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    Modeling and Simulation of Leakage Inductance

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    Bourns Extends Rotational Life Option for its Guitar Potentiometer

    Modeling and Simulation of Leakage Inductance

    Power Inductor Considerations for AI High Power Computing – Vishay Video

    TAIYO YUDEN Releases Compact SMD Power Inductors for Automotive Application

    Fischer Releases High Vibration Robust Ratchet Locking USB-C Connector System

    Littelfuse Unveils High-Use Tactile Switches with 2 Million Cycle Lifespan

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    VPG Demonstrates Precision Resistor in Cryogenic Conditions

    Comparison Testing of Chip Resistor Technologies Under High Vibration

    EMC Challenges for High Speed Signal Immunity and Low EMI

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Apple May Adopt IPD (Integrated Passive Device) in 3nm 2022 iDevices to Boost Battery Size

3.8.2021
Reading Time: 2 mins read
A A
featured image: iPhone 12 teardown source:  iFixit

featured image: iPhone 12 teardown source: iFixit

Thin, low profile electronic boards could enable Apple to increase the size of battery fitted in iPhones and other iDevices, without increase of the device dimensions.

A supply-chain report indicates that Apple will be increasing its use of a technology the company referenced in a patent last month.

RelatedPosts

Bourns Extends Rotational Life Option for its Guitar Potentiometer

Modeling and Simulation of Leakage Inductance

Power Inductor Considerations for AI High Power Computing – Vishay Video

It’s being reported by DigiTimes (paywall report) that Apple is expected to significantly increase the adoption of IPD (Integrated Passive Device) in new iPhones and other iOS products, providing manufacturing partners TSMC and Amkor with strong business opportunities.

The report further added that peripheral chips for iPhones, iPad and MacBook series are going slimmer with higher performance to allow more space for larger-capacity battery solutions for the devices, with the demand for IPDs to grow sharply in line with the trend, the sources said.

Recent Apple patent stated: “In another aspect, embodiments describe interposer chiplet configurations which may optionally include an integrated passive device, such as resistor, inductor, capacitor, etc. Various modifications and variations for integrating an interposer chiplet within a package are contemplated in accordance with embodiments.”

According to a recent study from market research firm Global Market Insights, the integrated passive devices market growth will be fostered by numerous features offered by IPDs systems such as reduced interconnection complexity, improved performance, reduced package footprints, improved component tolerance, and output, and better flexibility. These advanced characteristics will escalate the high adoption rate of integrated passive devices in numerous smart consumer wearables, IoT and AI-enabled devices, and infotainment and navigation systems in automobiles.

The incorporation of IPDs systems will facilitate manufacturers of automobiles and consumer electronics devices to minimize the overall cost and gain small footprint packages. Reportedly, the global integrated passive devices market is estimated to surpass US$2 billion by 2026.

The patent, while granted first in March 2021, dates back to 2017. So Apple has been working on the possible use of miniaturization technology, such as IPD, for at least the past four years.

Related

Source: Patently Apple

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