air Core RF Inductors

20.5.2025
20

Highly Reliable Flex Rigid PCBs, Würth Elektronik Webinar

15.5.2025
34

Vishay Releases Automotive SMD Thick Film Power Resistor for Enhanced Protection Against Short Transient Pulses

14.5.2025
20

Exxelia Power Film Capacitors Support Critical Systems Across Various Industries

13.5.2025
33

H2-Assisted Thermal Treatment of Electrode Materials Increases Supercapacitors Energy Density

13.5.2025
14

Researchers Present Hybrid Supercapacitor Zn-Ion Microcapacitors

12.5.2025
40

Fischer Releases High Vibration Robust Ratchet Locking USB-C Connector System

9.5.2025
19

KYOCERA AVX Releases Compact High-Directivity Couplers

7.5.2025
29

Upcoming Events

Jun 24
17:00 - 18:00 CEST

Ultra-Compact and Efficient Switched-Capacitor Power Converters

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors Explained

    0 shares
    Share 0 Tweet 0
  • How to Design an Inductor

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Premium Suppliers

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version