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    Bourns CSS4C-1216 four-terminal metal-strip current sense resistor for high-current Kelvin measurement

    Bourns Extends 1216 Kelvin Current Sense Resistors

    Modelithics COMPLETE+3D Library v26.3 for Ansys HFSS with RF passive component and 3D electromagnetic simulation models

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    Samsung Electro-Mechanics low-profile and embedded MLCCs for compact PCB and power-delivery applications

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    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

    5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

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    Exxelia Passive Components Support BepiColombo Mission

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    Bourns CSS4C-1216 four-terminal metal-strip current sense resistor for high-current Kelvin measurement

    Bourns Extends 1216 Kelvin Current Sense Resistors

    Modelithics COMPLETE+3D Library v26.3 for Ansys HFSS with RF passive component and 3D electromagnetic simulation models

    Modelithics COMPLETE+3D v26.3 Expands HFSS RF Models

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    Samsung Low-Profile and Embedded MLCCs for Compact Devices

    Wk 36 Electronics Supply Chain Digest

    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

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    Samsung MLCC Options for 1 MW AI Rack Power

    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

    5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

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Apple May Adopt IPD (Integrated Passive Device) in 3nm 2022 iDevices to Boost Battery Size

3.8.2021
Reading Time: 2 mins read
A A
featured image: iPhone 12 teardown source:  iFixit

featured image: iPhone 12 teardown source: iFixit

Thin, low profile electronic boards could enable Apple to increase the size of battery fitted in iPhones and other iDevices, without increase of the device dimensions.

A supply-chain report indicates that Apple will be increasing its use of a technology the company referenced in a patent last month.

RelatedPosts

Bourns Extends 1216 Kelvin Current Sense Resistors

Modelithics COMPLETE+3D v26.3 Expands HFSS RF Models

Samsung Low-Profile and Embedded MLCCs for Compact Devices

It’s being reported by DigiTimes (paywall report) that Apple is expected to significantly increase the adoption of IPD (Integrated Passive Device) in new iPhones and other iOS products, providing manufacturing partners TSMC and Amkor with strong business opportunities.

The report further added that peripheral chips for iPhones, iPad and MacBook series are going slimmer with higher performance to allow more space for larger-capacity battery solutions for the devices, with the demand for IPDs to grow sharply in line with the trend, the sources said.

Recent Apple patent stated: “In another aspect, embodiments describe interposer chiplet configurations which may optionally include an integrated passive device, such as resistor, inductor, capacitor, etc. Various modifications and variations for integrating an interposer chiplet within a package are contemplated in accordance with embodiments.”

According to a recent study from market research firm Global Market Insights, the integrated passive devices market growth will be fostered by numerous features offered by IPDs systems such as reduced interconnection complexity, improved performance, reduced package footprints, improved component tolerance, and output, and better flexibility. These advanced characteristics will escalate the high adoption rate of integrated passive devices in numerous smart consumer wearables, IoT and AI-enabled devices, and infotainment and navigation systems in automobiles.

The incorporation of IPDs systems will facilitate manufacturers of automobiles and consumer electronics devices to minimize the overall cost and gain small footprint packages. Reportedly, the global integrated passive devices market is estimated to surpass US$2 billion by 2026.

The patent, while granted first in March 2021, dates back to 2017. So Apple has been working on the possible use of miniaturization technology, such as IPD, for at least the past four years.

Related

Source: Patently Apple

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