Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Littelfuse Announced TVS Diodes for 48 V Automotive Systems

    Spectrum Controls Joins Modelithics Program to Offer High‑Fidelity RF Models for Resistors, Attenuators and Terminations

    RF Filters and Passive Components Enabling the 7 Missile RF Subsystems

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    YAGEO Presents NANOMET Soft Magnetic Cores for High‑Density Power Conversion

    Coilcraft Releases High-Current Ferrite Beads for CISPR 25 EMC compliance

    From DCL to SSC: Bridging Electrical Symptoms and Structural Indicators in Tantalum Capacitors

    Vishay Unveils Multi-Turn Position Sensor for Harsh Industrial Environments

    YAGEO Introduces Automotive MOV Surge Protection Varistor

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Littelfuse Announced TVS Diodes for 48 V Automotive Systems

    Spectrum Controls Joins Modelithics Program to Offer High‑Fidelity RF Models for Resistors, Attenuators and Terminations

    RF Filters and Passive Components Enabling the 7 Missile RF Subsystems

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    YAGEO Presents NANOMET Soft Magnetic Cores for High‑Density Power Conversion

    Coilcraft Releases High-Current Ferrite Beads for CISPR 25 EMC compliance

    From DCL to SSC: Bridging Electrical Symptoms and Structural Indicators in Tantalum Capacitors

    Vishay Unveils Multi-Turn Position Sensor for Harsh Industrial Environments

    YAGEO Introduces Automotive MOV Surge Protection Varistor

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

A Cost-Effective Method for Producing Printed Flexible Graphene-Based Electronics

10.2.2016
Reading Time: 2 mins read
A A

source: PhysOrg news

February 8, 2016
The introduction of flexible electronics was a paradigm change on established technologies. Now, researchers at the Barcelona Institute of Science and Technology (BIST), present a versatile, low-cost and customizable method for patterning graphene oxide onto multiple substrates. This patented technique, published in the latest issue of ACS Nano, might also be applicable to other electronic materials.

RelatedPosts

Littelfuse Announced TVS Diodes for 48 V Automotive Systems

Spectrum Controls Joins Modelithics Program to Offer High‑Fidelity RF Models for Resistors, Attenuators and Terminations

RF Filters and Passive Components Enabling the 7 Missile RF Subsystems

Some methods for patterning electronic devices involve long fabrication periods, high cost, great expertise and clean room facilities. Moreover, these methods are not versatile or effective for designing simple devices such as transistors or capacitors and biosensors that require effective linking of specific bioreceptors. The patterning method by ICN2 allows the transfer of graphene oxide onto almost any substrate in an easy, cost-effective and customizable way.

The patented method consists of three steps:

Printing: A nitrocellulose membrane is patterned onto the desired shape using a wax printer. The inverse pattern is printed onto the membrane surface.
Filtering: The wax-printed membrane is set onto the filtering glass and the suspension of graphene oxide is filtered. The wax clogs the membrane pores wherever it is printed.
Pressing: The pattern obtained is transferred by pressure to the desired target substrate.
This green, low-cost and versatile approach will enable in situ transfer of multiple electronic devices such as field effect transistors (FET), LEDs, electrodes, solar cells, biosensors or supercapacitors. It requires neither a clean room nor organic solvents. The wax-printed membranes have 50μm resolution, long-term stability and infinite shaping capability over a variety of substrates, including textile, paper, adhesive film or PET. Additionally, the technology can be implemented in a roll-to-roll hardware, speeding up the printing. It is also is promising for implementation in under-developed countries.

 

 

Related

Recent Posts

RF Filters and Passive Components Enabling the 7 Missile RF Subsystems

9.7.2026
27

From DCL to SSC: Bridging Electrical Symptoms and Structural Indicators in Tantalum Capacitors

7.7.2026
44

High-Q RF & Microwave MLCCs: A Cross-Vendor Benchmark

2.7.2026
76

TAIYO YUDEN Introduced Hybrid Aluminum Capacitors for 48V Automotive Power Supplies

2.7.2026
68

YAGEO Announces July 2026 Capacitor Price Increase

1.7.2026
638

Enabling the 800 V AI Server Era: How C0G High-Voltage MLCC Supports Next-Generation Power Architectures

1.7.2026
151

MLCCs in the Age of AI: Q2 2026 Market Tightness

30.6.2026
426

AI Hardware Demand for Passive Components Dossier

30.6.2026
146

Skeleton Supercapacitor Achieves UL‑certified 3,500 A Peak Current for AI Data Centers

26.6.2026
78

Upcoming Events

Jul 14
16:00 - 17:00 CEST

EMC Design Essentials: Mastering Varistors and Common Mode Chokes

Jul 21
16:00 - 17:00 CEST

Safety by design: X and Y Interference suppression capacitors for power line filters

Jul 28
8:00 - 11:00 CEST

Post Procurement Testing of EEE Components for LEO Space Applications

View Calendar

Popular Posts

  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • YAGEO Announces July 2026 Capacitor Price Increase

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version