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    Bourns Releases Compact High Current Shielded Power Inductors

    March 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

    APEC 2026 Power Electronics Trends and Implications for Passive Components

    Hydra Enhances Film Capacitor Robustness by Novel Gel Filler

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    Transformer-Based Power-Line Harvester Magnetic Design

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    Bourns Releases Compact High Current Shielded Power Inductors

    March 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

    APEC 2026 Power Electronics Trends and Implications for Passive Components

    Hydra Enhances Film Capacitor Robustness by Novel Gel Filler

    Würth Elektronik Releases Heat Sinks for TO and IC packages

    Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio

    Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

    Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors

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    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

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3rd PCNS Call for Papers Announced !

11.2.2021
Reading Time: 3 mins read
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PCNS Passive Components Networking Symposium organizing committee is pleased to announce Call for Papers for the 3rd international symposium dedicated to passive components. The event will be held on September 7th to 10th 2021 in Milano, Italy hosted by Politecnico di Milano university.

PCNS Passive Components Networking Symposium is a bi-annual international symposium organized by EPCI European Passive Components Institute in co-operation with an European university. 3rd edition of the PCNS Passive Components Networking Days Symposium is hosted by Department of Chemistry, Materials and Chemical Engineering “Giulio Natta” and Department of Electronics, Information and Bioengineering Faculty of Politecnico di Milano.

RelatedPosts

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March 2026 Interconnect, Passives and Electromechanical Components Market Insights

Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

3rd PCNS is intended as a hybrid, live event with speakers present and streaming options for virtual attendees.

“Being virtually tired, September may be a good time to finally meet again face to face and discuss in live mode what is going on in the world of passive electronic components. In the worst case scenario the PCNS would turn into a virtual event, that we are ready for, but we hope for the best to welcome both live and virtual attendees.” said Tomas Zednicek, EPCI and PCNS organizing committee president.

PCNS mission is to promote the discussion of recent developments and trends in the field of passive electronic components and to encourage the exchange of technical expertise and information covering a broad range of EEE passive components.

PCNS Technical Programme Committee board proposed a 3rd PCNS Theme:

“RELIABILITY & SUSTAINABILITY of PASSIVE COMPONENTS”

The theme will be mainly elaborated in conference Workshop, Hot Topic Panel Discussion and Keynotes selection preferences.

Abstract of papers related to passive electronic components are welcomed for online submission at the conference website by 2nd April 2021. The abstracts will be then evaluated by Technical Programme Committee (TPC) experts representing passive component manufacturers, universities and space agencies.

More information & Online Submission Form is available on the PCNS website:

www.PCNS.events

! 2nd April 2021 Abstract Deadline !

TOPICS

  • MATERIALS & PROCESSES
  • DESIGN & CONSTRUCTION
  • MEASUREMENT & TEST
  • QUALITY & RELIABILITY
  • TECHNOLOGY & ROADMAPS
  • APPLICATIONS
  • NEW DEVELOPMENT
  • MODELLING & SIMULATION

COMPONENTS

  • CAPACITORS
  • INDUCTORS & TRANSFORMERS
  • RESISTORS
  • FUSES
  • FILTERS
  • RF PASSIVES
  • PASSIVE SENSORS
  • CONNECTORS & CABLES
  • CRYSTALS & OSCILLATORS

The past 2nd PCNS 2019 hosted by Politehnica University of Bucharest, Romania was attended by 63 participants from 13 European countries, USA and China as networking event of designers, purchasers, application engineers with the group of component manufacturer industry (~50%), academia (~ 20%) and end users (~ 20% mainly automotive). Space industry was represented by presence of ESA ESTEC and Jacobs Engineering Inc/NASA. The Hot Panel Discussion digged into details of MLCC BIAS Ageing in open exchange of opinion between five MLCC manufacturers and automotive user.

2nd PCNS Attendees Valued Its High Professional and Networking Level

Related

Source: EPCI

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