Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Heatsink Design and Thermal Interface Materials for Reliable Electronics

    Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%

    Wk 17 Electronics Supply Chain Digest

    Exxelia Introduces SMD High‑Voltage Mica Capacitors

    Modelithics Releases COMPLETE v26.1 for Keysight ADS

    April 2026 Interconnect, Passives and Electromechanical Components Market Insights

    SPICE Simulation of Non-Linear Resistors: Vishay’s Thermistor and PPTC Modelling Ecosystem

    KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

    When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Heatsink Design and Thermal Interface Materials for Reliable Electronics

    Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%

    Wk 17 Electronics Supply Chain Digest

    Exxelia Introduces SMD High‑Voltage Mica Capacitors

    Modelithics Releases COMPLETE v26.1 for Keysight ADS

    April 2026 Interconnect, Passives and Electromechanical Components Market Insights

    SPICE Simulation of Non-Linear Resistors: Vishay’s Thermistor and PPTC Modelling Ecosystem

    KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

    When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

AVX is Sponsoring the GEOX DRAGON All-Electric Formula-E Racing Team for the Second-Straight Year

10.12.2019
Reading Time: 2 mins read
A A

As part of its continuous commitment to promoting increased environmental sustainability, AVX is once again partnering with Mouser, TTI, & Molex to support the GEOX DRAGON racing team for Season 6 of the world’s premier all-electric automotive racing series.

FOUNTAIN INN, S.C. (December 9, 2019) – AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, has announced its continued support of the GEOX DRAGON Formula-E racing team for the new 2019–2020 ABB FIA Formula-E Championship racing season, which kicked off in Diriyah, Saudi Arabia, on Friday, November 22.

RelatedPosts

Heatsink Design and Thermal Interface Materials for Reliable Electronics

Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%

Wk 17 Electronics Supply Chain Digest

For the second-straight year, AVX is partnering with Mouser Electronics, TTI, Inc., and Molex to sponsor the world’s premier racing series with all-electric vehicles. Comprised of 14 races that take place in 12 incredible cities across five continents, the ABB FIA Formula-E Championship is firmly rooted in three core values — energy, environment, and entertainment — and is designed to help drive the change towards an all-electric future by accelerating global interest in electric vehicle technology.

“We’re extremely proud and excited to renew our support of the GEOX DRAGON team for the sixth season of the Formula-E championship,” said Eric Pratt, AVX’s senior vice president of Marketing. “It’s a wildly entertaining, exciting, and unique annual event that leverages the global appeal of auto racing to showcase cutting-edge, all-electric racing technology and promote increased sustainability and awareness while also providing fans with a thrilling show and an influential interactive experience.

We’re also very pleased to be continuing our partnership with Mouser, TTI, and Molex as part of our corporate commitment to promoting increased environmental sustainability. Together, we’re making meaningful advancements toward further improving the performance, efficiency, and safety of all-electric vehicle technology, making it even more appealing to consumers, and propelling the automobile industry towards a greener, more sustainable future.”

“With the introduction of the Gen2 cars last season, Formula E really raised the bar on electric motorsports sustainability and performance,” said Todd McAtee, vice president, Americas Business Development for Mouser Electronics. “We are very excited to team up with Molex and TTI, along with AVX, to sponsor GEOX DRAGON and to promote these innovative technologies.”

The GEOX DRAGON team kicked off Season 6 with two new drivers: former Formula One driver and two-time World Endurance Champion Brendon Hartley, and former Audi Test and Reserve driver, and 2019 DTM Drivers’ Championship runner-up, Nico Müller. The next Formula-E championship race will take place Saturday, January 18, 2020, in Santiago, Chile, and the season will conclude on Sunday, July 26, 2020, in London.

AVX supports the advancement of electric vehicle technology with innovative electronic component, interconnect, sensor, control, and antenna solutions designed to provide peak performance in powertrain, active body control, advanced driver assistance system, lighting, power conversion, and drive control systems.

Related

Source: AVX

Recent Posts

Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%

27.4.2026
1

April 2026 Interconnect, Passives and Electromechanical Components Market Insights

22.4.2026
45

KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

21.4.2026
40

YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

17.4.2026
32

Würth Elektronik Expanded Capacity for Validation and Services in Asia

16.4.2026
17

Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

16.4.2026
27

YAGEO Releases Ferrite Shielded Power Inductors for High‑Density Designs

15.4.2026
29

KYOCERA AVX MIL-PRF-32535 BME NP0 MLCCs Approved to the DLA QPD

16.4.2026
30

ECIA March 2026 Industry Pulse Points to Best Sales Climate in Five Years

13.4.2026
54

Upcoming Events

Apr 27
15:00 - 16:00 CEST

Commercial Space Screening Approach for Agile, High-Reliability Payloads

Apr 29
10:00 - 11:00 CDT

SEPIC Design Done Right

Apr 30
10:00 - 11:00 CDT

Programming Embedded Systems

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version