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    tungsten-bronze-ceramic-capacitor-stack

    Tungsten bronze capacitors combine high κ and thermal stability

    Bourns MF-ASMF Series surface-mount PPTC resettable fuses in the manufacturer product photograph

    Bourns Announces 0402 PPTC Fuses Target Low-Current Protection

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    Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

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    Ruggedized passive component customization overview covering capacitors, resistors and inductors.

    Ruggedized Passive Components: Reliability Beyond the Datasheet

    YAGEO Group AS Series resin-coat-less multilayer piezoelectric actuator with lead wires for high-speed industrial motion control

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    tungsten-bronze-ceramic-capacitor-stack

    Tungsten bronze capacitors combine high κ and thermal stability

    Bourns MF-ASMF Series surface-mount PPTC resettable fuses in the manufacturer product photograph

    Bourns Announces 0402 PPTC Fuses Target Low-Current Protection

    Conceptual illustration of Littelfuse AQ4315-01ETG and SP4315-01WTG TVS diode applications on high-speed PCB data lines

    Littelfuse Adds Low-Capacitance TVS Diodes for Fast Data Links

    Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

    TDK Expands1608 Inductors for Automotive PoC Filters

    Murata electronica 2026 technology preview featuring MGJ2T2 power converters and SCI36LT inertial sensors.

    Murata Previews SiC Power and AI Sensors at electronica 2026

    Ruggedized passive component customization overview covering capacitors, resistors and inductors.

    Ruggedized Passive Components: Reliability Beyond the Datasheet

    YAGEO Group AS Series resin-coat-less multilayer piezoelectric actuator with lead wires for high-speed industrial motion control

    YAGEO Unveils Multilayer Piezoelectric Actuators

    Bourns CSI2F bolt-down current sense resistors for high-current busbar measurement

    Bourns Current Sense Resistors Reach 36 W

    Wk 38 Electronics Supply Chain Digest

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Apple May Adopt IPD (Integrated Passive Device) in 3nm 2022 iDevices to Boost Battery Size

3.8.2021
Reading Time: 2 mins read
A A
featured image: iPhone 12 teardown source:  iFixit

featured image: iPhone 12 teardown source: iFixit

Thin, low profile electronic boards could enable Apple to increase the size of battery fitted in iPhones and other iDevices, without increase of the device dimensions.

A supply-chain report indicates that Apple will be increasing its use of a technology the company referenced in a patent last month.

RelatedPosts

Tungsten bronze capacitors combine high κ and thermal stability

Bourns Announces 0402 PPTC Fuses Target Low-Current Protection

Littelfuse Adds Low-Capacitance TVS Diodes for Fast Data Links

It’s being reported by DigiTimes (paywall report) that Apple is expected to significantly increase the adoption of IPD (Integrated Passive Device) in new iPhones and other iOS products, providing manufacturing partners TSMC and Amkor with strong business opportunities.

The report further added that peripheral chips for iPhones, iPad and MacBook series are going slimmer with higher performance to allow more space for larger-capacity battery solutions for the devices, with the demand for IPDs to grow sharply in line with the trend, the sources said.

Recent Apple patent stated: “In another aspect, embodiments describe interposer chiplet configurations which may optionally include an integrated passive device, such as resistor, inductor, capacitor, etc. Various modifications and variations for integrating an interposer chiplet within a package are contemplated in accordance with embodiments.”

According to a recent study from market research firm Global Market Insights, the integrated passive devices market growth will be fostered by numerous features offered by IPDs systems such as reduced interconnection complexity, improved performance, reduced package footprints, improved component tolerance, and output, and better flexibility. These advanced characteristics will escalate the high adoption rate of integrated passive devices in numerous smart consumer wearables, IoT and AI-enabled devices, and infotainment and navigation systems in automobiles.

The incorporation of IPDs systems will facilitate manufacturers of automobiles and consumer electronics devices to minimize the overall cost and gain small footprint packages. Reportedly, the global integrated passive devices market is estimated to surpass US$2 billion by 2026.

The patent, while granted first in March 2021, dates back to 2017. So Apple has been working on the possible use of miniaturization technology, such as IPD, for at least the past four years.

Related

Source: Patently Apple

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