Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Würth Elektronik Coupled Inductors Harnessing Leakage Inductance in SEPIC, ZETA and Ćuk Converters

    Samsung Introduces Ultra‑compact, High‑Capacitance MLCCs for AI Edge and Wearable designs

    Knowles Presents Pulse Power Capacitors for Demanding MedTech, Industrial and Defense Applications

    Bourns Introduces LTCC Band Pass Filters for 5G C‑Band RF Front‑End Designs

    YAGEO Extends its Supercapacitor Series Line-Up

    SCHURTER Presents EKO High‑Voltage Fuses for Global Energy Systems

    June 2026: AI Demand Pushes Japanese and Korean MLCC Makers to Five‑Year Shipment High

    TDK Releases SMD Common‑Mode Chokes for Compact High‑Current EMI Filtering

    July 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Würth Elektronik Coupled Inductors Harnessing Leakage Inductance in SEPIC, ZETA and Ćuk Converters

    Samsung Introduces Ultra‑compact, High‑Capacitance MLCCs for AI Edge and Wearable designs

    Knowles Presents Pulse Power Capacitors for Demanding MedTech, Industrial and Defense Applications

    Bourns Introduces LTCC Band Pass Filters for 5G C‑Band RF Front‑End Designs

    YAGEO Extends its Supercapacitor Series Line-Up

    SCHURTER Presents EKO High‑Voltage Fuses for Global Energy Systems

    June 2026: AI Demand Pushes Japanese and Korean MLCC Makers to Five‑Year Shipment High

    TDK Releases SMD Common‑Mode Chokes for Compact High‑Current EMI Filtering

    July 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

AVX Releases New Ultra-Miniature, Thin-Film Transmission Line Capacitors for High-Performance Microwave & RF Applications

27.11.2019
Reading Time: 2 mins read
A A

source: AVX news

The new capacitors have a novel metal-insulator-metal (MIM) structure & a wide range of capacitance values, & are developed using a high-frequency structure simulator (HFSS) to deliver the highest possible RF performance & reliability.
FOUNTAIN INN, S.C. (January 2, 2019) – AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, introduced a new line of ultraminiature, thin-film transmission line capacitors for high-frequency links, DC blocking in the UHF range (300MHz – 3GHz), and other high-performance microwave and RF applications. The new capacitors have a novel metal-insulator-metal (MIM) structure, copper traces for optimal circuit conductivity, a transmission line wire-bond pad, and a gold-metallized backside ground, and can be supplied on a variety of low-loss substrates, including quartz, alumina, glass, and silicon. The new transmission line capacitors are also available in a wide range of capacitance values: 0.3-50pF with a ±20% tolerance, and each is made using a high-frequency structure simulator (HFSS) to proactively address any electromagnetic challenges and provide the highest possible RF performance and reliability.

RelatedPosts

Integrated Bulk Acoustic Wave (BAW) Technology Explained – Texas Instruments and Mouser Electronics EE Journal Chalk Talk Video

Würth Elektronik Introduces Robust, Resilient, Mountable Radio Interference Suppression Choke

What is RFID? How RFID works? RFID Explained in Detail

“Our new thin-film transmission line capacitors are developed using ultra-precise HFSS designs for optimized circuit conductivity and RF performance. They offer a wide range of capacitance values and several customizable features, including impedance values and substrate material and thickness, and are also gold-wire bondable and RoHS compliant, enabling their employment in a broad range of high-performance microwave and RF applications,” said Larry Eisenberger, principal technical marketing engineer at AVX.

The new transmission line capacitors are available in three standard substrate thicknesses: 5, 10, and 15mils (0.005, 0.01, 0.015″) and two standard substrate widths: 20 and 40mils (0.02-0.04″), and have design-dependent lengths determined by transmission line dimensions. Average lengths are generally in the realm of 20-80mils (0.02-0.08″), but lengths up to and beyond 320mils (0.32″) are not altogether uncommon.

The range is rated for up to 100V, has specific capacitance values ranging from 50-100pF/mm2, a dissipation factor of less than 0.1%, and a TCC value of ±60ppm/°C, and exhibits 50Ω standard impedance; although, actual maximum capacitance values also depend on transmission line dimensions. Custom impedance values, substrate materials, and substrate thicknesses are available upon request.

The new transmission line capacitors are also RoHS compliant and are tested to MIL-STD-883-2011.8 for bond strength, MIL-STD-883-2018 for shear strength, and MIL-STD-202-108 for lifetime. Packaging options include: antistatic waffle pack, tested but un-diced, and tested and diced on tape, and lead-time for the series is currently 14 weeks.

Related

Recent Posts

Würth Elektronik Coupled Inductors Harnessing Leakage Inductance in SEPIC, ZETA and Ćuk Converters

29.7.2026
19

Samsung Introduces Ultra‑compact, High‑Capacitance MLCCs for AI Edge and Wearable designs

29.7.2026
17

Knowles Presents Pulse Power Capacitors for Demanding MedTech, Industrial and Defense Applications

29.7.2026
16

Bourns Introduces LTCC Band Pass Filters for 5G C‑Band RF Front‑End Designs

29.7.2026
8

YAGEO Extends its Supercapacitor Series Line-Up

28.7.2026
43

June 2026: AI Demand Pushes Japanese and Korean MLCC Makers to Five‑Year Shipment High

28.7.2026
54

Samsung Introduces 1000V C0G and X7 MLCCs for 800V DC Systems

27.7.2026
56

Bourns Introduces LTCC GNSS L‑Band Diplexer for Compact RF Front Ends

24.7.2026
27

TT Electronics: How Qualification Underpins Reliable Selection of Thick‑Film Resistors

27.7.2026
85

Upcoming Events

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • YAGEO Announces July 2026 Capacitor Price Increase

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCCs in the Age of AI: Q2 2026 Market Tightness

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.