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    Knowles ATT A-Series surface-mount RF attenuator in compact ceramic thin-film package

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    Knowles ATT A-Series surface-mount RF attenuator in compact ceramic thin-film package

    Knowles A-Series RF Attenuators Target Compact 20 GHz Designs

    Film DC-link capacitor and supercapacitor energy buffer in a high-voltage power converter system

    Electrification Raises Demands on DC-Link Capacitors

    YAGEO Group high-reliability polymer tantalum capacitor portfolio for aerospace and defence power electronics

    YAGEO High-Reliability Polymer Tantalum Capacitors for Aerospace

    Schematic of the step-wise LPG/LPG@MnOx/LPG-O functionally graded thick cathode for a zinc-ion hybrid capacitor, Hefei Institutes of Physical Science.

    Laser-Engineered Zinc-Ion Cathodes Target Thick Electrodes

    Isabellenhütte HFF flexible Kapton heater with etched MANGANIN foil structure and wire lead exit

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    DigiKey Factory Tomorrow Season 6 graphic illustrating AI-ready industrial connectivity, data infrastructure and smart manufacturing networks.

    DigiKey Factory Tomorrow Season 6 Explores AI-Ready Factories

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    Würth Elektronik electronica 2026 presentation featuring electronic components, PCB technologies and high-current PowerBusbar connection solutions.

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Apple May Adopt IPD (Integrated Passive Device) in 3nm 2022 iDevices to Boost Battery Size

3.8.2021
Reading Time: 2 mins read
A A
featured image: iPhone 12 teardown source:  iFixit

featured image: iPhone 12 teardown source: iFixit

Thin, low profile electronic boards could enable Apple to increase the size of battery fitted in iPhones and other iDevices, without increase of the device dimensions.

A supply-chain report indicates that Apple will be increasing its use of a technology the company referenced in a patent last month.

RelatedPosts

Knowles A-Series RF Attenuators Target Compact 20 GHz Designs

Electrification Raises Demands on DC-Link Capacitors

YAGEO High-Reliability Polymer Tantalum Capacitors for Aerospace

It’s being reported by DigiTimes (paywall report) that Apple is expected to significantly increase the adoption of IPD (Integrated Passive Device) in new iPhones and other iOS products, providing manufacturing partners TSMC and Amkor with strong business opportunities.

The report further added that peripheral chips for iPhones, iPad and MacBook series are going slimmer with higher performance to allow more space for larger-capacity battery solutions for the devices, with the demand for IPDs to grow sharply in line with the trend, the sources said.

Recent Apple patent stated: “In another aspect, embodiments describe interposer chiplet configurations which may optionally include an integrated passive device, such as resistor, inductor, capacitor, etc. Various modifications and variations for integrating an interposer chiplet within a package are contemplated in accordance with embodiments.”

According to a recent study from market research firm Global Market Insights, the integrated passive devices market growth will be fostered by numerous features offered by IPDs systems such as reduced interconnection complexity, improved performance, reduced package footprints, improved component tolerance, and output, and better flexibility. These advanced characteristics will escalate the high adoption rate of integrated passive devices in numerous smart consumer wearables, IoT and AI-enabled devices, and infotainment and navigation systems in automobiles.

The incorporation of IPDs systems will facilitate manufacturers of automobiles and consumer electronics devices to minimize the overall cost and gain small footprint packages. Reportedly, the global integrated passive devices market is estimated to surpass US$2 billion by 2026.

The patent, while granted first in March 2021, dates back to 2017. So Apple has been working on the possible use of miniaturization technology, such as IPD, for at least the past four years.

Related

Source: Patently Apple

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