Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Miniaturization of Tantalum Capacitors: Structural Limit Under Constant Rating

    Heatsink Design and Thermal Interface Materials for Reliable Electronics

    Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%

    Wk 17 Electronics Supply Chain Digest

    Exxelia Introduces SMD High‑Voltage Mica Capacitors

    Modelithics Releases COMPLETE v26.1 for Keysight ADS

    April 2026 Interconnect, Passives and Electromechanical Components Market Insights

    SPICE Simulation of Non-Linear Resistors: Vishay’s Thermistor and PPTC Modelling Ecosystem

    KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Miniaturization of Tantalum Capacitors: Structural Limit Under Constant Rating

    Heatsink Design and Thermal Interface Materials for Reliable Electronics

    Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%

    Wk 17 Electronics Supply Chain Digest

    Exxelia Introduces SMD High‑Voltage Mica Capacitors

    Modelithics Releases COMPLETE v26.1 for Keysight ADS

    April 2026 Interconnect, Passives and Electromechanical Components Market Insights

    SPICE Simulation of Non-Linear Resistors: Vishay’s Thermistor and PPTC Modelling Ecosystem

    KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

A Cost-Effective Method for Producing Printed Flexible Graphene-Based Electronics

10.2.2016
Reading Time: 2 mins read
A A

source: PhysOrg news

February 8, 2016
The introduction of flexible electronics was a paradigm change on established technologies. Now, researchers at the Barcelona Institute of Science and Technology (BIST), present a versatile, low-cost and customizable method for patterning graphene oxide onto multiple substrates. This patented technique, published in the latest issue of ACS Nano, might also be applicable to other electronic materials.

RelatedPosts

Miniaturization of Tantalum Capacitors: Structural Limit Under Constant Rating

Heatsink Design and Thermal Interface Materials for Reliable Electronics

Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%

Some methods for patterning electronic devices involve long fabrication periods, high cost, great expertise and clean room facilities. Moreover, these methods are not versatile or effective for designing simple devices such as transistors or capacitors and biosensors that require effective linking of specific bioreceptors. The patterning method by ICN2 allows the transfer of graphene oxide onto almost any substrate in an easy, cost-effective and customizable way.

The patented method consists of three steps:

Printing: A nitrocellulose membrane is patterned onto the desired shape using a wax printer. The inverse pattern is printed onto the membrane surface.
Filtering: The wax-printed membrane is set onto the filtering glass and the suspension of graphene oxide is filtered. The wax clogs the membrane pores wherever it is printed.
Pressing: The pattern obtained is transferred by pressure to the desired target substrate.
This green, low-cost and versatile approach will enable in situ transfer of multiple electronic devices such as field effect transistors (FET), LEDs, electrodes, solar cells, biosensors or supercapacitors. It requires neither a clean room nor organic solvents. The wax-printed membranes have 50μm resolution, long-term stability and infinite shaping capability over a variety of substrates, including textile, paper, adhesive film or PET. Additionally, the technology can be implemented in a roll-to-roll hardware, speeding up the printing. It is also is promising for implementation in under-developed countries.

 

 

Related

Recent Posts

Miniaturization of Tantalum Capacitors: Structural Limit Under Constant Rating

27.4.2026
21

Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%

27.4.2026
30

Exxelia Introduces SMD High‑Voltage Mica Capacitors

28.4.2026
11

Modelithics Releases COMPLETE v26.1 for Keysight ADS

23.4.2026
11

April 2026 Interconnect, Passives and Electromechanical Components Market Insights

22.4.2026
59

KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

21.4.2026
41

When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

20.4.2026
43

YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

17.4.2026
34

YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

16.4.2026
55

Upcoming Events

Apr 29
10:00 - 11:00 CDT

SEPIC Design Done Right

Apr 30
10:00 - 11:00 CDT

Programming Embedded Systems

May 5
16:00 - 17:00 CEST

Understanding and Selecting Capacitors – Fundamentals, Technologies and Latest Trends

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version